Abstract: A printed circuit board includes an insulating substrate, a plurality of pads on a top surface of the insulating substrate, a protective layer formed on the insulating substrate and having an opening to expose top surfaces of the pads, a bump formed on at least one of the pads and protruding upward of a surface of the protective layer. The bump has a curved lateral side.

Abstract: Disclosed are a method and an apparatus for implementing an active imaging system. A method of obtaining an image in an active imaging system including: dividing an imaging region, and determining a plurality of divided imaging regions; scanning each of the plurality of divided imaging regions based on a laser; collecting reflected light for each of the plurality of divided imaging regions, and generating a plurality of divided images by an image sensor; and generating a whole image for the imaging region based on the plurality of divided images.

Abstract: Provided herein is a pulse laser generator including a modulator configured to receive a continuous wave laser, and to modulate an intensity and phase of the continuous wave laser to generate a first pulse laser; and a chirping unit configured to chirp the first pulse laser to generate a second pulse laser.

Abstract: Discussed are an antistatic device of a display device, which has a high electrostatic discharge (ESD) speed and reduces consumption power, and a method of manufacturing the same. The antistatic device can include a first switching thin film transistor (TFT) in which an active layer is formed of oxide, a second switching TFT in which an active layer is formed of oxide, and an equalizer TFT in which an active layer is formed of amorphous silicon.

Abstract: Provided herein a laser radar apparatus including a plurality of light transmission and reception modules arranged concavely in an opposite direction to a scanning direction based on a surface vertical to the scanning direction, wherein each of the plurality of light transmission and reception modules comprises a transmitter configured to deflect a laser beam and to irradiate the deflected laser beam to a target; and a receiver configured to receive the laser beam reflected from the target.

Abstract: An array substrate including: a gate barrier layer on a substrate; a gate line on the gate barrier layer, the gate line having a gate open portion exposing the gate barrier layer in a gate electrode region; a gate insulating layer on the gate line; an active layer on the gate insulating layer over the gate barrier layer in the gate electrode region; and source and drain electrodes spaced apart from each other on the active layer.

Abstract: A semiconductor package substrate includes an insulating substrate, a circuit pattern on the insulating substrate, a protective layer formed on the insulating substrate to cover the circuit pattern on the insulating substrate, a pad formed on the protective layer while protruding from a surface of the protective layer, and an adhesive member on the pad.

Abstract: A semiconductor package substrate includes an insulating substrate; a circuit pattern on the insulating substrate; a protective layer on the insulating substrate, the protective layer covering the circuit pattern on the insulating substrate; a pad on the protective layer; and an adhesive member on the protective layer, wherein the pad includes a first pad buried in the protective layer, and a second pad on the first pad, the second pad protruding over the protective layer.

Abstract: Provided are a printed circuit board which can be used as a substrate for a package, a method of manufacturing the printed circuit board, and a semiconductor package using the printed circuit board, the printed circuit board including: a first substrate having a first mounting area for mounting a package substrate and a second mounting area for mounting a semiconductor element; a single layer or multi-layered circuit pattern of the first substrate; and a post bump connected to the circuit pattern, provided on an external insulating layer of the first mounting area, and having a concave upper surface.

Abstract: Provided is a semiconductor package, including: a lower package to which elements are mounted; a metal post connected to the lower package and including at least one metal material portion; and an upper package to which elements is mounted, and which is connected to the metal post via a solder ball.

Abstract: Embodiments of the invention provide a heat dissipating substrate, including: a heat dissipating circuit layer formed of an electrolytic invar layer including an invar layer and electrolytic copper plating layers formed on both sides of the invar layer; insulation layers formed on both sides of the heat dissipating circuit layer such that the heat dissipating circuit layer is interposed between the insulation layers; first and second circuit layers formed on the insulation layers; and a first bump connecting the heat dissipating circuit layer with the first circuit layer and a second bump connecting the heat dissipating circuit layer with the second circuit layer. The heat dissipating substrate exhibits excellent heat dissipation efficiency and can be made thin.

Abstract: Embodiments of the invention provide a heat dissipating substrate, including: a heat dissipating circuit layer formed of an electrolytic invar layer including an invar layer and electrolytic copper plating layers formed on both sides of the invar layer; insulation layers formed on both sides of the heat dissipating circuit layer such that the heat dissipating circuit layer is interposed between the insulation layers; first and second circuit layers formed on the insulation layers; and a first bump connecting the heat dissipating circuit layer with the first circuit layer and a second bump connecting the heat dissipating circuit layer with the second circuit layer. The heat dissipating substrate exhibits excellent heat dissipation efficiency and can be made thin.

Abstract: An ECG sensing apparatus and a method for removing a baseline drift in the clothing are provided. The ECG sensing apparatus filters ECG signals and filters a baseline drift noise which is caused by human body's motion and breathing. Accordingly, the baseline drift in the sensing apparatus is minimized even if there is a free motion.

Abstract: The present invention provides a new recursive FIR filter scheme which supports a variable order short-term predictor, and uses a pipeline stall based on the radix-2 algorithm and an autocorrelation processing time for reducing the complexity of MPEG-4 ALS hardware implementation.

Abstract: A method of fabrication an array substrate includes forming an oxide semiconductor layer on a substrate; sequentially forming a gate insulating layer and a gate electrode corresponding to a central portion of the oxide semiconductor layer; forming source and drain areas having conductive properties in the oxide semiconductor layer by performing hydrogen plasma treatment; forming barrier layers on the source and drain areas, the barrier layer having a first thickness; forming an inter insulating layer on the gate electrode and having first contact holes that expose the barrier layers; and forming source and drain electrodes on the inter insulating layer and contacting the barrier layers through the first contact holes, respectively.

Abstract: Disclosed is a calibration system for stereo cameras. The calibration system includes a rig control module configured to, when a camera calibration parameter is input, control an auto rig according to the camera calibration parameter to perform physical calibration for a camera, a stereo image calibration apparatus configured to calibrate a stereo image to acquire the camera calibration parameter, and output the acquired camera calibration parameter, and a camera control module configured to output the camera calibration parameter, which is input from the stereo image calibration apparatus, to the rig control module, or screen-output the camera calibration parameter. Therefore, physical calibration and image processing calibration for a camera are performed in association with each other.

Abstract: Disclosed herein is a heat dissipating substrate, including: a heat dissipating circuit layer formed of an electrolytic invar layer including an invar layer and electrolytic copper plating layers formed on both sides of the invar layer; insulation layers formed on both sides of the heat dissipating circuit layer such that the heat dissipating circuit layer is interposed between the insulation layers; first and second circuit layers formed on the insulation layers; and a first bump connecting the heat dissipating circuit layer with the first circuit layer and a second bump connecting the heat dissipating circuit layer with the second circuit layer. The heat dissipating substrate exhibits excellent heat dissipation efficiency and can be made thin.

Abstract: An ECG sensing apparatus and a method for removing a baseline drift in the clothing are provided. The ECG sensing apparatus filters ECG signals and filters a baseline drift noise which is caused by human body's motion and breathing. Accordingly, the baseline drift in the sensing apparatus is minimized even if there is a free motion.

Abstract: An apparatus for controlling IEEE 802.15.4 physical layer operation state is provided. The physical layer operation state controlling apparatus defines an operation state of a physical layer including a Hardwired Low-MAC (HL-MAC) device in which functions of IEEE 802.15.4 MAC layer are hardwired, and includes a state module for controlling the operation state of the physical layer. The state module includes a Finite State Machine (FSM) for, when receiving an event for the operation state of the physical layer, transiting to a state module corresponding to the event and controlling the operation state of the physical layer; and an interrupt handler for converting an interrupt received from the physical layer to the event corresponding to a register of the state module and sending the event to the FSM. Hence, by means of the state machine for the IEEE 802.15.4 PHY, the IEEE 802.15.4 physical layer operation state can be controlled to optimize the operations of the upper MAC.

Abstract: A dual muffler is provided which includes an inlet pipe, an end of which an exhaust gas is introduced from an engine. Additionally, an outlet pipe, an end of which is connected to an opposite end of the inlet pipe, branched at the opposite end of the inlet pipe running toward a side and the opposite side such that the exhaust gas from the inlet pipe is discharged through an opposite end is also provided. A housing covers the inlet pipe and the outlet pipe to expose the end of the inlet pipe and the opposite end of the outlet pipe to an outside environment; and a sound-absorbing material fills the interior space of the housing except for the remaining space where the inlet pipe and the outlet pipe.