Abstract: Embodiments related to integrated circuit (IC) connectors are described. In some embodiments, an IC assembly may include an IC package substrate, an intermediate member, and a male connector. The IC package substrate may have first signal contacts on a top or bottom surface, and the bottom surface may have second signal contacts for coupling with a socket on a circuit board. The intermediate member may have a first end coupled to the first signal contacts and a second end extending beyond the side surface. The male connector may be disposed at the second end of the intermediate member, and may have signal contacts coupled to the signal contacts of the intermediate member. The male connector may be mateable with a female connector when the female connector is brought into engagement in a direction parallel to the axis of the intermediate member. Other embodiments may be disclosed and/or claimed.

Abstract: Embodiments of the present disclosure are directed to an interconnect cable including a edge finger connector, and associated configurations and methods. The edge finger connector may be disposed at a first end of the interconnect cable and may connect the interconnect cable to an edge finger included in or coupled to a package substrate. The package substrate may be included in a processor package assembly, and a processor may be mounted on the substrate. The interconnect cable may include one or more elongate conductors, with contacts directly coupled to respective conductors. A second connector may be disposed at a second end of the interconnect cable, and may couple the interconnect cable to a small form-factor pluggable (SFP) case that is configured to connect the interconnect cable to an SFP cable. Other embodiments may be described and claimed.

Abstract: A double-mated edge finger connector that is configured to double the connector density without resorting to a reduction in pitch. A first connector defines a first slot configured to receive and permit horizontal displacement of an edge finger of a second board relative thereto, while a second connector defines a second slot configured to receive and permit horizontal displacement of an edge finger of a first board relative thereto, to thereby establish an electrical connection between the first board and the second board.

Abstract: A flexible interposer for the attachment of a microelectronic package to a microelectronic socket, wherein a first portion of the flexible substrate may be positioned between the microelectronic package and the microelectronic socket, and a second portion of the flexible interposer may extend from between the microelectronic package and the microelectronic socket to electrically contact an external component. In one embodiment, the external component may be a microelectronic substrate and the microelectronic socket may be attached to the microelectronic substrate.

Abstract: Embodiments of the present disclosure are directed to an interconnect cable including a edge finger connector, and associated configurations and methods. The edge finger connector may be disposed at a first end of the interconnect cable and may connect the interconnect cable to an edge finger included in or coupled to a package substrate. The package substrate may be included in a processor package assembly, and a processor may be mounted on the substrate. The interconnect cable may include one or more elongate conductors, with contacts directly coupled to respective conductors. A second connector may be disposed at a second end of the interconnect cable, and may couple the interconnect cable to a small form-factor pluggable (SFP) case that is configured to connect the interconnect cable to an SFP cable. Other embodiments may be described and claimed.

Abstract: A flexible interposer for the attachment of a microelectronic package to a microelectronic socket, wherein a first portion of the flexible substrate may be positioned between the microelectronic package and the microelectronic socket, and a second portion of the flexible interposer may extend from between the microelectronic package and the microelectronic socket to electrically contact an external component. In one embodiment, the external component may be a microelectronic substrate and the microelectronic socket may be attached to the microelectronic substrate.

Abstract: Embodiments related to integrated circuit (IC) connectors are described. In some embodiments, an IC assembly may include an IC package substrate, an intermediate member, and a male connector. The IC package substrate may have first signal contacts on a top or bottom surface, and the bottom surface may have second signal contacts for coupling with a socket on a circuit board. The intermediate member may have a first end coupled to the first signal contacts and a second end extending beyond the side surface. The male connector may be disposed at the second end of the intermediate member, and may have signal contacts coupled to the signal contacts of the intermediate member. The male connector may be mateable with a female connector when the female connector is brought into engagement in a direction parallel to the axis of the intermediate member. Other embodiments may be disclosed and/or claimed.

Abstract: This disclosure relates generally to a connector assembly. Optionally, first conductive members form a first row. Second conductive members include a first subset forming a second row and a second subset forming a third row, the second and third rows being parallel and offset with respect to one another. Individual ones of the first and second conductive members are arranged to be coupled at a first end to a corresponding contact. At least one of the first and second subsets has a vertical displacement to form a common row of the second conductive members at a second end of the second conductive members. Individual ones of the first conductive members are arranged to be coupled proximate a second end of the first conductive members to the second end of a corresponding one of the second conductive members.

Abstract: Embodiments of the present disclosure are directed to an interconnect cable including a edge finger connector, and associated configurations and methods. The edge finger connector may be disposed at a first end of the interconnect cable and may connect the interconnect cable to an edge finger included in or coupled to a package substrate. The package substrate may be included in a processor package assembly, and a processor may be mounted on the substrate. The interconnect cable may include one or more elongate conductors, with contacts directly coupled to respective conductors. A second connector may be disposed at a second end of the interconnect cable, and may couple the interconnect cable to a small form-factor pluggable (SFP) case that is configured to connect the interconnect cable to an SFP cable. Other embodiments may be described and claimed.

Abstract: This disclosure relates generally to a chip package assembly arranged to be electrically coupled to a circuit board including a plurality of circuit board contacts. The chip package assembly may include a chip package including a first side and a second side, the second side including a first plurality of contacts arranged to be electrically coupled to the plurality of circuit board contacts and a second plurality of contacts arranged to be electrically coupled to a remote device via a connector assembly.

Abstract: Stacked flex cable assemblies and their manufacture are described. One assembly includes a first flex cable and a second flex cable electrically coupled to the first flex cable. The assembly also includes a connector electrically coupled to the first flex cable. The first flex cable is positioned between the connector and the second flex cable. Other embodiments are described and claimed.

Abstract: This disclosure relates generally to a connector assembly. Optionally, first conductive members form a first row. Second conductive members include a first subset forming a second row and a second subset forming a third row, the second and third rows being parallel and offset with respect to one another. Individual ones of the first and second conductive members are arranged to be coupled at a first end to a corresponding contact. At least one of the first and second subsets has a vertical displacement to form a common row of the second conductive members at a second end of the second conductive members. Individual ones of the first conductive members are arranged to be coupled proximate a second end of the first conductive members to the second end of a corresponding one of the second conductive members.

Abstract: A flexible interposer for the attachment of a microelectronic package to a microelectronic socket, wherein a first portion of the flexible substrate may be positioned between the microelectronic package and the microelectronic socket, and a second portion of the flexible interposer may extend from between the microelectronic package and the microelectronic socket to electrically contact an external component. In one embodiment, the external component may be a microelectronic substrate and the microelectronic socket may be attached to the microelectronic substrate.

Abstract: An example socket includes a plurality of contacts and a base. The base includes exterior walls and interior walls which extend between the exterior walls to form openings within the base such that each opening in the base includes one of the contacts. At least some interior walls include indentations that are adapted to receive projections on the contacts such that when the projections on the contacts are positioned within indentations in the interior walls, the contacts are secured to the base. Another example socket includes a first group of the interior walls that is oriented in a first direction and a second group of the interior walls oriented in a second direction that is orthogonal to the first direction. The first and second groups of interior walls form openings within the base with the first group of interior walls being higher than the second group of interior walls.

Abstract: A bottom loaded assembly for securing heat sinks to printed circuit boards may use a preloaded spring. The preloaded spring may be positioned on one side of the printed circuit board and the heat sink may be positioned on the opposite side.

Abstract: A system for providing electrical contacts between a die and an electrical device includes a die and a package. The package includes a first major surface, a second major surface, a first scalloped edge, a second scalloped edge and a solid end adapted for insertion into a slot. The solid end and the scalloped edges carry current greater than the current needed for an input/output signal. The socket includes a base having an opening therein adapted to receive the package. A slot is located at one end of the opening in the base. The slot is provided with a plurality of conductors for carrying currents greater than the current needed for an input/output signal. A first edge and second edge of the opening include a plurality of spaced overhangs positioned over the opening. The overhangs are sloped with respect to the major planar surface.

Abstract: An example socket includes a plurality of contacts and a base. The base includes exterior walls and interior walls which extend between the exterior walls to form openings within the base such that each opening in the base includes one of the contacts. At least some interior walls include indentations that are adapted to receive projections on the contacts such that when the projections on the contacts are positioned within indentations in the interior walls, the contacts are secured to the base. Another example socket includes a first group of the interior walls that is oriented in a first direction and a second group of the interior walls oriented in a second direction that is orthogonal to the first direction. The first and second groups of interior walls form openings within the base with the first group of interior walls being higher than the second group of interior walls.

Abstract: An example socket includes a plurality of contacts and a base. The base includes exterior walls and interior walls which extend between the exterior walls to form openings within the base such that each opening in the base includes one of the contacts. At least some interior walls include indentations that are adapted to receive projections on the contacts such that when the projections on the contacts are positioned within indentations in the interior walls, the contacts are secured to the base. Another example socket includes a first group of the interior walls that is oriented in a first direction and a second group of the interior walls oriented in a second direction that is orthogonal to the first direction. The first and second groups of interior walls form openings within the base with the first group of interior walls being higher than the second group of interior walls.

Abstract: In some example embodiments, an integrated circuit, electronic assembly and method provide a current path for supplying power to a processor. As an example, the integrated circuit includes a base having power contacts that extend from an upper surface of base. The integrated circuit further includes a substrate that is mounted to the upper surface of the base to electrically couple the substrate to the base. A die is mounted on a substrate such that the die is electrically coupled to the substrate. The power contacts on the upper surface of the base engage a daughterboard so that the die is able to receive power from a voltage source mounted on the daughterboard through the power contacts on the upper surface of the base.

Abstract: An apparatus, method, and system for a connector cell having an electrically and/or mechanically supported conductive extension are disclosed herein.