Abstract: Described herein is a method of controlling calls for packet switched networks, each network including at least two local area networks (50, 60) and a connecting network (70). The method comprises the steps of determining an acceptable packet loss rate for a call to be established between two of the local area networks, comparing actual packet loss rate to the acceptable packet loss rate, and dropping the call if the actual packet loss rate is greater than the acceptable packet loss rate determining for how long a period the actual packet loss rate has been happening and utilising that period in deciding to drop the call. A recorded announcement may be played when the call is to be dropped. Alternatively, the priority of the transmission of the continuous stream of data can be changed when the actual packet loss rate is not acceptable and the above steps are repeated. Ideally, data relating to dropped calls is stored for future use.

Abstract: Provided is a method of manufacturing a multi-frequency surface acoustic wave (SAW) device on a common piezoelectric substrate. The method features varying the resonant frequency of waveguide elements of the SAW device using a single etch step. The etch step removes a sub-portion of multiple layers of conductive film disposed on the substrate.

Abstract: Devices positioned between an energy source and an imprint lithography template may block exposure of energy to portions of polymerizable material dispensed on a substrate. Portions of the polymerizable material that are blocked from the energy may remain fluid, while the remaining polymerizable material is solidified.

Abstract: Methods for manufacturing a patterned surface on a substrate are described. Generally, the patterned surface is defined by a residual layer having a thickness of less than approximately 5 nm.

Abstract: Provided is a method of manufacturing a multi-frequency surface acoustic wave (SAW) device on a common piezoelectric substrate. The method features varying the resonant frequency of waveguide elements of the SAW device using a single etch step. The etch step removes a sub-portion of multiple layers of conductive film disposed on the substrate.

Abstract: Provided is a method of manufacturing a multi-frequency surface acoustic wave (SAW) device on a common piezoelectric substrate. The method features varying the resonant frequency of waveguide elements of the SAW device using a single etch step. The etch step removes a sub-portion of multiple layers of conductive film disposed on the substrate.

Abstract: Described herein is a method of controlling call admission for packet switched networks, each network including at least two local area networks (50, 60) and a connecting network (70). The method comprises determining success rates of previous calls from a first local area network to a second local area network and deciding to drop the call attempt based on the success rates of previous calls. In one embodiment, the current packet loss rate for calls from the first local area network to the second local area network is also determined, and the decision to drop the call attempt is based on that current packet loss rate. Additionally, the decision to drop the call attempt may be based on both the current packet loss rate and the success rates of previous calls.

Abstract: Provided is a method of manufacturing a multi-frequency surface acoustic wave (SAW) device on a common piezoelectric substrate. The method features varying the resonant frequency of waveguide elements of the SAW device using a single etch step. The etch step removes a sub-portion of multiple layers of conductive film disposed on the substrate.