Abstract: A semiconductor package device includes a lower package including a lower semiconductor chip mounted on the lower package substrate, a lower molding compound layer disposed on the lower package substrate, a first trench formed in the lower molding compound layer to surround the lower semiconductor chip, and a second trench connected to the first trench to extend to an outer wall of the lower package, the second trench being formed in the lower molding compound layer, an upper package disposed on the lower package. The upper package includes an upper package substrate and at least one upper semiconductor chip mounted on the upper package substrate and a heat transfer member disposed between the lower package and the upper package.