Abstract: This disclosure is directed to facilitating voice and video communication between users independent of a location or a device. A communication request can specify users, who may be identified and located in their respective environments. For example, users can be identified and located using facial recognition imaging techniques and/or by monitoring a radio frequency (RF) signal associated with a device that is carried or worn by a user. After determining a location of a user, individual devices can be configured as a functionally grouped device to allow the users to communicate. For example, capabilities of a television, microphone, speaker, and imaging device can be combined to allow a video communication between users. Further, as a user moves around his or her environment, the location of the user can be tracked and additional functionally grouped devices can be provided for seamless communication.

Abstract: Systems and techniques that facilitate hybrid readout packaging for quantum multichip bonding are provided. In various embodiments, an interposer can have a first quantum chip and a second quantum chip. In various aspects, a readout resonator (e.g., input/output port) of one or more qubits on the first quantum chip can be routed to an inner portion of the interposer. In various instances, the inner portion can be located between the first quantum chip and the second quantum chip. In various aspects, routing the readout resonator to the inner portion can reduce a number of crossings and/or intersections between input/output lines on the interposer and connection buses between qubits on the interposer.

Abstract: In an embodiment, a quantum device includes a first set of protrusions formed on a substrate and a second set of protrusions formed on a qubit chip. In the embodiment, the quantum device includes a set of bumps formed on an interposer, the set of bumps formed of a material having above a threshold ductility at a room temperature range, wherein a first subset of the set of bumps is configured to cold weld to the first set of protrusions and a second subset of the set of bumps is configured to cold weld to the second set of protrusions.

Abstract: Systems and techniques that facilitate hybrid readout packaging for quantum multichip bonding are provided. In various embodiments, an interposer can have a first quantum chip and a second quantum chip. In various aspects, a readout resonator (e.g., input/output port) of one or more qubits on the first quantum chip can be routed to an inner portion of the interposer. In various instances, the inner portion can be located between the first quantum chip and the second quantum chip. In various aspects, routing the readout resonator to the inner portion can reduce a number of crossings and/or intersections between input/output lines on the interposer and connection buses between qubits on the interposer.

Abstract: Object interference in biological samples generated by lateral shearing interference microscopes is addressed by a shearing microscope slide comprising a periodic structure having alternating reference and sample regions. In some embodiments, the reference regions are configured to provide references that remove sample overlap in a sheared microscopic measurement. A system for generating sheared microscopic measurements is also provided that comprises an inlet configured to receive a sample material, an outlet configured to release a portion of the sample material, and a periodic structure having a plurality of interleaved reference and sample channels. In some cases, the sample channels are configured to accommodate a flow of sample material from the inlet to the outlet and the reference channels are configured to provide references that remove sample overlap in a sheared microscopic measurement.

Abstract: System and method for monitoring of performance of a mirror array of a digital scanner with a use of light, illuminating the mirror array at grazing (off-axis) incidence, and an optical imaging system that includes a lateral shearing interferometer (operated in either static or a phase-shifting condition) during and without interrupting the process of exposure of the workpiece with the digital scanner, to either simply identify problematic pixels for further troubleshooting or measure the exact magnitude of the deformation of a mirror element of the mirror array.

Abstract: Systems and/or techniques associated with a sandwich-parallel micro-battery are provided. In one example, a device comprises a first battery and a second battery. The first battery comprises a first surface and a second surface. The second surface is smaller than the first surface. The second battery comprises a third surface and a fourth surface. The fourth surface is smaller than the third surface. Furthermore, the fourth surface is mechanically coupled to the second surface of the first battery. The third surface of the second battery and the first surface of the first battery comprise a conductive contact that electrically couples the first battery and the second battery.

Abstract: Devices and methods that can facilitate hybrid under-bump metallization components are provided. According to an embodiment, a device can comprise an under-bump metallization component that can comprise a superconducting interconnect component and a solder wetting component. The device can further comprise a solder bump that can be coupled to the superconducting interconnect component and the solder wetting component. In some embodiments, the superconducting interconnect component can comprise a hermetically sealed superconducting interconnect component.

Abstract: A gas chromatography instrument is provided that is capable of analyzing samples both quickly and accurately. The detector includes a first unit and a second unit that alternate between collection mode and desorption mode. This allows one unit to collect the sample, while the other unit desorbs another sample before the units switch operations. The alternating collection and desorption modes allows the detector to generate a data point approximately every thirty seconds, with each alternating unit.

Abstract: An apparatus comprises an electrochemical energy storage device, a non-conductive film at least partially covering the electrochemical energy storage device, and a nano-grain metallic film at least partially covering the non-conductive film. The electrochemical energy storage device may include a cathode electrode layer, an anode electrode layer, and a separator layer therebetween.

Abstract: A method of forming a thin film battery may include forming may include forming a trench in a substrate, depositing a stencil on top surface of the substrate, wherein the stencil is aligned with the trench, depositing a cathode layer in the trench, wherein the cathode layer is in direct contact with the stencil, and compressing the cathode layer into the trench to reduce a thickness of the cathode layer. The compressing the cathode layer into the trench may include applying isostatic pressure onto the cathode layer using a pressure head. The method may also include depositing an electrolyte layer on top of the cathode layer, depositing an anode layer on top of the electrolyte layer, and depositing an anode collector layer on top of the anode layer.

Abstract: Devices and methods that can facilitate hybrid under-bump metallization components are provided. According to an embodiment, a device can comprise an under-bump metallization component that can comprise a superconducting interconnect component and a solder wetting component. The device can further comprise a solder bump that can be coupled to the superconducting interconnect component and the solder wetting component. In some embodiments, the superconducting interconnect component can comprise a hermetically sealed superconducting interconnect component.

Abstract: Prediction of a distribution of light in an illumination pupil of an illumination system includes identifying component(s) of the illumination system the adjustment of which affects this distribution and simulating the distribution based on a point spread function defined in part by the identified components. The point spread function has functional relationship with configurable setting of the illumination settings.

Abstract: In an embodiment, a method for forming a solder bump includes preparing a transfer mold having a solder pillar extending from a mold substrate and through a first photoresist layer and having a shape partially defined by a second photoresist layer that is removed prior to transfer of the solder. In an embodiment, the mold substrate is flexible. In an embodiment, the transfer mold is flexible. In an embodiment, the method includes providing a device substrate having a wettable pad. In an embodiment, the method includes placing the transfer mold and the device substrate into aligned contact such that the solder pillar is in contact with the wettable pad. In an embodiment, the method includes forming a metallic bond between the solder pillar and the wettable pad. In an embodiment, the method includes removing the mold substrate and first photoresist layer.

Abstract: The invention relates to antisense molecules and methods for modulating splicing of polyomavirus T antigen pre-mRNA. In one aspect the invention relates to an antisense oligonucleotide 12 to 30, preferably 17, 18, 19 or 20 to 30 nucleobases in length which comprises a sequence that is the reverse complement of a contiguous stretch of at least 12 nucleobases of a polyomavirus T-antigen pre-mRNA and which antisense oligonucleotide can modulate splicing of said T-antigen pre-mRNA in a cell.

Abstract: In an embodiment, a method for forming a solder bump includes preparing a transfer mold having a solder pillar extending from a mold substrate and through a first photoresist layer and having a shape partially defined by a second photoresist layer that is removed prior to transfer of the solder. In an embodiment, the mold substrate is flexible. In an embodiment, the transfer mold is flexible. In an embodiment, the method includes providing a device substrate having a wettable pad. In an embodiment, the method includes placing the transfer mold and the device substrate into aligned contact such that the solder pillar is in contact with the wettable pad. In an embodiment, the method includes forming a metallic bond between the solder pillar and the wettable pad. In an embodiment, the method includes removing the mold substrate and first photoresist layer.

Abstract: System and method for profiling of a surface with lateral scanning interferometer the optical axis of which is perpendicular to the surface. In-plane scanning of the surface is carried out with increments that correspond to integer number of pixels of an employed optical detector. Determination of height profile of a region-of-interest that is incomparably larger than a FOV of the interferometer objective is performed in time reduced by at least an order of magnitude as compared to time required for the same determination by a vertical scanning interferometer.

Abstract: A thermalization structure is formed using a foil and a low temperature device (LTD). The foil includes a first layer of a first material. The LTD includes a surface from which heat is transferred away from the LTD. A coupling is formed between the foil and the surface of the LTD, where the coupling includes a bond formed between the foil and the surface such that forming the bond forms a set of ridges in the foil, a ridge in the set of ridges operating to dissipate the heat.

Abstract: A warehouse storage and retrieval system including an array of multilevel storage racks having at least one transfer deck, picking isles and storage areas disposed along picking isles, the storage areas being configured to hold differing loads, and a controller including a management module configured to variably size the storage areas of the array of multilevel storage rack modules and assign each of the variably sized storage areas to a corresponding one of the differing loads, wherein the storage and retrieval system is arranged to transport the differing loads for placement in the variably sized storage areas assigned by the controller.

Abstract: A processing machine (10) for building a part (11) includes: a support device (26) including a support surface (26B); a drive device (28) which moves the support device (26) so as a specific position on the support surface (26B) is moved along a moving direction (25); a powder supply device (18) which supplies a powder (12) to the moving support device (26) to form a powder layer (13); an irradiation device (22) which irradiates at least a portion of the powder layer (13) with an energy beam (22D) to form at least a portion of the part (11) from the powder layer (13) during a first period of time; and a measurement device (20) which measures at least portion of the part (11) during a second period of time. The first period in which the irradiation device (22) irradiates the powder layer (13) with the energy beam (22D) and the second period in which the measurement device (22) measures are overlapped.