Abstract: The present invention relates to compositions and methods for testing agents (e.g., Clostridium botulinum neurotoxin (BoNT) detection and analysis). In particular, the present invention relates to the use of Human induced pluripotent stem (hiPS) derived cells for agent detection and analysis.

Abstract: The present invention relates to compositions and methods for testing agents (e.g., Clostridium botulinum neurotoxin (BoNT) detection and analysis). In particular, the present invention relates to the use of Human induced pluripotent stem (hiPS) derived cells for agent detection and analysis.

Abstract: Differentiated cholinergic cells having motor neuron-like morphology and increased sensitivity to botulinum neurotoxin are provided herein. Methods of using such differentiated cells for detecting neurotoxin are also provided.

Abstract: Differentiated cholinergic cells having motor neuron-like morphology and increased sensitivity to botulinum neurotoxin are provided herein. Methods of using such differentiated cells for detecting neurotoxin are also provided.

Abstract: The invention provides a sensor for monitoring an environmental parameter in concrete comprising an enclosure for embedding in concrete; a detecting means connected to the enclosure for detecting at least one environmental parameter in concrete, the detecting means comprising at least one capacitive element for measuring capacitive change; an active material connected to the enclosure, the active material being liable to respond to the environmental parameter and the active material being operably connected to the capacitive element; a RFID chip mounted within the enclosure, the RFID chip being operably connected to the detecting means; and an antenna operably connected to the RFID chip, the antenna being operably connected to the detecting means, and the antenna being part of an L-R-C circuit whose resonance frequency shifts within an assigned frequency band. The invention also provides a MEMS-based capacitor that responds to an environmental parameter in concrete.

Abstract: The invention provides a humidity control system (HCS) to control indoor humidity within a specified range so as to reduce indoor house-dust mite allergen levels. The invention also provides a hydrogel absorber/desorber for reversibly absorbing water vapor from air releasing water vapor to air. The invention employs a reversible hydrogel desiccant as the active element for absorption and desorption of water, thus rendering the HCS more effective and energy-efficient than traditional humidification/dehumidification systems. The HCS of the invention treats indoor air by drawing fresh air in from outside and adjusting the humidity of the air-stream. In certain embodiments, fresh air is drawn in from the outside and mixed with recirculated air. The HCS uses a controller to introduce fresh air into the interior space and to control air circulation within it. Relative humidity is monitored remotely throughout the interior space using wired or wireless sensors.

Abstract: A system and method for collecting data on small-arms usage in the form of a device which is mounted to the firearm so as to be able to sense at least an impulse in the firearm due to firing. The device is mounted to the gun so as to detect impulses due to firing. A processor accepts impulse signals from the sensor, and uses either a hold-off delay or a windowing time to determine and store information related to the firing of the firearm. This information may be any combination of temperature, firing rate, firing intervals and time data for subsequent analysis, and, optionally, information identifying the weapon to which the device is attached. The device preferably has an interface to transfer data from the device to a computer or other data collection device.

Abstract: A winch assembly is disclosed that eliminates rope crushing, even when synthetic ropes are used. Tension is applied to the rope by at least one traction sheave so that the tension at the drum is reduced. By using multiple sheaves with large wrap angles traction can be applied to the rope over a much larger area, reducing shear stress and minimizing internal wear due to relative motion of rope components. The winch drum and at least one traction sheave are driven independently, preferably by AC induction motors using frequency control. The winch assembly may operate in conjunction with a hydraulic tensioner so that lower horsepower motors can be used to maintain constant tension in moving systems.

Abstract: A device for collecting data on small-arms usage that senses when a shot has been fired from a gun using its acceleration, acoustic noise or RF emissions; measures the interval between shots so that the firing rate may be determined; measures the time at which each shot has been fired; measures the temperature of the barrel when each shot is fired; stores any combination of temperature, firing rate, firing intervals and time data for subsequent analysis and has an electrical interface to transfer data from the device to a computer or other data collection device.

Abstract: The invention provides a sensor for monitoring an environmental parameter in concrete including an enclosure; a detecting device connected to the enclosure for a detecting at least one environmental parameter in concrete, wherein the detecting device includes at least one capacitive element; an active material connected to the enclosure, wherein the active material is liable to respond to the environmental parameter and is operably connected to the capacitive element; a RFID chip mounted within the enclosure and operably connected to the detecting device; and an antenna operably connected to the RFID chip and the detecting device, wherein the antenna is part of an L-R-C circuit whose resonance frequency shifts within an assigned frequency band. The invention also provides a MEMS-based capacitive element that responds to an environmental parameter in concrete. The invention further provides a method of forming a MEMS-based capacitive element.

Abstract: The invention provides an apparatus for measuring the magnetic field strength between the magnet arrays of an insertion device in an X-ray generating system comprising a magnetic field strength sensor that produces an output signal, three stages for positioning the sensor along the X, Y and Z axes of the insertion device, means for controlling positions of the stages and information storage means for reading the output signal operably connected to the sensor. The apparatus eliminates the need for a dedicated measurement facility by mounting guide means for the long (Z-)axis directly to the insertion device. This long-axis guide means can be permanently or temporarily mounted to the insertion device. The remainder of the measurement apparatus may then be transferred onto the long-axis guide means while measurements and, if necessary, adjustments are made. The apparatus is compact, allowing greater access to magnet arrays for adjustment than existing systems.

Abstract: A flexible chip carrier with contact pads on its upper surface matching those of the chip with said pads conductively connected to land grid array (LGA) pads on its lower surface matching the those of a card or PCB. The chip carrier is provided with a stiffening layer at the LGA interface. The stiffening layer is mechanically attached to the lower surface of the chip carrier. Holes are formed in the stiffening layer to expose the LGA pads. The holes are then filled with a conductive adhesive material. Compliant LGA bumps are applied to the uncured conductive adhesive material which material is then cured.

Abstract: A heat sink for free convection cooling in horizontal applications is provided. Specifically, the heat sink includes a plurality of spaced apart cooling fins, which are supported by an angled base. The cooling fins are transversely attached to the base and extend in a substantially vertical direction. In addition, the cooling fins extend beyond an outer edge of the base so that air can flow horizontally beneath the base and then vertically through the spaced apart cooling fins.

Abstract: A heat sink for free convection cooling in horizontal applications is provided. Specifically, the heat sink includes a plurality of spaced apart cooling fins, which are supported by an angled base. The cooling fins are transversely attached to the base and extend in a substantially vertical direction. In addition, the cooling fins extend beyond an outer edge of the base so that air can flow horizontally beneath the base and then vertically through the spaced apart cooling fins.

Abstract: A heat sink for free convection cooling in horizontal applications is provided. Specifically, the heat sink includes a plurality of spaced apart cooling fins, which are supported by an angled base. The cooling fins are transversely attached to the base and extend in a substantially vertical direction. In addition, the cooling fins extend beyond an outer edge of the base so that air can flow horizontally beneath the base and then vertically through the spaced apart cooling fins.

Abstract: Wire bond packages which mount encapsulated semiconductor chips, such as plastic ball grid array (PBGA) packages providing for the mounting of so-called flip-chips. The chips are overlaid with a heat spreading thermally-conductive cap of a mesh-like material which is interstitially the filled with an adhesive to prevent delamination caused by mismatches in the coefficients of thermal expansion, which result in contractions which cause the entire package arrangement to warp, leading to delamination between an encapsulant and cap and resulting in failure of connect joints and the ball grid arrays.

Abstract: A flexible chip carrier with contact pads on its upper surface matching those of the chip with said pads conductively connected to land grid array (LGA) pads on its lower surface matching the those of a card or PCB. The chip carrier is provided with a stiffening layer at the LGA interface. The stiffening layer is mechanically attached to the lower surface of the chip carrier. Holes are formed in the stiffening layer to expose the LGA pads. The holes are then filled with a conductive adhesive material. Compliant LGA bumps are applied to the uncured conductive adhesive material which material is then cured.

Abstract: Wire bond packages which mount encapsulated semiconductor chips, such as plastic ball grid array (PBGA) packages providing for the mounting of so-called flip-chips. The chips are overlaid with a heat spreading thermally-conductive cap of a mesh-like material which is interstitially the filled with an adhesive to prevent delamination caused by mismatches in the coefficients of thermal expansion, which result in contractions which cause the entire package arrangement to warp, leading to delamination between an encapsulant and cap and resulting in failure of connect joints and the ball grid arrays.

Abstract: A flexible chip carrier with contact pads on its upper surface matching those of the chip with said pads conductively connected to land grid array (LGA) pads on its lower surface matching the those of a card or PCB. The chip carrier is provided with a stiffening layer at the LGA interface. The stiffening layer is mechanically attached to the lower surface of the chip carrier. Holes are formed in the stiffening layer to expose the LGA pads. The holes are then filled with a conductive adhesive material. Compliant LGA bumps are applied to the uncured conductive adhesive material which material is then cured.

Abstract: A thermally conductive planar member is in thermally conductive communication with a flip chip encapsulated within a dielectric material that surrounds portions of the thermally conductive planar member, the flip-chip, and a predefined portion of a substrate member. The present invention provides a flip chip package having pick-and-place capability without the thermal resistance disadvantage of capped chip packages.