Abstract: Apparatuses, methods and storage medium associated with connectors for coupling to a computer processing unit (CPU) package are disclosed herein. In embodiments, a connector assembly for connection to a computer processing unit (CPU) package may include a connector housing. One or more electrical contacts of the connector housing may be to couple to the CPU package when the connector assembly is engaged with a mating connector assembly. The connector assembly may further include a mounting handle affixed to a top of the connector housing. The mounting handle may include a locking latch that extends from the mounting handle. The locking latch may engage with a notch within the mating connector assembly that, when engaged, the locking latch may provide a force to maintain coupling of the one or more electrical contacts with the CPU package when engaged with the mating connector assembly.

Abstract: Apparatuses, methods and storage medium associated with connectors for coupling to a computer processing unit (CPU) package are disclosed herein. In embodiments, a connector assembly for connection to a computer processing unit (CPU) package may include a connector housing. One or more electrical contacts of the connector housing may be to couple to the CPU package when the connector assembly is engaged with a mating connector assembly. The connector assembly may further include a mounting handle affixed to a top of the connector housing. The mounting handle may include a locking latch that extends from the mounting handle. The locking latch may engage with a notch within the mating connector assembly that, when engaged, the locking latch may provide a force to maintain coupling of the one or more electrical contacts with the CPU package when engaged with the mating connector assembly.

Abstract: Embodiments herein relate to port frames and connectors for direct connections to integrated circuit packages. In various embodiments, a port frame to receive a connector and maintain a connection between the connector and a computer processor package may include a protrusion to provide stable attachment of the port frame to a bolster frame, a first wall, a second wall opposite the first wall, a first detent in the first wall, and a second detent in the second wall where the connector is to be received between the first wall and the second wall, and where the first detent is to receive a first locking protrusion extending from the connector and the second detent is to receive a second locking protrusion extending from the connector. Other embodiments may be described and/or claimed.

Abstract: Embodiments of the present disclosure are directed to an interconnect cable including a edge finger connector, and associated configurations and methods. The edge finger connector may be disposed at a first end of the interconnect cable and may connect the interconnect cable to an edge finger included in or coupled to a package substrate. The package substrate may be included in a processor package assembly, and a processor may be mounted on the substrate. The interconnect cable may include one or more elongate conductors, with contacts directly coupled to respective conductors. A second connector may be disposed at a second end of the interconnect cable, and may couple the interconnect cable to a small form-factor pluggable (SFP) case that is configured to connect the interconnect cable to an SFP cable. Other embodiments may be described and claimed.

Abstract: An apparatus comprises a cable connector including: a first connector body portion including a first plurality of electrical contacts arranged to contact electrical contacts of a first surface of an edge connector substrate; a second connector body portion separate from the first connector body portion and including a second plurality of electrical contacts arranged to oppose the first plurality of electrical contacts of the first connector body portion and to contact electrical contacts of a second surface of the edge connector substrate, wherein the first and second plurality of electrical contacts are electrically coupled to one or more cables; and a joining mechanism configured to join the first connector body portion and the second connector body portion together and to apply a bias force to the edge connector substrate when the edge connector substrate is arranged between the first connector body portion and the second connector body portion.

Abstract: Embodiments herein relate to port frames and connectors for direct connections to integrated circuit packages. In various embodiments, a port frame to receive a connector and maintain a connection between the connector and a computer processor package may include a protrusion to provide stable attachment of the port frame to a bolster frame, a first wall, a second wall opposite the first wall, a first detent in the first wall, and a second detent in the second wall where the connector is to be received between the first wall and the second wall, and where the first detent is to receive a first locking protrusion extending from the connector and the second detent is to receive a second locking protrusion extending from the connector. Other embodiments may be described and/or claimed.

Abstract: An example electronic assembly for securing an electronic card. In some forms, the electronic assembly further includes a printed circuit board. The electronic assembly includes a housing having a first set of electrical contacts and a second set of electrical contacts. The housing is configured to receive the electronic card between the first and second set of electrical contacts. The housing further includes a third set of electrical contacts and a fourth set of electrical contacts. The housing is configured to receive the electronic card between the third and fourth set of electrical contacts. A ground shield is positioned between at least one of the first and third set of electrical contacts and the second and fourth set of electrical contacts. In some forms, the ground shield may be positioned between both the first and third set of electrical contacts and the second and fourth set of electrical contacts.

Abstract: An example electronic assembly for securing an electronic card. In some forms, the electronic assembly further includes a printed circuit board. The electronic assembly includes a housing having a first set of electrical contacts and a second set of electrical contacts. The housing is configured to receive the electronic card between the first and second set of electrical contacts. The housing further includes a third set of electrical contacts and a fourth set of electrical contacts. The housing is configured to receive the electronic card between the third and fourth set of electrical contacts. A ground shield is positioned between at least one of the first and third set of electrical contacts and the second and fourth set of electrical contacts. In some forms, the ground shield may be positioned between both the first and third set of electrical contacts and the second and fourth set of electrical contacts.

Abstract: An apparatus comprises a cable connector including: a first connector body portion including a first plurality of electrical contacts arranged to contact electrical contacts of a first surface of an edge connector substrate; a second connector body portion separate from the first connector body portion and including a second plurality of electrical contacts arranged to oppose the first plurality of electrical contacts of the first connector body portion and to contact electrical contacts of a second surface of the edge connector substrate, wherein the first and second plurality of electrical contacts are electrically coupled to one or more cables; and a joining mechanism configured to join the first connector body portion and the second connector body portion together and to apply a bias force to the edge connector substrate when the edge connector substrate is arranged between the first connector body portion and the second connector body portion.

Abstract: An electronic device connection system includes a first electrical device and a second electrical device. The first electrical device includes a plurality of electrical connectors disposed in, on, or about at least a portion of an exterior surface of the first electrical device. The second electrical device includes a plurality of electrical contacts disposed in, on, or about at least a portion of an exterior surface of the second electrical device. A mechanical compressor exerts a force on at least one of the first electrical device or the second electrical device such that the electrical connections on the first electrical device physically and conductively couple to the electrical contacts on the second electrical device. The device casing may function as the mechanical compressor. The electrical connectors and/or electrical contacts may include injection molded connectors that include a conductive material dispersed in a thermoplastic matrix.

Abstract: An electronic device connection system includes a first electrical device and a second electrical device. The first electrical device includes a plurality of electrical connectors disposed in, on, or about at least a portion of an exterior surface of the first electrical device. The second electrical device includes a plurality of electrical contacts disposed in, on, or about at least a portion of an exterior surface of the second electrical device. A mechanical compressor exerts a force on at least one of the first electrical device or the second electrical device such that the electrical connections on the first electrical device physically and conductively couple to the electrical contacts on the second electrical device. The device casing may function as the mechanical compressor. The electrical connectors and/or electrical contacts may include injection molded connectors that include a conductive material dispersed in a thermoplastic matrix.

Abstract: This disclosure relates generally to a chip package assembly arranged to be electrically coupled to a circuit board including a plurality of circuit board contacts. The chip package assembly may include a chip package including a first side and a second side, the second side including a first plurality of contacts arranged to be electrically coupled to the plurality of circuit board contacts and a second plurality of contacts arranged to be electrically coupled to a remote device via a connector assembly.

Abstract: A cable connector that includes a substrate having a plurality of conductive pads and at least one grounding pad. The cable connector further includes twin axial cable that includes a first conductor and second conductor, a first insulator that surrounds the first conductor, and a second insulator that surrounds the second conductor. The twin axial cable further includes a ground shield that surrounds the first and second insulator. The first conductor is electrically connected to one conductive pad and the second conductor is electrically connected to another of the conductive pads. The ground shield is electrically connected to the grounding pad. A shielding structure is mounted to the substrate and is electrically connected to the grounding pad. The shielding structure includes a cap and a plurality of sidewalls extending from the cap to the substrate. The twin axial cable is positioned between the side walls.

Abstract: A flexible interposer for the attachment of a microelectronic package to a microelectronic socket, wherein a first portion of the flexible substrate may be positioned between the microelectronic package and the microelectronic socket, and a second portion of the flexible interposer may extend from between the microelectronic package and the microelectronic socket to electrically contact an external component. In one embodiment, the external component may be a microelectronic substrate and the microelectronic socket may be attached to the microelectronic substrate.

Abstract: A double-mated edge finger connector that is configured to double the connector density without resorting to a reduction in pitch. A first connector defines a first slot configured to receive and permit horizontal displacement of an edge finger of a second board relative thereto, while a second connector defines a second slot configured to receive and permit horizontal displacement of an edge finger of a first board relative thereto, to thereby establish an electrical connection between the first board and the second board.

Abstract: A connector for a multi-array bottom side array is described that uses a spring bias. In one example, a connector includes a connector housing, the connector housing having a bottom surface, and a plurality of resilient connectors opposite the bottom surface to electrically connect to a corresponding plurality of pads of an integrated circuit package, a cable connector to electrically connect the resilient connectors to a cable, a base plate having a bottom surface to press against a circuit board, and a top surface opposite the bottom surface, and plurality of spring members coupled between the base plate and the connector bottom surface to press the base plate bottom surface against the system board and to press the connector housing connectors against the package.

Abstract: A cable connector that includes a substrate having a plurality of conductive pads and at least one grounding pad. The cable connector further includes twin axial cable that includes a first conductor and second conductor, a first insulator that surrounds the first conductor, and a second insulator that surrounds the second conductor. The twin axial cable further includes a ground shield that surrounds the first and second insulator. The first conductor is electrically connected to one conductive pad and the second conductor is electrically connected to another of the conductive pads. The ground shield is electrically connected to the grounding pad. A shielding structure is mounted to the substrate and is electrically connected to the grounding pad. The shielding structure includes a cap and a plurality of sidewalls extending from the cap to the substrate. The twin axial cable is positioned between the side walls.

Abstract: Stacked flex cable assemblies and their manufacture are described. One assembly includes a first flex cable and a second flex cable electrically coupled to the first flex cable. The assembly also includes a connector electrically coupled to the first flex cable. The first flex cable is positioned between the connector and the second flex cable. Other embodiments are described and claimed.

Abstract: A connector for a multi-array bottom side array is described that uses a spring bias. In one example, a connector includes a connector housing, the connector housing having a bottom surface, and a plurality of resilient connectors opposite the bottom surface to electrically connect to a corresponding plurality of pads of an integrated circuit package, a cable connector to electrically connect the resilient connectors to a cable, a base plate having a bottom surface to press against a circuit board, and a top surface opposite the bottom surface, and plurality of spring members coupled between the base plate and the connector bottom surface to press the base plate bottom surface against the system board and to press the connector housing connectors against the package.

Abstract: Stacked flex cable assemblies and their manufacture are described. One assembly includes a first flex cable and a second flex cable electrically coupled to the first flex cable. The assembly also includes a connector electrically coupled to the first flex cable. The first flex cable is positioned between the connector and the second flex cable. Other embodiments are described and claimed.