Patents by Inventor Dongmin Chen
Dongmin Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 8247879Abstract: A micromechanical device assembly includes a micromechanical device enclosed within a processing region and a lubricant channel formed through an interior wall of the processing region and in fluid communication with the processing region. Lubricant is injected into the lubricant channel via capillary forces and held therein via surface tension of the lubricant against the internal surfaces of the lubrication channel. The lubricant channel containing the lubricant provides a ready supply of fresh lubricant to prevent stiction from occurring between interacting components of the micromechanical device disposed within the processing region.Type: GrantFiled: April 25, 2011Date of Patent: August 21, 2012Assignee: Miradia, Inc.Inventors: Dongmin Chen, William Spencer Worley, Hung-Nan Chen
-
Publication number: 20120205611Abstract: A memory device includes a first metal layer and a first metal oxide layer coupled to the first metal layer. The memory device includes a second metal oxide layer coupled to the first metal oxide layer and a second metal layer coupled to the second metal oxide layer.Type: ApplicationFiled: April 26, 2012Publication date: August 16, 2012Applicant: 4D-S PTY, LTDInventor: Dongmin Chen
-
Publication number: 20120199804Abstract: A memory device includes a first metal layer and a first metal oxide layer coupled to the first metal layer. The memory device includes a second metal oxide layer coupled to the first metal oxide layer and a second metal layer coupled to the second metal oxide layer.Type: ApplicationFiled: February 14, 2012Publication date: August 9, 2012Applicant: 4D-S PTY, LTDInventor: Dongmin CHEN
-
Patent number: 8207004Abstract: A method for fabricating a micro electromechanical device includes providing a first substrate including control circuitry. The first substrate has a top surface and a bottom surface. The method also includes forming an insulating layer on the top surface of the first substrate, removing a first portion of the insulating layer so as to form a plurality of standoff structures, and bonding a second substrate to the first substrate. The method further includes thinning the second substrate to a predetermined thickness and forming a plurality of trenches in the second substrate. Each of the plurality of trenches extends to the top surface of the first substrate. Moreover, the method includes filling at least a portion of each of the plurality of trenches with a conductive material, forming the micro electromechanical device in the second substrate, and bonding a third substrate to the second substrate.Type: GrantFiled: November 18, 2009Date of Patent: June 26, 2012Assignee: Miradia Inc.Inventors: Dongmin Chen, Justin Payne, Li-Tien Tseng
-
Patent number: 8119432Abstract: A resonator includes a CMOS substrate having a first electrode and a second electrode. The CMOS substrate is configured to provide one or more control signals to the first electrode. The resonator also includes a resonator structure including a silicon material layer. The resonator structure is coupled to the CMOS substrate and configured to resonate in response to the one or more control signals.Type: GrantFiled: November 12, 2010Date of Patent: February 21, 2012Assignee: Miradia Inc.Inventors: Xiao Yang, Dongmin Chen, Ye Wang, Justin Payne, Yuxiang Wang, Wook Ji
-
Publication number: 20120034724Abstract: A resonator includes a CMOS substrate having a first electrode and a second electrode. The CMOS substrate is configured to provide one or more control signals to the first electrode. The resonator also includes a resonator structure including a silicon material layer. The resonator structure is coupled to the CMOS substrate and configured to resonate in response to the one or more control signals.Type: ApplicationFiled: October 18, 2011Publication date: February 9, 2012Applicant: Miradia Inc.Inventors: Xiao Yang, Dongmin Chen, Ye Wang, Justin Payne, Yuxiang Wang, Wook Ji
-
Patent number: 8096665Abstract: A high-resolution image is generated using multiple spatially offset lower-resolution digital micro-mirror device (DMD) panels. Multiple lower-resolution subframe signals for controlling the spatial light modulators are generated from a high-resolution image signal using a resolution reduction and interpolation algorithm. The spatial light modulators under control of the subframe signals are illuminated by a light source and light beams reflected from the spatial light modulators are combined and directed onto a screen for display.Type: GrantFiled: October 11, 2007Date of Patent: January 17, 2012Assignee: Miradia, Inc.Inventors: Matthew William Bellis, Dongmin Chen, Gregory Allen Miller
-
Patent number: 8022520Abstract: A system for hermetically sealing devices. The system includes a substrate, which includes a plurality of individual chips. Each of the chips includes a plurality of devices and each of the chips are arranged in a spatial manner as a first array. The system also includes a transparent member of a predetermined thickness, which includes a plurality of recessed regions arranged in a spatial manner as a second array and each of the recessed regions are bordered by a standoff region. The substrate and the transparent member are aligned in a manner to couple each of the plurality of recessed regions to a respective one of said plurality of chips. Each of the chips within one of the respective recessed regions is hermetically sealed by contacting the standoff region of the transparent member to the plurality of first street regions and second street regions using at least a bonding process to isolate each of the chips within one of the recessed regions.Type: GrantFiled: August 29, 2006Date of Patent: September 20, 2011Assignee: Miradia Inc.Inventors: Xiao Yang, Dongmin Chen
-
Publication number: 20110215430Abstract: A micromechanical device assembly includes a micromechanical device enclosed within a processing region and a lubricant channel formed through an interior wall of the processing region and in fluid communication with the processing region. Lubricant is injected into the lubricant channel via capillary forces and held therein via surface tension of the lubricant against the internal surfaces of the lubrication channel. The lubricant channel containing the lubricant provides a ready supply of fresh lubricant to prevent stiction from occurring between interacting components of the micromechanical device disposed within the processing region.Type: ApplicationFiled: April 25, 2011Publication date: September 8, 2011Applicant: Miradia, Inc.Inventors: Dongmin CHEN, William Spencer WORLEY, Hung-Nan CHEN
-
Publication number: 20110186839Abstract: A system for hermetically sealing devices includes a substrate, which includes a plurality of individual chips. Each of the chips includes a plurality of devices and each of the chips are arranged in a spatial manner as a first array. The system also includes a transparent member of a predetermined thickness, which includes a plurality of recessed regions arranged in a spatial manner as a second array and each of the recessed regions are bordered by a standoff region. The substrate and the transparent member are aligned in a manner to couple each of the plurality of recessed regions to a respective one of said plurality of chips. Each of the chips within one of the respective recessed regions is hermetically sealed by contacting the standoff region of the transparent member to the plurality of first street regions and second street regions using at least a bonding process to isolate each of the chips within one of the recessed regions.Type: ApplicationFiled: April 13, 2011Publication date: August 4, 2011Applicant: Miradia Inc.Inventors: Xiao Yang, Dongmin Chen
-
Patent number: 7952786Abstract: One embodiment of an micromechanical device includes a first contact surface, a moveable component having a second contact surface, and a coating of liquid or solid lubricant on at least one of the contact surfaces, where the second contact surface interacts with the first contact surface during device operation, and a gas-phase lubricant is disposed between the first contact surface and the second contact surface, where the gas-phase lubricant is adapted to increase the usable lifetime of the liquid or solid lubricant coating on the contact surfaces. One advantage of the disclosed device is that a gas-phase lubricant has a high diffusion rate and, therefore, is self-replenishing, meaning that it can quickly move back into a contact region after being physically displaced from the region by the contacting surfaces of the device during operation.Type: GrantFiled: April 23, 2008Date of Patent: May 31, 2011Assignee: Miradia Inc.Inventors: Dongmin Chen, Fulin Xiong
-
Patent number: 7948000Abstract: A system for hermetically sealing devices includes a substrate, which includes a plurality of individual chips. Each of the chips includes a plurality of devices and each of the chips are arranged in a spatial manner as a first array. The system also includes a transparent member of a predetermined thickness, which includes a plurality of recessed regions arranged in a spatial manner as a second array and each of the recessed regions are bordered by a standoff region. The substrate and the transparent member are aligned in a manner to couple each of the plurality of recessed regions to a respective one of said plurality of chips. Each of the chips within one of the respective recessed regions is hermetically sealed by contacting the standoff region of the transparent member to the plurality of first street regions and second street regions using at least a bonding process to isolate each of the chips within one of the recessed regions.Type: GrantFiled: February 7, 2007Date of Patent: May 24, 2011Assignee: Miradia Inc.Inventors: Xiao Yang, Dongmin Chen
-
Publication number: 20110111544Abstract: A MEMS mirror for a laser printing application includes providing a CMOS substrate including a pair of electrodes, and providing a reflecting mirror moveable over the substrate and the electrodes. Voltages applied to the electrodes create an electrostatic force causing an end of the mirror to be attracted to the substrate. A precise position of the mirror can be detected and controlled by sensing a change in capacitance between the mirror ends and the underlying electrodes.Type: ApplicationFiled: January 20, 2011Publication date: May 12, 2011Applicant: Miradia Inc.Inventors: Xiao Yang, William Spencer Worley, III, Dongmin Chen, Ye Wang
-
Patent number: 7932569Abstract: A micromechanical device assembly includes a micromechanical device enclosed within a processing region and a lubricant channel formed through an interior wall of the processing region and in fluid communication with the processing region. Lubricant is injected into the lubricant channel via capillary forces and held therein via surface tension of the lubricant against the internal surfaces of the lubrication channel. The lubricant channel containing the lubricant provides a ready supply of fresh lubricant to prevent stiction from occurring between interacting components of the micromechanical device disposed within the processing region.Type: GrantFiled: September 26, 2007Date of Patent: April 26, 2011Assignee: Miradia, Inc.Inventors: Dongmin Chen, William Spencer Worley, Hung-Nan Chen
-
Patent number: 7923789Abstract: The contrast offered by a spatial light modulator device may be enhanced by positioning nonreflective elements such as supporting posts and moveable hinges, behind the reflecting surface of the pixel. In accordance with one embodiment, the reflecting surface is suspended over and underlying hinge-containing layer by integral ribs of the reflecting material defined by gaps in a sacrificial layer. In accordance with an alternative embodiment, the reflecting surface is separated from the underlying hinge by a gap formed in an intervening layer, such as oxide. In either embodiment, walls separating adjacent pixel regions may be recessed beneath the reflecting surface to further reduce unwanted scattering of incident light and thereby enhance contrast.Type: GrantFiled: April 25, 2008Date of Patent: April 12, 2011Assignee: Miradia Inc.Inventors: Kegang Huang, Xiao Yang, Dongmin Chen
-
Publication number: 20110059565Abstract: A resonator includes a CMOS substrate having a first electrode and a second electrode. The CMOS substrate is configured to provide one or more control signals to the first electrode. The resonator also includes a resonator structure including a silicon material layer. The resonator structure is coupled to the CMOS substrate and configured to resonate in response to the one or more control signals.Type: ApplicationFiled: November 12, 2010Publication date: March 10, 2011Applicant: Miradia Inc.Inventors: Xiao Yang, Dongmin Chen, Ye Wang, Justin Payne, Yuxiang Wang, Wook Ji
-
Patent number: 7898561Abstract: A MEMS mirror for a laser printing application includes providing a CMOS substrate including a pair of electrodes, and providing a reflecting mirror moveable over the substrate and the electrodes. Voltages applied to the electrodes create an electrostatic force causing an end of the mirror to be attracted to the substrate. A precise position of the mirror can be detected and controlled by sensing a change in capacitance between the mirror ends and the underlying electrodes.Type: GrantFiled: January 25, 2008Date of Patent: March 1, 2011Assignee: Miradia Inc.Inventors: Xiao Yang, William Spencer Worley, III, Dongmin Chen, Ye Wang
-
Publication number: 20110012166Abstract: A multilayered integrated optical and circuit device. The device has a first substrate comprising at least one integrated circuit chip thereon, which has a cell region and a peripheral region. Preferably, the peripheral region has a bonding pad region, which has one or more bonding pads and an antistiction region surrounding each of the one or more bonding pads. The device has a second substrate with at least one or more deflection devices thereon coupled to the first substrate. At least one or more bonding pads are exposed on the first substrate. The device has a transparent member overlying the second substrate while forming a cavity region to allow the one or more deflection devices to move within a portion of the cavity region to form a sandwich structure including at least a portion of the first substrate, a portion of the second substrate, and a portion of the transparent member.Type: ApplicationFiled: September 27, 2010Publication date: January 20, 2011Applicant: Miradia Inc.Inventors: Xiao "Charles" Yang, Dongmin Chen, Philip Chen
-
Patent number: 7863697Abstract: A resonator includes a CMOS substrate having a first electrode and a second electrode. The CMOS substrate is configured to provide one or more control signals to the first electrode. The resonator also includes a resonator structure including a silicon material layer. The resonator structure is coupled to the CMOS substrate and configured to resonate in response to the one or more control signals.Type: GrantFiled: December 4, 2007Date of Patent: January 4, 2011Assignee: Miradia Inc.Inventors: Xiao Yang, Dongmin Chen, Ye Wang, Justin Payne, Yuxiang Wang, Wook Ji
-
Patent number: 7825519Abstract: A multilayered integrated optical and circuit device. The device has a first substrate comprising at least one integrated circuit chip thereon, which has a cell region and a peripheral region. Preferably, the peripheral region has a bonding pad region, which has one or more bonding pads and an antistiction region surrounding each of the one or more bonding pads. The device has a second substrate with at least one or more deflection devices thereon coupled to the first substrate. At least one or more bonding pads are exposed on the first substrate. The device has a transparent member overlying the second substrate while forming a cavity region to allow the one or more deflection devices to move within a portion of the cavity region to form a sandwich structure including at least a portion of the first substrate, a portion of the second substrate, and a portion of the transparent member.Type: GrantFiled: February 12, 2008Date of Patent: November 2, 2010Assignee: Miradia Inc.Inventors: Xiao Yang, Dongmin Chen, Philip Chen