Patents by Inventor Elias Gedamu
Elias Gedamu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240057869Abstract: A system and kit for capturing a 3D image of a body a user includes a plurality of pillar segments being configurable between an assembled configuration and a disassembled configuration. In the assembled configuration, the pillar segments are joined to form one or more upstanding sensing pillars. A plurality of sensors operable to capture image data are distributed along the one or more sensing pillars. The plurality of sensors have fields of view that are overlapping when supported on the sensing pillars. In the disassembled configuration, transportation of the pillar segments is facilitated. The system and kit may be suitable for use at a remote location. Additional functionalities may include a power storage unit, solar charging panels, climate control subsystem, and wireless communication submodule. In operation, the sensing pillars may be enclosed within an enclosure.Type: ApplicationFiled: October 24, 2023Publication date: February 22, 2024Inventor: Elias Gedamu
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Publication number: 20240013875Abstract: A system for manufacturing an artificial covering includes a 3D surface scanning module and a 3D printing module where an anatomical surface is imaged and the image is processed for manufacturing and embedding a sensor or device in the covering which can be used for diagnosis or sensing medical issues in the user.Type: ApplicationFiled: September 26, 2023Publication date: January 11, 2024Inventor: Elias Gedamu
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Patent number: 11813040Abstract: A system and kit for capturing a 3D image of a body a user includes a plurality of pillar segments being configurable between an assembled configuration and a disassembled configuration. In the assembled configuration, the pillar segments are joined to form one or more upstanding sensing pillars. A plurality of sensors operable to capture image data are distributed along the one or more sensing pillars. The plurality of sensors have fields of view that are overlapping when supported on the sensing pillars. In the disassembled configuration, transportation of the pillar segments is facilitated. The system and kit may be suitable for use at a remote location. Additional functionalities may include a power storage unit, solar charging panels, climate control subsystem, and wireless communication submodule. In operation, the sensing pillars may be enclosed within an enclosure.Type: GrantFiled: August 17, 2022Date of Patent: November 14, 2023Assignee: H3ALTH TECHNOLOGIES, INC.Inventor: Elias Gedamu
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Patent number: 11798664Abstract: A system and method for manufacturing custom fit artificial nails includes a 3D surface scanning module and a 3D printing module and use thereof. A central processing module is connected to the 3D surface scanning module and the 3D printing module and performs: operating the 3D surface scanning module to obtain an image of a user's hands/feet; processing the image to create an input 3D model of nails of the user; generating an output 3D model corresponding to artificial nails matching dimensions of the user's nails according to the 3D input model; operating the 3D printing module to manufacture artificial nails according to the output 3D model; and generating medical data by correlating the identified features of the user's nails with known medical conditions, in order to diagnose a medical condition of the user which is known to exhibit the identified features as a symptom. Alternatively, or additionally, medicinal ingredient may be included in the artificial nail to treat the medical condition of the user.Type: GrantFiled: November 21, 2022Date of Patent: October 24, 2023Assignee: H3ALTH TECHNOLOGIES INC.Inventor: Elias Gedamu
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Publication number: 20230079330Abstract: A system and method for manufacturing custom fit artificial nails includes a 3D surface scanning module and a 3D printing module and use thereof. A central processing module is connected to the 3D surface scanning module and the 3D printing module and performs: operating the 3D surface scanning module to obtain an image of a user's hands/feet; processing the image to create an input 3D model of nails of the user; generating an output 3D model corresponding to artificial nails matching dimensions of the user's nails according to the 3D input model; operating the 3D printing module to manufacture artificial nails according to the output 3D model; and generating medical data by correlating the identified features of the user's nails with known medical conditions, in order to diagnose a medical condition of the user which is known to exhibit the identified features as a symptom. Alternatively, or additionally, medicinal ingredient may be included in the artificial nail to treat the medical condition of the user.Type: ApplicationFiled: November 21, 2022Publication date: March 16, 2023Inventor: Elias Gedamu
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Publication number: 20220386874Abstract: A system and kit for capturing a 3D image of a body a user includes a plurality of pillar segments being configurable between an assembled configuration and a disassembled configuration. In the assembled configuration, the pillar segments are joined to form one or more upstanding sensing pillars. A plurality of sensors operable to capture image data are distributed along the one or more sensing pillars. The plurality of sensors have fields of view that are overlapping when supported on the sensing pillars. In the disassembled configuration, transportation of the pillar segments is facilitated. The system and kit may be suitable for use at a remote location. Additional functionalities may include a power storage unit, solar charging panels, climate control subsystem, and wireless communication submodule. In operation, the sensing pillars may be enclosed within an enclosure.Type: ApplicationFiled: August 17, 2022Publication date: December 8, 2022Inventor: Elias Gedamu
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Patent number: 11515019Abstract: A system and method for manufacturing custom fit artificial nails includes a 3D surface scanning module and a 3D printing module and use thereof. A central processing module is connected to the 3D surface scanning module and the 3D printing module and performs: operating the 3D surface scanning module to obtain an image of a user's hands/feet; processing the image to create an input 3D model of nails of the user; generating an output 3D model corresponding to artificial nails matching dimensions of the user's nails according to the 3D input model; operating the 3D printing module to manufacture artificial nails according to the output 3D model; and generating medical data by correlating the identified features of the user's nails with known medical conditions, in order to diagnose a medical condition of the user which is known to exhibit the identified features as a symptom. Alternatively, or additionally, medicinal ingredient may be included in the artificial nail to treat the medical condition of the user.Type: GrantFiled: June 21, 2018Date of Patent: November 29, 2022Assignee: H3ALTH TECHNOLOGIES INC.Inventor: Elias Gedamu
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Patent number: 11439305Abstract: A system and kit for capturing a 3D image of a body a user includes a plurality of pillar segments being configurable between an assembled configuration and a disassembled configuration. In the assembled configuration, the pillar segments are joined to form one or more upstanding sensing pillars. A plurality of sensors operable to capture image data are distributed along the one or more sensing pillars. The plurality of sensors have fields of view that are overlapping when supported on the sensing pillars. In the disassembled configuration, transportation of the pillar segments is facilitated. The system and kit may be suitable for use at a remote location. Additional functionalities may include a power storage unit, solar charging panels, climate control subsystem, and wireless communication submodule. In operation, the sensing pillars may be enclosed within an enclosure.Type: GrantFiled: June 21, 2018Date of Patent: September 13, 2022Assignee: H3ALTH TECHNOLOGIES INC.Inventor: Elias Gedamu
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Publication number: 20210396409Abstract: The invention is directed to an electromagnetic air filtration system and process for removing charged pathogens, such as, the SARS-CoV-2 virus, from an air stream. The air filtration system and process provide a magnetic field within an airflow to remove charged pathogens from the airflow, thereby producing treated air.Type: ApplicationFiled: June 22, 2021Publication date: December 23, 2021Inventors: Elias Gedamu, Lashitew Gedamu, Rani Hussein, Chantelle Anderson, Abraham Gedamu
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Publication number: 20200135310Abstract: A system and method for manufacturing custom fit artificial nails includes a 3D surface scanning module and a 3D printing module and use thereof. A central processing module is connected to the 3D surface scanning module and the 3D printing module and performs: operating the 3D surface scanning module to obtain an image of a user's hands/feet; processing the image to create an input 3D model of nails of the user; generating an output 3D model corresponding to artificial nails matching dimensions of the user's nails according to the 3D input model; operating the 3D printing module to manufacture artificial nails according to the output 3D model; and generating medical data by correlating the identified features of the user's nails with known medical conditions, in order to diagnose a medical condition of the user which is known to exhibit the identified features as a symptom. Alternatively, or additionally, medicinal ingredient may be included in the artificial nail to treat the medical condition of the user.Type: ApplicationFiled: June 21, 2018Publication date: April 30, 2020Inventor: Elias Gedamu
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Publication number: 20200129066Abstract: A system and kit for capturing a 3D image of a body a user includes a plurality of pillar segments being configurable between an assembled configuration and a disassembled configuration. In the assembled configuration, the pillar segments are joined to form one or more upstanding sensing pillars. A plurality of sensors operable to capture image data are distributed along the one or more sensing pillars. The plurality of sensors have fields of view that are overlapping when supported on the sensing pillars. In the disassembled configuration, transportation of the pillar segments is facilitated. The system and kit may be suitable for use at a remote location. Additional functionalities may include a power storage unit, solar charging panels, climate control subsystem, and wireless communication submodule. In operation, the sensing pillars may be enclosed within an enclosure.Type: ApplicationFiled: June 21, 2018Publication date: April 30, 2020Inventor: Elias Gedamu
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Patent number: 7818645Abstract: Systems, methods, and a computer program are disclosed. One embodiment comprises a compiler for developing verification tests of an integrated circuit. The compiler comprises an interface and a built-in self-test (BIST) emulator. The interface includes an input and an output. The interface receives and forwards operator-level instructions to the BIST emulator, which is coupled to the output. The BIST emulator simulates the operation of a BIST module within the integrated circuit.Type: GrantFiled: July 20, 2005Date of Patent: October 19, 2010Assignee: Hewlett-Packard Development Company, L.P.Inventors: Elias Gedamu, Denise Man, Eric Richard Stubblefield, Oguz Ertekin
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Publication number: 20060143524Abstract: Systems, methods, and a computer program are disclosed. One embodiment comprises a compiler for developing verification tests of an integrated circuit. The compiler comprises an interface and a built-in self-test (BIST) emulator. The interface includes an input and an output. The interface receives and forwards operator-level instructions to the BIST emulator, which is coupled to the output. The BIST emulator simulates the operation of a BIST module within the integrated circuit. The BIST emulator includes a function that initializes a plurality of indicators associated with respective data storage locations in communication with the integrated circuit in response to the operator level instruction.Type: ApplicationFiled: July 22, 2004Publication date: June 29, 2006Inventors: Elias Gedamu, Denise Man
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Publication number: 20060031789Abstract: Systems, methods, and a computer program are disclosed. One embodiment comprises a compiler for developing verification tests of an integrated circuit. The compiler comprises an interface and a built-in self-test (BIST) emulator. The interface includes an input and an output. The interface receives and forwards operator-level instructions to the BIST emulator, which is coupled to the output. The BIST emulator simulates the operation of a BIST module within the integrated circuit. The BIST emulator includes a function that enables an assert operation of a plurality of data storage locations in communication with the integrated circuit in response to the operator level instruction.Type: ApplicationFiled: July 22, 2004Publication date: February 9, 2006Inventors: Elias Gedamu, Denise Man
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Publication number: 20060026478Abstract: Systems, methods, and a computer program are disclosed. One embodiment comprises a compiler for developing verification tests of an integrated circuit. The compiler comprises an interface and a built-in self-test (BIST) emulator. The interface includes an input and an output. The interface receives and forwards operator-level instructions to the BIST emulator, which is coupled to the output. The BIST emulator simulates the operation of a BIST module within the integrated circuit.Type: ApplicationFiled: July 20, 2005Publication date: February 2, 2006Inventors: Elias Gedamu, Denise Man, Eric Stubblefield, Oguz Ertekin
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Publication number: 20060020411Abstract: Systems, methods, and a computer program are disclosed. One embodiment comprises a compiler for developing verification tests of an integrated circuit. The compiler comprises an interface and a built-in self-test (BIST) emulator. The interface includes an input and an output. The interface receives and forwards operator-level instructions to the BIST emulator, which is coupled to the output. The BIST emulator simulates the operation of a BIST module within the integrated circuit. The BIST emulator includes a function that initializes a plurality of data storage locations in communication with the integrated circuit.Type: ApplicationFiled: July 22, 2004Publication date: January 26, 2006Inventors: Elias Gedamu, Denise Man
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Publication number: 20060020442Abstract: Systems, methods, and a computer program are disclosed. One embodiment comprises a compiler for developing verification tests of an integrated circuit. The compiler comprises an interface and a built-in self-test (BIST) emulator. The interface includes an input and an output. The interface receives and forwards operator-level instructions to the BIST emulator, which is coupled to the output. The BIST emulator simulates the operation of a BIST module within the integrated circuit. The BIST emulator includes a function that that directs a data value stored in a data storage location to an output device.Type: ApplicationFiled: July 22, 2004Publication date: January 26, 2006Inventors: Elias Gedamu, Denise Man
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Patent number: 6975945Abstract: One embodiment of a method comprises retrieving test data corresponding to test results from a plurality of fuses, each one of the plurality of fuses residing on a different one of a plurality of semiconductor devices and each one of the plurality of fuses having a common location on the semiconductor devices, determining from the test data which of the plurality of fuses are defective fuses, and specifying on an output report the common location of the determined defective fuses when a number of the defective fuses are at least equal to a predefined portion of the plurality of fuses.Type: GrantFiled: August 26, 2003Date of Patent: December 13, 2005Assignee: Hewlett Packard Development Company, L.P.Inventors: Elias Gedamu, Denise Man
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Patent number: 6972590Abstract: A data bus for a printed circuit board is disclosed having a plurality of lines separated by a substrate. A method is also disclosed for creating a bus with a reduced reflection of signal energy at the interface between the bus and a receiving agent connected to the bus. The lines in the bus include data lines and at least two strobe lines that are positioned adjacent each other to take advantage of the known impedance inherent to their dominant coupling. The bus includes separate data-line terminations and strobe-line terminations connected to the data lines and strobe lines, respectively. The separate terminations have values matched to impedances calculated from the separate sets of lines to more effectively reduce the reflected energy by more accurately matching the impedances on the lines.Type: GrantFiled: May 30, 2002Date of Patent: December 6, 2005Assignee: Hewlett-Packard Development Company, L.P.Inventors: David Marshall, Karl J. Bois, Elias Gedamu
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Patent number: 6961674Abstract: One embodiment of a method for analysis of cache array test data comprises retrieving test results for a current period of time for a first plurality of storage elements and for a historical period of time for a second plurality of storage elements; determining a plurality of attributes for each of the first storage elements and the second storage elements based upon the test results, the attributes comprising one of a good condition, a defective condition, a repairable condition and a repaired condition; determining a plurality of attribute statistics corresponding to the attributes of the first storage elements and the second storage elements; and generating an output report indicating at least two of the attribute statistics of the first storage elements and the second storage elements.Type: GrantFiled: August 11, 2003Date of Patent: November 1, 2005Assignee: Hewlett-Packard Development Company, L.P.Inventors: Elias Gedamu, Denise Man