Abstract: A label sheet for cleaning is formed of a label for cleaning including a cleaning layer having a 180° peeling adhesion to a silicon wafer of 0.20 N/10 mm or less after receiving an active energy and an adhesive layer provided on one of surfaces of said cleaning layer, and a separator on which the label is removably provided through the adhesive layer.

Abstract: The present invention provides a method for producing an organic EL device comprising a step of eliminating a partition wall 3, which has become unnecessary after patterning, from a substrate 1 in a production or an organic electroluminescence device (organic EL device). In particular, it provides a method for producing an organic EL device comprising a step of attaching on the substrate adhesive sheets 6, in particular, an adhesive sheet having an ultraviolet ray curing type pressure sensitive adhesive layer after the patterning, and peeling off the adhesive sheets. According to the method, an organic EL device substantially not containing a partition wall is provided so that the adverse effect of the moisture content and the gas discharged from the partition wall to the device can be prevented, and thus an organic EL device with a long life can be provided.

Abstract: The invention provides a method for removing a resist material existing on an article by adhering a pressure-sensitive adhesive sheet onto the surface of a resist material and releasing both the pressure-sensitive adhesive sheet and the resist material in an integrated state to thereby remove the resist material from the article, in which method the resist material has a Young's modulus of 0.5 MPa or more upon releasing.

Abstract: A cleaning sheet has a cleaning layer having a surface resistivity not less than 1×103 &OHgr;/□. In a method of manufacturing a conveying member with a cleaning function, for sticking the cleaning sheet, in which the cleaning layer formed of an adhesive that is polymerized/cured by an active energy is provided onto one surface of a base material and an ordinary adhesive layer is provided onto the other surface thereof, onto the conveying member via an ordinary adhesive layer to have a shape larger than the shape of the conveying member and then cutting the cleaning sheet along a shape of the conveying member, wherein a polymerizing/curing reaction of the cleaning layer is carried out after the cleaning sheet is cut out into the shape of the conveying member.

Abstract: A low-staining adhesive sheet provided with an adhesive layer containing as the main component a pressure-sensitive adhesive polymer on a base film, wherein the pressure-sensitive adhesive polymer is substantially free from oligomeric low-molecular weight matters; and a method for removing a resist material by using this low-staining adhesive sheet. This low-staining adhesive sheet gives no organic staining matters remaining on the surface of article (for example, substrate) to be used as an adherend and is useful in removing a resist material and foreign matters, and re-peeling surface-protectors, masking materials, and other materials.

Abstract: A cleaning sheet for cleaning foreign matters away from the interior of the substrate processing equipment is provided. The cleaning sheet includes a cleaning layer having substantially no tackiness and having a tensile modulus of not lower than 0.98 N/mm2 as determined according to JIS K7127. Alternatively, the cleaning sheet includes a cleaning layer having a Vickers hardness of not lower than 10.

Abstract: The present invention provides a process for the peeling of a resist material with a pressure-sensitive adhesive sheet which involves the improvement in the removal of resist material or the enhancement of peelability of resist material to certainly remove the resist material from the object regardless of the properties or treated state of the resist material. The process comprises (1) after the application of the pressure-sensitive adhesive sheet, effecting a stress-imparting treatment which causes shrinkage or expansion of the pressure-sensitive adhesive sheet so that a stress develops at the interface between the resist material and the object or (2) prior to the application of the resist material to the object, effecting surface treatment to the object such that the surface of the object has a surface free energy of to not greater than 60 dyne/cm.

Abstract: The invention provides a method for removing a resist material existing on an article by adhering a pressure-sensitive adhesive sheet onto the surface of a resist material and releasing both the pressure-sensitive adhesive sheet and the resist material in an integrated state to thereby remove the resist material from the article, in which method the resist material has a Young's modulus of 0.5 MPa or more upon releasing.

Abstract: The present invention is intended to collectively remove unnecessary resist material and side wall protective film after dry etching by side wall protection process, making it possible to simplify the process for the preparation of semiconductors, etc. The process according to the present invention comprises removing unnecessary resist material (3) left behind after dry etching by side wall protection process with a resist pattern (3) present on a semiconductor substrate (2) as a mask and side wall protective film (4) deposited on the side wall (22) of pattern, said process comprising the steps of applying an pressure-sensitive adhesive sheet (1) to said substrate (2), heating the pressure-sensitive adhesive layer (1) under pressure so that the pressure-sensitive adhesive (11) comes in contact with up to the side wall (4) of pattern, and then collectively peeling said pressure-sensitive adhesive sheet (1), said resist material (3) and said side wall protective film (4) off said substrate.

Abstract: An adhesive tape for the removal of a resist includes a curing adhesive layer having an initial tensile modulus of not smaller than 10 MPa at 100° C. after cured provided on a supporting base material, and/or an adhesive layer provided on a supporting base material having a flexural stiffness of not smaller than 1×10−4 (N·m) per unit width.

Abstract: The present invention provides a process for the peeling of a resist material with a pressure-sensitive adhesive sheet which involves the improvement in the removal of resist material or the enhancement of peelability of resist material to certainly remove the resist material from the object regardless of the properties or treated state of the resist material. The process comprises (1) after the application of the pressure-sensitive adhesive sheet, effecting a stress-imparting treatment which causes shrinkage or expansion of the pressure-sensitive adhesive sheet so that a stress develops at the interface between the resist material and the object or (2) prior to the application of the resist material to the object, effecting surface treatment to the object such that the surface of the object has a surface free energy of to not greater than 60 dyne/cm.

Abstract: The present invention provides a process for the peeling of a resist material with a pressure-sensitive adhesive sheet which involves the improvement in the removal of resist material or the enhancement of peelability of resist material to certainly remove the resist material from the object regardless of the properties or treated state of the resist material. The process comprises (1) after the application of the pressure-sensitive adhesive sheet, effecting a stress-imparting treatment which causes shrinkage or expansion of the pressure-sensitive adhesive sheet so that a stress develops at the interface between the resist material and the object or (2) prior to the application of the resist material to the object, effecting surface treatment to the object such that the surface of the object has a surface free energy of to not greater than 60 dyne/cm.

Abstract: A resist removing apparatus for removing an unwanted resist pattern from a surface of wafer W by applying an adhesive tape to the surface of wafer W having the resist patterns formed thereon, and separating the adhesive tape from the surface of wafer W. The apparatus includes an adhesive removing mechanism 13 for treating the surface of wafer W after the adhesive tape is separated therefrom. The adhesive removing mechanism 13 may be effective when constructed to jet ozone to the surface of wafer W heated, to irradiate the surface of wafer W heated, with ultraviolet rays, or to jet ozone to the surface of wafer W heated and irradiate the surface with ultraviolet rays.

Abstract: An adhesive tape is applied to an article covered with a resist pattern. The article with the adhesive tape applied thereto is rapidly cooled to form cracks in the resist pattern on the surface of the article to weaken the cohesion between the resist pattern and the surface of the article. After the cooling, the adhesive tape is separated from the article, whereby the resist pattern is removed with the adhesive tape from the surface of the article.

Abstract: The present invention provides a process for the removal of a resist layer formed on a semiconductor substrate, which enables easy removal of a resist layer without causing any damage on a gate oxide layer, and an apparatus therefor. The process comprises the steps of forming a gate oxide layer on the semiconductor substrate; forming a resist layer as a resist pattern on the gate oxide layer; removing the gate oxide layer at unnecessary area utilizing the resist layer as a mask; applying a pressure-sensitive adhesive sheet to the semiconductor substrate such that the gate oxide layer left on the semiconductor substrate and the resist layer are masked, and peeling the pressure-sensitive adhesive sheet together with the resist layer off the semiconductor substrate to separate and remove the resist layer from the semiconductor substrate.

Abstract: A deceleration apparatus of an AC servo motor for use in an industrial sewing machine performs a regenerating braking operation during a motor deceleration period. At an early time in the regenerating braking operation of the motor, an intermittent regenerating braking operation is carried out by supplying a current in a control circuit of a motor drive circuit. Subsequently, a continuous regenerating braking operation in the motor is carried out. A drive element comprising a switching element or a transistor in the control circuit is protected in accordance with an intermittent regenerating braking operation or a small regenerating braking current.

Abstract: A rotor of a permanent magnet type synchronous motor facing a stator having a number of slots comprises a rotor core fixed to a motor shaft and an even number of permanent magnets in a circumferential direction of the rotor core. Projecting portions are formed in the shape of a protruding portion of the rotor core over each permanent magnet. The width (A) of each projecting portion is different from the pitch (B) of the slots of the stator. A position detector for detecting the permanent magnet position of the rotor comprises detectors of the normal rotation and other detectors of the reverse rotation. These detectors are arranged having predetermined phase differences (.alpha., .beta.) to a center line. A pattern generating circuit is provided for switching the conducting position to the stator winding corresponding to the phase differences.

Abstract: A superconducting system including a superconductive coil and a perpetual current switch connected in parallel therewith in a cryogenic vessel, wherein the perpetual current switch includes a superconductive lead and a heater that causes the superconductive lead to be normal-conductive; and a DC power source that can arbitrarily change the output thereof with respect to the superconductive coil and the perpetual current switch. The system circulates a current of a specified amount within a closed loop constituted by the superconductive coil and the superconductive lead so as to create a perpetual current loop.

Abstract: A diesel engine characterized in that a part of fuel is reformed into a mixture containing decomposition and oxidation products in a system separate from that of a fuel injection in which a fuel is injected into a compressed air introduced into the cylinders under a high pressure and ignited, and said mixture is introduced into said cylinders during the suction stroke of the engine, and the method for improving the combustion efficiency thereof.