Abstract: A heat sink for free convection cooling in horizontal applications is provided. Specifically, the heat sink includes a plurality of spaced apart cooling fins, which are supported by an angled base. The cooling fins are transversely attached to the base and extend in a substantially vertical direction. In addition, the cooling fins extend beyond an outer edge of the base so that air can flow horizontally beneath the base and then vertically through the spaced apart cooling fins.

Abstract: Plastic ball grid array (PBGA) packages comprised of organic carriers on which are mounted and encapsulated semiconductor chips, providing for the mounting of so-called flip-chips. The chips are overlaid with a heat spreading thermally-conductive cap of a mesh-like material which is interstitially filled with an adhesive to prevent delamination caused by mismatches in the coefficients of thermal expansion, which result in contractions which cause the entire package arrangement to warp, leading to delamination between an encapsulant and cap and resulting in failure of connect joints and the ball grid arrays.

Abstract: A electronic package is constituted of a compliant multi-layered circuit board or printed circuit board package, particularly for use in ball grid array (BGA) applications wherein two or possibly greater numbers of naturally spaced sub-composites are equipped with electronic circuitry which is interconnected through the intermediary of conductive adhesives. Pursuant to a method of producing, no other mechanical connection is provided intermediate these spaced sub-composites except, possibly, along the periphery of the structure thereof, where a molded plastic seal may be provided in order to form a protection against the ingress environmental or external influences. The unfilled void, space or interspatial volume which is present between the spaced sub-composite facilitates the deformation in shear of the conductive adhesive interconnections, such as epoxy resins or the like, with extremely little constraint of the various components.

Abstract: A flexible chip carrier with contact pads on its upper surface matching those of the chip with said pads conductively connected to land grid array (LGA) pads on its lower surface matching the those of a card or PCB. The chip carrier is provided with a stiffening layer at the LGA interface. The stiffening layer is mechanically attached to the lower surface of the chip carrier. Holes are formed in the stiffening layer to expose the LGA pads. The holes are then filled with a conductive adhesive material. Compliant LGA bumps are applied to the uncured conductive adhesive material which material is then cured.

Abstract: A flip-chip module is interconnected to a PCB or circuit card through a peripheral LGA interposer connector. The flip-chip is mounted on the same surface of the module substrate as the peripheral array of LGA interconnection pads and projects into a central opening of the interposer. An opening in the upper stiffener of the PCB or circuit card permits the peripheral array of LGA interconnection pads to make contact with corresponding LGA PCB or circuit card pads. A first heat sink is arranged to thermally contact the entire surface of the substrate opposing the surface upon which the flip-chip is mounted. An opening in the PCB or circuit card and lower stiffener allows a second heat sink to make thermal contact with the surface of the flip-chip.

Abstract: An electronic package which has a thermally conductive member encapsulated with the semiconductor chip; and which is adapted for chip-scale or near-chip-scale applications of both wire-bond and flip-chip packages. For adhesively bonding the semiconductor chip to a circuitized carrier or substrate on which the chip is positioned, and to concurrently form an encapsulating structure protecting the semiconductor chip, there is provided a mold compound, such as a thermosetting plastic resin or epoxy to not only extend between the surface of the circuitized substrate or carrier facing the semiconductor chip, and possibly about the peripheral sides of the carrier, but to also at least extend over and encompass the peripheral edge portions of the opposite surface of the carrier or circuitized substrate distal to or facing away from the chip.

Abstract: A electronic package is constituted of a compliant multi-layered circuit board or printed circuit board package, particularly for use in ball grid array (BGA) applications wherein two or possibly greater numbers of naturally spaced sub-composites are equipped with electronic circuitry which is interconnected through the intermediary of conductive adhesives. Pursuant to a method of producing, no other mechanical connection is provided intermediate these spaced sub-composites except, possibly, along the periphery of the structure thereof, where a molded plastic seal may be provided in order to form a protection against the ingress environmental or external influences. The unfilled void, space or interspatial volume which is present between the spaced sub-composite facilitates the deformation in shear of the conductive adhesive interconnections, such as epoxy resins or the like, with extremely little constraint of the various components.

Abstract: An electronic package which has a thermally conductive member encapsulated with the semiconductor chip; and which is adapted for chip-scale or near-chip-scale applications of both wire-bond and flip-chip packages. For adhesively bonding the semiconductor chip to a circuitized carrier or substrate on which the chip is positioned, and to concurrently form an encapsulating structure protecting the semiconductor chip, there is provided a mold compound, such as a thermosetting plastic resin or epoxy to not only extend between the surface of the circuitized substrate or carrier facing the semiconductor chip, and possibly about the peripheral sides of the carrier, but to also at least extend over and encompass the peripheral edge portions of the opposite surface of the carrier or circuitized substrate distal to or facing away from the chip.

Abstract: Plastic ball grid array (PBGA) packages comprised of organic carriers on which are mounted and encapsulated semiconductor chips, providing for the mounting of so-called flip-chips. The chips are overlaid with a heat spreading thermally-conductive cap of a mesh-like material which is interstitially filled with an adhesive to prevent delamination caused by mismatches in the coefficients of thermal expansion, which result in contractions which cause the entire package arrangement to warp, leading to delamination between an encapsulant and cap and resulting in failure of connect joints and the ball grid arrays.

Abstract: A chip package includes a die having an active surface and an inactive surface. An adhesive is formed on the inactive surface where the adhesive has a low Young's modulus of elasticity. The low Young's modulus of elasticity may be 10,000 psi or less; 1,000 psi or less; or, preferably, about 1,000 psi. Further, the adhesive may include a thermal conducting material. A protective plate is coupled to the inactive surface using the adhesive and a chip carrier is coupled to the active surface of the die.

Abstract: An apparatus and method attaching a heatsink to a surface of an electronic package comprising a substrate, an integrated circuit chip attached to the surface of the substrate, an encapsulant encapsulating the integrated circuit chip and contacting at least a portion of the surface of the substrate, and an orifice formed in the top portion of the encapsulant to attach the heatsink to the surface of the electronic package. The heatsink may be attached and removed as desired to allow for package identification or rework.

Abstract: An apparatus and method attaching a heatsink to a surface of an electronic package comprising a substrate, an integrated circuit chip attached to the surface of the substrate, an encapsulant encapsulating the integrated circuit chip and contacting at least a portion of the surface of the substrate, and an orifice formed in the top portion of the encapsulant to attach the heatsink to the surface of the electronic package. The heatsink may be attached and removed as desired to allow for package identification or rework.

Abstract: An apparatus and method attaching a heatsink to a surface of an electronic package comprising a substrate, an integrated circuit chip attached to the surface of the substrate, an encapsulant encapsulating the integrated circuit chip and contacting at least a portion of the surface of the substrate, and an orifice formed in the top portion of the encapsulant to attach the heatsink to the surface of the electronic package. The heatsink may be attached and removed as desired to allow for package identification or rework.

Abstract: An electronic package is fabricated by providing a thin, circuitized substrate having electrical circuitry on a first surface; and then molding a dielectric body to the first surface of the substrate. The dielectric body contains an opening for exposing a portion of the surface of the thin circuitized substrate having at least a portion of the electrical circuitry. A semiconductor device is then positioned within the opening of the molded dielectric body and is electrically coupled to at least a portion of the electrical circuitry on the exposed portion of the surface of the thin circuitized substrate. Next, a plurality of electrical conductive members are secured to a surface of the thin circuitized substrate that is opposite the first surface.

Abstract: A thermally conductive planar member is in thermally conductive communication with a flip chip encapsulated within a dielectric material that surrounds portions of the thermally conductive planar member, the flip chip, and a predefined portion of a substrate member. The present invention provides a flip chip package having pick-and-place capability without the thermal resistance disadvantage of capped chip packages.

Abstract: An electronic package which includes a flexible substrate, stiffener and chip. The chip is bonded to the substrate, which was secured to the stiffener. Strain relief means are utilized at various locations in the package to prevent problems (e.g., tape "wrinkling") associated with relatively large differences in coefficients of thermal expansion between the package's various elements.

Abstract: An electronic package which includes a flexible substrate, stiffener and chip. The chip is bonded to the substrate, which was secured to the stiffener. Strain relief means are utilized at various locations in the package to prevent problems (e.g., tape "wrinkling") associated with relatively large differences in coefficients of thermal expansion between the package's various elements.

Abstract: A thermally conductive planar member is in thermally conductive communication with a flip chip encapsulated within a dielectric material that surrounds portions of the thermally conductive planar member, the flip-chip, and a predefined portion of a substrate member. The present invention provides a flip chip package having pick-and-place capability without the thermal resistance disadvantage of capped chip packages.