Abstract: A system includes a vehicle having an electronic device, a sensor designed to detect sensor data corresponding to at least one property of the electronic device, an output device designed to output data, and a vehicle network access device designed to transmit the sensor data. The system also includes a machine learning server separate from the vehicle and having a machine learning processor designed to receive the sensor data, and generate, using a machine learning algorithm, a model of the electronic device. The machine learning processor is also designed to determine that a fault is likely to occur with the electronic device by conducting a T squared statistical analysis of the sensor data using the model, and generate a signal to be transmitted to the vehicle network access device when the fault is likely to occur and output information indicating that the fault is likely to occur.

Abstract: A method for fabricating a thermal composite includes pouring a mixture including a plurality of magnetically susceptible particles and a thermosetting polymer into a mold, placing the mold containing the mixture in a chamber including a plurality of magnet arrays, and heating the mold containing the mixture in the chamber for a time and at a temperature sufficient to cure the thermosetting polymer. At least one of the plurality of magnet arrays includes a Halbach array.

Abstract: An optical power transfer device with an embedded active cooling chip is disclosed. The device includes a cooling chip made of a semiconductor material, and a first subassembly and a second subassembly mounted on the cooling chip. The cooling chip comprises at least one metallization layer on a portion of a first surface of the cooling chip, at least one inlet through a second surface of the cooling chip, wherein the second surface is opposite to the first surface, at least one outlet through the second surface and one or more micro-channels extending between and fluidly coupled to the at least one inlet and the at least one outlet. A cooling fluid flows through the one or more micro-channels. The first subassembly is mounted on the at least one metallization layer and comprises a laser. The second subassembly comprises a phototransducer configured to receive a laser beam from the laser.

Abstract: An autonomous driving system includes an aerial vehicle and an autonomous vehicle. The aerial vehicle includes an imaging device configured to obtain map data, an optical-to-electrical transducer configured to convert optical power to electrical power for operating the aerial vehicle, one or more processors, one or more memory modules, and machine readable instructions stored in the one or more memory modules of the aerial vehicle that, when executed by the one or more processors, cause the aerial vehicle to output the map data. The autonomous vehicle includes an optical power generator configured to transmit an optical power beam to the optical-to-electrical transducer of the aerial vehicle. The autonomous vehicle receives the map data output by the imaging device from the aerial vehicle.

Abstract: Bridge circuits provide a reduced amplitude of gate-source voltage oscillation when the switches switch states during short circuit triggered turnoff for protection. Bridge circuits reduce an amplitude of an oscillation voltage between a gate and a source of a transistor that is utilized as a switch in the bridge circuit. This is beneficial because the reduced amplitude reduces the likelihood of damage to the transistor. A bridge circuit includes a first power rail and a second power rail. The bridge circuit further includes a first circuit having a first switch and a second switch connected in parallel between the first power rail and the second power rail. The bridge circuit further includes at least one passive circuit element connected in parallel with a primary energy flow path of the first circuit to damp oscillation voltage of the first circuit.

Abstract: Methods, systems, and apparatus for a wireless charging apparatus. The wireless charging apparatus includes a layer or sheet of polymeric or similarly compliant material. The wireless charging apparatus includes an inductive loop embedded within the layer or sheet of polymeric material. The inductive loop has a first shape and a first size. The wireless charging apparatus includes one or more actuators. The one or more actuators are configured to move or shape the layer or sheet of polymeric material and the inductive loop. The wireless charging apparatus includes a controller. The controller is configured to determine a second shape or a second size for the inductive loop. The controller is configured to move or adjust the one or more actuators to form the inductive loop into a second shape or a second size.

Abstract: An electronics assembly comprising at least one circuit board substrate comprising a fluid inlet channel and a fluid outlet channel and at least one heat generating component coupled to the circuit board substrate. The at least one heat generating component is fluidly coupled to the fluid inlet channel and the fluid outlet channel. A heat exchanger is directly coupled to the circuit board substrate and comprises an inlet plenum fluidly coupled to the fluid outlet channel of the circuit board substrate and an outlet plenum fluidly coupled to the inlet channel of the circuit board substrate. A pump is fluidly coupled to the circuit board substrate and the heat exchanger.

Abstract: A system, computer readable medium, and a method for monitoring power module degradation in a vehicle are provided. The method includes determining a structure function of a power module, determining a change in the structure function based on a comparison between the structure function and an initial or baseline structure function associated with the power module, outputting a degradation determination result based on the change in the structure function, and generating an alert when the degradation determination result exceeds a predetermined or adaptively determined degradation criterion value.

Abstract: A heat exchanging system includes one or more heat exchanging portions, wherein each heat exchanging portion includes an optimized internal fin structure. The optimization of the optimized internal fin structure includes receiving existing heat exchanging system information, analyzing exterior fluid flow around the one or more heat exchanging portions as a heat flux analysis, determining boundary conditions of a heat flux distribution based on the heat flux analysis, receiving material properties of the one or more heat exchanging portions, and designing the optimized internal fin structure based on the existing heat exchanging system information, the boundary conditions of the heat flux distribution, and the material properties of the one or more heat exchanging portions.

Abstract: An electronics assembly includes a first cooling chip made of a semiconductor material, and at least one subassembly mounted on the first cooling chip. The first cooling chip includes at least one metallization layer on a portion of a first surface of the first cooling chip, at least one inlet through a second surface of the first cooling chip, wherein the second surface is opposite to the first surface, at least one outlet through the second surface of the first cooling chip, and one or more micro-channels extending between and fluidly coupled to the at least one inlet and the at least one outlet. The at least one subassembly includes one or more photonic cores positioned to receive light from a light source, wherein the one or more photonic cores comprise a wide band gap semiconductor material.

Abstract: Systems and methods of simulating a physical bond layer comprising a composite material and predicting one or more properties of the composite material are disclosed. A method includes obtaining one or more X-ray images of a bulk physical sample of a composite material, the one or more X-ray images including one or more visual identifiers that correspond to one or more materials present in the bulk physical sample, and generating a three dimensional image of the bulk physical sample from the one or more X-ray images. The three dimensional image includes one or more labels indicating the presence and location of the one or more materials. The method further includes creating a meshed three dimensional microstructure-based model from the three dimensional image and simulating a physical bond layer with the meshed three dimensional microstructure-based model. The meshed three dimensional microstructure-based model incorporates data obtained from the one or more labels.

Abstract: An electronics control system includes a power control unit disposed above a graphics processing unit and thermally connected to a cooling assembly inside. The system also includes a graphics processing unit disposed below the power control unit and thermally connected to the cooling assembly, an auxiliary DC-DC converter disposed below the power control unit and thermally connected to the cooling assembly, and a cooling assembly disposed at a predetermined location and configured to simultaneously transfer heat away from a power control unit, graphics processing unit, and auxiliary DC-DC converter via fluid circulation are presented.

Abstract: Methods, systems, and apparatus for an electric vehicle. The system includes a battery control unit configured to be in a grid-connected mode or a stand-alone mode. The system includes a shared boost converter connected to a battery. The shared boost converter receives alternating current (AC) power, steps up voltage and converts the AC power to direct current (DC) power when the battery control unit is in the grid-connected mode. The shared boost converter receives DC power from the battery and steps up voltage when the battery control unit is in the stand-alone mode. The system also includes an inverter configured to receive the stepped up DC power when the battery control unit is in the stand-alone mode and convert the DC power to AC power. The system also includes a motor/generator connected to the inverter and configured to receive AC power for powering a drivetrain of the electric vehicle.

Abstract: A system includes a vehicle having an electronic device, a sensor designed to detect sensor data corresponding to at least one property of the electronic device, an output device designed to output data, and a vehicle network access device designed to transmit the sensor data. The system also includes a machine learning server separate from the vehicle and having a machine learning processor designed to receive the sensor data, and generate, using a machine learning algorithm, a model of the electronic device. The machine learning processor is also designed to determine that a fault is likely to occur with the electronic device by conducting a T squared statistical analysis of the sensor data using the model, and generate a signal to be transmitted to the vehicle network access device when the fault is likely to occur and output information indicating that the fault is likely to occur.

Abstract: Embodiments described herein generally relate to an assembly including a manifold structure. The manifold structure includes a fluid inlet and a fluid outlet. The fluid inlet is for receiving a cooling fluid into the manifold structure and the fluid outlet is for removing the cooling fluid from the manifold structure. The manifold structure also includes a first cooling surface and an opposite second cooling surface. The first cooling surface includes a cooling chip inlet opening fluidly coupled to a cooling chip outlet opening. The fluid inlet is fluidly coupled to the cooling chip inlet opening. The second cooling surface includes a cavity. A first integrated fluid channel fluidly couples the cooling chip outlet opening to the cavity and a second integrated fluid channel fluidly couples the cavity to the fluid outlet. A cooling chip includes a plurality of microchannels, which fluidly couple the cooling chip to the first cooling surface.

Abstract: A power electronics assembly includes a cooling chip having a first subassembly and a second subassembly. The cooling chip includes a first metallization layer and a second metallization layer on a portion of a first surface of the cooling chip, an inlet through a second surface of the cooling chip opposite to the first surface, an outlet through the second surface, and one or more micro-channels extending between and fluidly coupled to the inlet and the outlet. The first subassembly includes a light source coupled to a first electrode and the first metallization layer, which provides a second electrode. The light source is configured to receive an electrical signal and operable to produce light in response to the electrical signal. The second subassembly includes one or more wide band gap semiconductor photonic cores acting as an electric switch positioned to receive the light produced by the light source.

Abstract: A multilayer composite bonding material with a plurality of thermal stress compensation layers is provided. The plurality of thermal stress compensation layers include a metal core layer, a pair of particle layers extending across the metal core layer such that the metal core layer is sandwiched between the pair of particle layers, and a pair of metal outer layers extending across the pair of particle layers such that the pair of particle layers are sandwiched between the pair of metal outer layers. A pair of low melting point (LMP) bonding layers extend across the pair of metal outer layers. The metal core layer, the pair of particle layers, and the pair of metal outer layers each have a melting point above a transient liquid phase (TLP) sintering temperature, and the pair of LMP bonding layers each have a melting point below the TLP sintering temperature.

Abstract: A multi-layer cooling structure comprising a first substrate layer comprising an array of cooling channels, a second substrate layer comprising a nozzle structure that includes one or more nozzles, an outlet, and an outlet manifold, a third substrate layer comprising an inlet manifold and an inlet, and one or more TSVs disposed through the first substrate layer, second substrate layer, and third substrate layer. At least one of the one or more TSVs is metallized. The first substrate layer and the second substrate layer are directly bonded, and the second substrate layer and the third substrate layer are directly bonded.

Abstract: A system includes an electronic device and a sensor to detect sensor data corresponding to the electronic device. The system also includes a machine learning processor that receives the sensor data and generates a model of the electronic device to determine a T squared threshold and a Q threshold using a machine learning algorithm. The machine learning processor also performs a T squared analysis of the electronic device by comparing a T squared value to the T squared threshold, and a Q analysis of the electronic device by comparing a Q value to the Q threshold. The machine learning processor also determines that the model is faulty when the T squared value is less than the T squared threshold and the Q value is greater than or equal to the Q threshold, and generates a new model or updates the model when the model is determined to be faulty.

Abstract: Embodiments described herein generally relate to an assembly including a manifold structure. The manifold structure includes a fluid inlet and a fluid outlet. The fluid inlet is for receiving a cooling fluid into the manifold structure and the fluid outlet is for removing the cooling fluid from the manifold structure. The manifold structure also includes a first cooling surface and an opposite second cooling surface. The first cooling surface includes a cooling chip inlet opening fluidly coupled to a cooling chip outlet opening. The fluid inlet is fluidly coupled to the cooling chip inlet opening. The second cooling surface includes a cavity. A first integrated fluid channel fluidly couples the cooling chip outlet opening to the cavity and a second integrated fluid channel fluidly couples the cavity to the fluid outlet. A cooling chip includes a plurality of microchannels, which fluidly couple the cooling chip to the first cooling surface.