Abstract: A method and apparatus for improved defocus detection on wafers. The use of hyperspectral imaging provides increased sensitivity for local defocus defects, and the use of Fourier Space analysis provides increased sensitivity for extended defocus defects. A combination of the two provides improved overall sensitivity to local and extended defocus defects.

Abstract: Wafer inspection systems and methods are provided. One inspection system includes a module measurement cell coupled to a host inspection system by a wafer handler. The module measurement cell is configured to inspect a wafer using one or more modes prior to inspection of the wafer by the host inspection system. The one or more modes include backside inspection, edge inspection, frontside macro defect inspection, or a combination thereof. Another inspection system includes two or more low resolution electronic sensors arranged at multiple viewing angles. The sensors are configured to detect light returned from a wafer substantially simultaneously. A method for analyzing inspection data includes selecting a template corresponding to a support device that contacts a backside of a wafer prior to inspection of the backside of the wafer. The method also includes subtracting data representing the template from inspection data generated by inspection of the backside of the wafer.

Abstract: In one embodiment, a surface scanning system comprises a radiation directing assembly that scans a surface using a Cartesian scanning pattern; and a radiation collecting assembly that collects radiation reflected from the surface. A scattered radiation collection system is included that measures the scattered light from the surface.

Abstract: An inspection system for detecting anomalies on a substrate. A first network is coupled to a sensor array and communicates data. Process nodes are coupled to the first network, and process the data to produce reports. Each process node has an interface card that formats the data for a high speed interface bus that is coupled to the interface card. A computer receives and processes the data to produce the report. A second network receives the reports. A job manager is coupled to the second network, receives the reports, and sends information to the process nodes to coordinate processing of the data.

Abstract: A method and apparatus for enhancing image contrast between resist-covered and bare silicon regions of a wafer, applicable to Edge Bead Removal inspection. The wafer is illuminated separately by s-polarized light and p-polarized light impinging at near the Brewster angle of silicon or resist, and an image difference between the reflected s-polarized light and the reflected p-polarized light is derived.

Abstract: A wafer edge inspection system utilizes a novel camera and mirror arrangement which conveys the images of the various near-edge wafer regions in piecewise fashion to a linear sensor array on a single line-scan sensor. This system is low-cost and compact, and may be integrated into various wafer handling or processing machines or systems.

Abstract: An inspection system for detecting anomalies on a substrate. A first network is coupled to the sensor array and communicates image data. Process nodes are couple to the first network, and process the data to produce reports. Each process node has an interface card that formats the data for a high speed interface bus that is coupled to the interface card. A computer receives and processes the data to produce the report. A second network receives the reports from the process nodes. A job manager is coupled to the second network, and receives the reports from the process nodes and sends information to the process nodes to coordinate the processing of the data in the process nodes.

Abstract: Wafer inspection systems and methods are provided. One inspection system includes a module measurement cell coupled to a host inspection system by a wafer handler. The module measurement cell is configured to inspect a wafer using one or more modes prior to inspection of the wafer by the host inspection system. The one or more modes include backside inspection, edge inspection, frontside macro defect inspection, or a combination thereof. Another inspection system includes two or more low resolution electronic sensors arranged at multiple viewing angles. The sensors are configured to detect light returned from a wafer substantially simultaneously. A method for analyzing inspection data includes selecting a template corresponding to a support device that contacts a backside of a wafer prior to inspection of the backside of the wafer. The method also includes subtracting data representing the template from inspection data generated by inspection of the backside of the wafer.

Abstract: An inspection system for detecting anomalies on a substrate. The inspection system has a sensor array for generating image data. A first high speed network is coupled to the sensor array and receives and communicates the image data. An array of process nodes is coupled to the first high speed network, and receives and processes the image data to produce anomaly reports. Each process node has an interface card coupled to the first high speed network, that receives the image data from the first high speed network and formats the image data according to a high speed interface bus protocol. The interface card sets a register indicating whether a predetermined amount of image data has been stored in a memory, and the process node reads the register to determine whether the predetermined amount of image data has been stored in the memory, and initiates image processing when the register indicates that the predetermined amount of image data has been stored in the memory.

Abstract: An inspection system for detecting anomalies on a substrate. The inspection system has a sensor array for generating image data. A first high speed network is coupled to the sensor array and receives and communicates the image data. An array of process nodes is coupled to the first high speed network, and receives and processes the image data to produce anomaly reports. Each process node has an interface card coupled to the first high speed network, that receives the image data from the first high speed network and formats the image data according to a high speed interface bus protocol. The interface card sets a register indicating whether a predetermined amount of image data has been stored in a memory, and the process node reads the register to determine whether the predetermined amount of image data has been stored in the memory, and initiates image processing when the register indicates that the predetermined amount of image data has been stored in the memory.

Abstract: A method and apparatus for improving system resolution for a defect line scanner while not increasing aliasing effects, or alternatively to maintain system resolution for a defect scanner while decreasing aliasing effects. This is accomplished by decreasing effective pixel size for a CCD array defect line scanner while not decreasing signal-to-noise ratio, with minimal changes to the current machine. The method utilizes a sampling phase shift between successive lines of a multi-line sensor array during scanning.

Abstract: A method and apparatus for enhancing image contrast between resist-covered and bare silicon regions of a wafer, applicable to Edge Bead Removal inspection. The wafer is illuminated separately by s-polarized light and p-polarized light impinging at near the Brewster angle of silicon or resist, and an image difference between the reflected s-polarized light and the reflected p-polarized light is derived.

Abstract: An inspection system for detecting anomalies on a substrate. The inspection system has a sensor array for generating image data. A first high speed network is coupled to the sensor array and receives and communicates the image data. An array of process nodes is coupled to the first high speed network, and receives and processes the image data to produce anomaly reports. Each process node has an interface card coupled to the first high speed network, that receives the image data from the first high speed network and formats the image data according to a high speed interface bus protocol. A high speed interface bus is coupled to the interface card, receives the image data from the interface card. A computer is coupled to the high speed interface bus, and receives the image data from the high speed interface bus and processes the image data according to an algorithm, to produce the anomaly report.

Abstract: An inspection system for detecting anomalies on a substrate. A first network is coupled to a sensor array and communicates data. Process nodes are coupled to the first network, and process the data to produce reports. Each process node has an interface card that formats the data for a high speed interface bus that is coupled to the interface card. A computer receives and processes the data to produce the report. A second network receives the reports. A job manager is coupled to the second network, receives the reports, and sends information to the process nodes to coordinate processing of the data.

Abstract: A method and apparatus for enhancing image contrast between resist-covered and bare silicon regions of a wafer, applicable to Edge Bead Removal inspection. The wafer is illuminated separately by s-polarized light and p-polarized light impinging at near the Brewster angle of silicon or resist, and an image difference between the reflected s-polarized light and the reflected p-polarized light is derived.

Abstract: A method and apparatus for improved defocus detection on wafers. The use of hyperspectral imaging provides increased sensitivity for local defocus defects, and the use of Fourier Space analysis provides increased sensitivity for extended defocus defects. A combination of the two provides improved overall sensitivity to local and extended defocus defects.

Abstract: An inspection system for detecting anomalies on a substrate. A first network is coupled to a sensor array and communicates data. Process nodes are coupled to the first network, and process the data to produce reports. Each process node includes memory sufficient to buffer the data until it can process the data. Each process node has an interface card that formats the data for a high speed interface bus that is coupled to the interface card. A computer receives and processes the data to produce the report. A second network receives the reports. A job manager is coupled to the second network, receives the reports, and sends information to the process nodes to coordinate processing of the data.

Abstract: Systems and methods for contact image sensor based inspection of specimens are provided. A system configured to inspect a specimen may include a contact image sensor. The contact image sensor may include a light source configured to direct light toward a surface of the specimen and a linear sensor array configured to detect light returned from the surface. The system may further include a processor configured to determine a presence of defects on the surface using the detected light. A method for inspecting the specimen may include directing light from a light source toward a surface of the specimen and detecting light returned from the surface using a linear sensor array. The light source and the linear sensor array may be arranged in a contact image sensor. The method may further include determining a presence of defects on the surface from the detected light.

Abstract: An inspection system for detecting anomalies on a substrate. The inspection system has a sensor array for generating image data. A first high speed network is coupled to the sensor array and receives and communicates the image data. An array of process nodes is coupled to the first high speed network, and receives and processes the image data to produce anomaly reports. Each of the process nodes has an amount of memory that is sufficient to receive image data representing a plurality of dice on an integrated circuit wafer, and each of the process nodes performs analysis on the plurality of dice. Each process node has an interface card coupled to the first high speed network, that receives the image data from the first high speed network and formats the image data according to a high speed interface bus protocol. A high speed interface bus is coupled to the interface card, receives the image data from the interface card.

Abstract: An inspection system for detecting anomalies on a substrate. A first network is coupled to a sensor array and communicates image data. Process nodes are coupled to the first network, and processes the data to produce reports. Each process node has an interface card that formats the data for a high speed interface bus that is coupled to the interface card. A computer receives and processes the data to produce the anomaly report. A second network receives the anomaly reports from the process nodes. A job manager is coupled to the second network, and receives the anomaly reports from the process nodes and sends information to the process nodes to coordinate the processing of the data in the process nodes.