Patents by Inventor Eric A. Hudson

Eric A. Hudson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11313242
    Abstract: Aspects of the disclosure are directed to a seal configured to interface with at least a first component and a second component of a gas turbine engine. A method for forming the seal includes obtaining an ingot of a fine grained, or a coarse grained, or a columnar grained or a single crystal material from a precipitation hardened nickel base superalloy containing at least 40% by volume of the precipitate of the form Ni3(Al, X), where X is a metallic or refractory element, and processing the ingot to generate a sheet of the material, where the sheet has a thickness within a range of 0.010 inches and 0.050 inches inclusive.
    Type: Grant
    Filed: September 18, 2019
    Date of Patent: April 26, 2022
    Assignee: Raytheon Technologies Corporation
    Inventors: Alan D. Cetel, Dilip N. Shah, Eric A. Hudson, Raymond Surace
  • Publication number: 20220028696
    Abstract: A method of forming a feature in a stack comprising a dielectric material on a substrate is provided. An etch plasma is generated from an etch gas, exposing the stack to the etch plasma and partially etching the feature in the stack. The stack is primed. A protective film is deposited on sidewalls of the feature by repeating for a plurality of cycles the steps of exposing the stack to a first reactant, allowing the first reactant to adsorb onto the stack, and exposing the stack to a second reactant, wherein the first and second reactants react with one another to form the protective film over the stack. The etching, priming, and depositing a protective film are repeated until the feature is etched to a final depth.
    Type: Application
    Filed: October 7, 2021
    Publication date: January 27, 2022
    Inventors: Eric HUDSON, Kalman PELHOS
  • Patent number: 11171011
    Abstract: A method of forming a feature in a stack comprising a dielectric material on a substrate is provided. An etch plasma is generated from an etch gas, exposing the stack to the etch plasma and partially etching the feature in the stack. The stack is primed. A protective film is deposited on sidewalls of the feature by repeating for a plurality of cycles the steps of exposing the stack to a first reactant, allowing the first reactant to adsorb onto the stack, and exposing the stack to a second reactant, wherein the first and second reactants react with one another to form the protective film over the stack. The etching, priming, and depositing a protective film are repeated until the feature is etched to a final depth.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: November 9, 2021
    Assignee: Lam Research Corporation
    Inventors: Eric Hudson, Kalman Pelhos
  • Patent number: 11014145
    Abstract: A core assembly for a casting system according to an exemplary aspect of the present disclosure includes, among other things, a core that includes a body and at least one hole formed through the body and a spacer that extends through the at least one hole. The spacer includes a stud portion and a chaplet portion configured to abut a surface of the body that circumscribes the at least one hole.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: May 25, 2021
    Assignee: RAYTHEON TECHNOLOGIES CORPORATION
    Inventors: Tracy A. Propheter-Hinckley, James T. Auxier, Eric A. Hudson
  • Publication number: 20210025919
    Abstract: An active noise isolation apparatus and method for cancelling vibration noise from the probe signal of a scanning tunneling microscope by generating a correction signal by convolution based on the probe signal and the sensor signal, which is based on the ambient vibration that adds noise to the probe signal.
    Type: Application
    Filed: January 24, 2019
    Publication date: January 28, 2021
    Inventors: Eric Hudson, Lavish Pabbi
  • Patent number: 10861708
    Abstract: Systems and methods for applying three or more states for achieving a high aspect ratio dielectric etch operation are described. In one of the methods, a middle state is introduced between a high state and a low state. The middle state is applied to both a source radio frequency (RF) generator and a bias radio frequency (RF) generator. During the middle state, RF power is maintained to be between a high amount of RF power associated with the high state and a low amount of RF power associated with the low state to achieve the high aspect ratio dielectric etch.
    Type: Grant
    Filed: November 21, 2019
    Date of Patent: December 8, 2020
    Assignee: Lam Research Corporation
    Inventors: Takumi Yanagawa, Nikhil Dole, Ranadeep Bhowmick, Eric Hudson, Felix Leib Kozakevich, John Holland, Alexei Marakhtanov, Bradford J. Lyndaker
  • Patent number: 10847374
    Abstract: A method for etching features in a stack below a carbon containing mask is provided. The stack is cooled to a temperature below ?20° C. An etch gas is provided comprising a free fluorine providing component, a hydrogen containing component, a hydrocarbon containing component, and a fluorocarbon containing component. A plasma is generated from the etch gas. A bias is provided with a magnitude of at least about 400 volts to accelerate ions from the plasma to the stack. Features are selectively etched in the stack with respect to the carbon containing mask.
    Type: Grant
    Filed: October 31, 2017
    Date of Patent: November 24, 2020
    Assignee: Lam Research Corporation
    Inventors: Leonid Belau, Eric Hudson, Francis Sloan Roberts
  • Patent number: 10847375
    Abstract: A method for selectively etching a dielectric layer with respect to an epitaxial layer or metal-based hardmask is provided. The method comprises performing a plurality of cycles. Each cycle comprises a deposition phase and an activation phase. The deposition phase comprises flowing a deposition gas, wherein the deposition gas comprises helium and a hydrofluorocarbon or fluorocarbon, forming the deposition gas into a plasma to effect a fluorinated polymer deposition, and stopping the flow of the deposition gas. The activation phase comprises flowing an activation gas comprising an ion bombardment gas, forming the activation gas into a plasma, providing an activation bias to cause ion bombardment of the fluorinated polymer deposition, wherein the ion bombardment activates fluorine from the fluorinated polymer deposition to etch the dielectric layer, and stopping the flow of the activation gas.
    Type: Grant
    Filed: June 26, 2018
    Date of Patent: November 24, 2020
    Assignee: Lam Research Corporation
    Inventors: Chia-Chun Wang, Eric Hudson, Andrew Clark Serino, Nerissa Draeger, Zhonghao Zhang
  • Patent number: 10815819
    Abstract: A variable area turbine arrangement according to an exemplary aspect of the present disclosure includes, among other things, a variable vane assembly and a secondary flow system associated with the variable vane assembly. Flow modulation of a cooling fluid through the secondary flow system is changed simultaneously with actuation of the variable vane assembly.
    Type: Grant
    Filed: October 16, 2018
    Date of Patent: October 27, 2020
    Assignee: Raytheon Technologies Corporation
    Inventors: Raymond Surace, Eric A. Hudson
  • Patent number: 10808551
    Abstract: An airfoil includes leading and trailing edges; first and second sides extending from the leading edge to the trailing edge, each side having an exterior surface; a core passage located between the first and second sides and the leading and trailing edges; and a wall structure located between the core passage and the exterior surface of the first side. The wall structure includes a plurality of cooling fluid inlets communicating with the core passage for receiving cooling fluid from the core passage, a plurality of cooling fluid outlets on the exterior surface of the first side for expelling cooling fluid and forming a cooling film along the exterior surface of the first side, and a plurality of cooling passages communicating with the plurality of cooling fluid inlets and the plurality of cooling fluid outlets. At least a portion of one cooling passage extends between adjacent cooling fluid outlets.
    Type: Grant
    Filed: April 29, 2019
    Date of Patent: October 20, 2020
    Assignee: United Technologies Corporation
    Inventors: Eric A. Hudson, Tracy A. Propheter-Hinckley, San Quach, Matthew A. Devore
  • Patent number: 10781716
    Abstract: A cooling scheme for a blade outer air seal includes a perimeter cooling arrangement configured to convectively cool a perimeter of the blade outer air seal, and a core cooling arrangement configured to cool a central portion of the blade outer air seal through impingement cooling and to provide film cooling to an inner diameter face of the blade outer air seal.
    Type: Grant
    Filed: January 21, 2019
    Date of Patent: September 22, 2020
    Assignee: United Technologies Corporation
    Inventors: Susan M. Tholen, Dominic J. Mongillo, Paul M. Lutjen, James N. Knapp, Virginia L. Ross, Jonathan J. Earl, Eric A. Hudson
  • Patent number: 10741367
    Abstract: A method of processing a substrate is provided. The method includes loading a substrate in a processing chamber. The substrate is supported on a bottom electrode and the processing chamber includes a top electrode opposing the bottom electrode. The method includes placing a plasma containment structure over a selected portion of the surface of the substrate to define a plasma containment region of the selected portion of the surface of the substrate. Then, injecting at least one process gas into the plasma containment region and biasing the top electrode and the bottom electrode. The method further includes exhausting process byproducts from the plasma containment region and moving the plasma containment region relative to the substrate to selectively passes over the entire surface of the substrate.
    Type: Grant
    Filed: November 3, 2015
    Date of Patent: August 11, 2020
    Assignee: Lam Research Corporation
    Inventor: Eric Hudson
  • Publication number: 20200243307
    Abstract: A plasma processing system includes a plasma chamber having a substrate support, and a multi-zone gas injection upper electrode disposed opposite the substrate support. An inner plasma region is defined between the upper electrode and the substrate support. The multi-zone gas injection upper electrode has a plurality of concentric gas injection zones. A confinement structure, which surrounds the inner plasma region, has an upper horizontal wall that interfaces with the outer electrode of the upper electrode. The confinement structure has a lower horizontal wall that interfaces with the substrate support, and includes a perforated confinement ring and a vertical wall that extends from the upper horizontal wall to the lower horizontal wall. The lower surface of the upper horizontal wall, an inner surface of the vertical wall, and an upper surface of the lower horizontal wall define a boundary of an outer plasma region, which surrounds the inner plasma region.
    Type: Application
    Filed: April 10, 2020
    Publication date: July 30, 2020
    Inventors: Ryan Bise, Rajinder Dhindsa, Alexei Marakhtanov, Lumin Li, Sang Ki Nam, Jim Rogers, Eric Hudson, Gerardo Delgadino, Andrew D. Bailey, III, Mike Kellogg, Anthony de la Llera, Darrell Ehrlich
  • Publication number: 20200227237
    Abstract: Embodiments for processing a substrate in a pulsed plasma chamber are provided. A processing apparatus with two chambers, separated by a plate fluidly connecting the chambers, includes a continuous wave (CW) controller, a pulse controller, and a system controller. The CW controller sets the voltage and the frequency for a first radio frequency (RF) power source coupled to a top electrode. The pulse controller is operable to set voltage, frequency, ON-period duration, and OFF-period duration for a pulsed RF signal generated by a second RF power source coupled to the bottom electrode. The system controller is operable to regulate the flow of species between the chambers to assist in the negative-ion etching, to neutralize excessive positive charge on the wafer surface during afterglow in the OFF-period, and to assist in the re-striking of the bottom plasma during the ON-period.
    Type: Application
    Filed: March 27, 2020
    Publication date: July 16, 2020
    Inventors: Alexei Marakhtanov, Rajinder Dhindsa, Eric Hudson, Andrew D. Bailey, III
  • Publication number: 20200194234
    Abstract: An apparatus for processing substrates is provided. A chamber comprises a chamber top and a chamber bottom, wherein the chamber bottom is detachably connected to the chamber top. At least one substrate support supports at least one substrate in the chamber. A substrate port allows a substrate to move into or out of the chamber. A seal creates a vacuum seal when the chamber top is on the chamber bottom. A manipulation system for manipulating an interior of the chamber when the chamber top is spaced apart from the chamber bottom comprises 1) a sealing wall for creating a seal between the chamber top and chamber bottom when the chamber top is spaced apart from the chamber bottom and 2) a manipulation port in the sealing wall, wherein the manipulation port allows a mechanical force to be provided through the sealing wall inside the chamber.
    Type: Application
    Filed: December 17, 2018
    Publication date: June 18, 2020
    Inventors: Leonid BELAU, Eric HUDSON, John HOLLAND
  • Patent number: 10662779
    Abstract: A gas turbine engine component includes a passage and a wall adjacent the passage. The wall includes a first side bordering the passage and a second side opposite the first side. The second side includes an array of cells. The wall also includes an array of channels. Each of the channels is located proximate a corresponding one of the cells. A coating is disposed over the cells. When the coating degrades the channels open to permit impingement air flow through the channel onto sidewalls of the cells.
    Type: Grant
    Filed: November 17, 2016
    Date of Patent: May 26, 2020
    Assignee: RAYTHEON TECHNOLOGIES CORPORATION
    Inventors: Eric A. Hudson, Tracy A. Propheter-Hinckley
  • Publication number: 20200141255
    Abstract: Aspects of the disclosure are directed to a seal configured to interface with at least a first component and a second component of a gas turbine engine. A method for forming the seal includes obtaining an ingot of a fine grained, or a coarse grained, or a columnar grained or a single crystal material from a precipitation hardened nickel base superalloy containing at least 40% by volume of the precipitate of the form Ni3(Al, X), where X is a metallic or refractory element, and processing the ingot to generate a sheet of the material, where the sheet has a thickness within a range of 0.010 inches and 0.050 inches inclusive.
    Type: Application
    Filed: September 18, 2019
    Publication date: May 7, 2020
    Inventors: Alan D. Cetel, Dilip N. Shah, Eric A. Hudson, Raymond Surace
  • Patent number: 10622195
    Abstract: A system and method of plasma processing includes a plasma processing system including a plasma chamber and a controller coupled to the plasma chamber. The plasma chamber including a substrate support and an upper electrode opposite the substrate support, the upper electrode having a plurality of concentric gas injection zones.
    Type: Grant
    Filed: April 3, 2012
    Date of Patent: April 14, 2020
    Assignee: Lam Research Corporation
    Inventors: Ryan Bise, Rajinder Dhindsa, Alexei Marakhtanov, Lumin Li, Sang Ki Nam, Jim Rogers, Eric Hudson, Gerardo Delgadino, Andrew D. Bailey, III, Mike Kellogg, Anthony Dela Llera, Darrell Ehrlich
  • Publication number: 20200105508
    Abstract: A wafer is supported on a wafer support structure such that a lower peripheral open region exists between a peripheral portion of a bottom surface of the wafer and an edge ring structure. The edge ring structure is configured to circumscribe both the wafer support structure and the wafer. A plasma is generated above a top surface of the wafer. The plasma causes accumulation of byproduct material within the lower peripheral open region. A byproduct volatizing gas is supplied to the lower peripheral open region to control the accumulation of the byproduct material within the lower peripheral open region during generation of the plasma. Use of the byproduct volatizing gas to control the accumulation of the byproduct material within the lower peripheral open region serves to prevent electrical arcing and particle contamination.
    Type: Application
    Filed: September 28, 2018
    Publication date: April 2, 2020
    Inventors: Leonid Belau, Alexei Marakhtanov, Eric Hudson, John Patrick Holland
  • Publication number: 20200090948
    Abstract: Systems and methods for applying three or more states for achieving a high aspect ratio dielectric etch operation are described. In one of the methods, a middle state is introduced between a high state and a low state. The middle state is applied to both a source radio frequency (RF) generator and a bias radio frequency (RF) generator. During the middle state, RF power is maintained to be between a high amount of RF power associated with the high state and a low amount of RF power associated with the low state to achieve the high aspect ratio dielectric etch.
    Type: Application
    Filed: November 21, 2019
    Publication date: March 19, 2020
    Inventors: Takumi Yanagawa, Nikhil Dole, Ranadeep Bhowmick, Eric Hudson, Felix Leib Kozakevich, John Holland, Alexei Marakhtanov, Bradford J. Lyndaker