Abstract: A desktop computing system having at least a central core surrounded by housing having a shape that defines a volume in which the central core resides is described. The housing includes a first opening and a second opening axially displaced from the first opening. The first opening having a size and shape in accordance with an amount of airflow used as a heat transfer medium for cooling internal components, the second opening defined by a lip that engages a portion of the airflow in such a way that at least some of the heat transferred to the air flow from the internal components is passed to the housing.

Abstract: An electronic device can include a housing that defines an internal volume. The electronic device can also include a component within the internal volume that divides the internal volume into a first volume and a second volume. The first volume and second volume can be fluidically isolated except at an aperture defined by the component. An air-moving system can produce a positive air pressure in the first volume and a negative air pressure in the second volume.

Abstract: This application relates to a layout of components within an electronic device. The electronic device includes a circuit board and one or more thermal components located on or proximate to each surface of the circuit board. As a result, thermal energy generated by components of the circuit board are drawn away from the circuit board in a more efficient manner. Additionally, the electronic device may include one or more air movers designed to draw ambient air into the electronic device in a manner that causes the ambient air to cool components upstream from the air movers. Further, the electronic device includes a fin stack that is thermally coupled to the aforementioned thermal components, and further receives air driven in by the air mover(s). Also, the electronic device is designed to receive the ambient air through openings that define a 360-degree air inlet.

Abstract: A desktop computing system having at least a central core surrounded by housing having a shape that defines a volume in which the central core resides is described. The housing includes a first opening and a second opening axially displaced from the first opening. The first opening having a size and shape in accordance with an amount of airflow used as a heat transfer medium for cooling internal components, the second opening defined by a lip that engages a portion of the airflow in such a way that at least some of the heat transferred to the air flow from the internal components is passed to the housing.

Abstract: A desktop computing system having at least a central core surrounded by housing having a shape that defines a volume in which the central core resides is described. The housing includes a first opening and a second opening axially displaced from the first opening. The first opening having a size and shape in accordance with an amount of airflow used as a heat transfer medium for cooling internal components, the second opening defined by a lip that engages a portion of the airflow in such a way that at least some of the heat transferred to the air flow from the internal components is passed to the housing.

Abstract: A desktop computing system having at least a central core surrounded by housing having a shape that defines a volume in which the central core resides is described. The housing includes a first opening and a second opening axially displaced from the first opening. The first opening having a size and shape in accordance with an amount of airflow used as a heat transfer medium for cooling internal components, the second opening defined by a lip that engages a portion of the airflow in such a way that at least some of the heat transferred to the air flow from the internal components is passed to the housing.

Abstract: An electronic device is disclosed. The electronic device includes a shield that provides thermal and electromagnetic interference (“EMI”) shielding benefits. The shield is secured with fan assemblies by airtight seals to prevent air leakage and promote a pressured volume when the fan assemblies are running. Further, the shield can direct airflow from the fan assemblies to one or more thermally conductive components, where the airflow can convectively cool the thermally conductive components and exit the electronic device. The shield is made from a metal, and when the shield covers a circuit board, the shield protects an EMI barrier for integrated circuits located on the circuit board. Moreover, the shield can provide a single-piece, monolithic body that provides advantages over multiple shields, such as eliminating gaps in the shield for air leakage and EMI intrusion, increasing air circulation efficiency, and decreasing costs.

Abstract: This application relates to modifications and enhancements to assemblies used with integrated circuits. In the described embodiments, multiple thermal components (e.g., vapor chambers, fin stacks, heat pipes) can be used to provide a dual-sided thermal energy extraction solution for a circuit board and an integrated circuit located on the circuit board. The thermal components can provide thermal energy dissipation capabilities for additional heat-generating components on the circuit board. Additionally, multiple plates can provide a compression force used to maintain contact between the integrated circuit and the circuit board, and in particular, between contact pads of the integrated circuit and pins, or springs, of a socket located on the circuit board.

Abstract: This application relates to a layout of components within an electronic device. The electronic device includes a circuit board and one or more thermal components located on or proximate to each surface of the circuit board. As a result, thermal energy generated by components of the circuit board are drawn away from the circuit board in a more efficient manner. Additionally, the electronic device may include one or more air movers designed to draw ambient air into the electronic device in a manner that causes the ambient air to cool components upstream from the air movers. Further, the electronic device includes a fin stack that is thermally coupled to the aforementioned thermal components, and further receives air driven in by the air mover(s). Also, the electronic device is designed to receive the ambient air through openings that define a 360-degree air inlet.

Abstract: Fan assemblies are disclosed. Fan assemblies include an impeller with asymmetric design. For example, an impeller may include a first set of blades with one geometry and second set of fan blades with another geometry. This enables a dual-inlet centrifugal fan to generate different air flow performance characteristics for the air entering one fan inlet compared to the air entering the other fan inlet. The impeller, with different fan blade configurations, can better handle air flow entering the fan assembly through different inlets, particularly when the air flow conditions differ through the inlets due to impeding structures (e.g., motor, struts, etc.). As a result, air flow distribution from air leaving the impeller, including the locations associated with the different fan blade configurations, is relatively uniform. Beneficially, when air flow distribution uniformity increases, the fan assembly operates more efficiently, as air flow pressure losses due to flow separation are mitigated.

Abstract: A desktop computing system having at least a central core surrounded by housing having a shape that defines a volume in which the central core resides is described. The housing includes a first opening and a second opening axially displaced from the first opening. The first opening having a size and shape in accordance with an amount of airflow used as a heat transfer medium for cooling internal components, the second opening defined by a lip that engages a portion of the airflow in such a way that at least some of the heat transferred to the air flow from the internal components is passed to the housing.

Abstract: Fan assemblies are disclosed. Fan assemblies include an impeller with asymmetric design. For example, an impeller may include a first set of blades with one geometry and second set of fan blades with another geometry. This enables a dual-inlet centrifugal fan to generate different air flow performance characteristics for the air entering one fan inlet compared to the air entering the other fan inlet. The impeller, with different fan blade configurations, can better handle air flow entering the fan assembly through different inlets, particularly when the air flow conditions differ through the inlets due to impeding structures (e.g., motor, struts, etc.). As a result, air flow distribution from air leaving the impeller, including the locations associated with the different fan blade configurations, is relatively uniform. Beneficially, when air flow distribution uniformity increases, the fan assembly operates more efficiently, as air flow pressure losses due to flow separation are mitigated.

Abstract: An electronic device can include a housing that defines an internal volume. The electronic device can also include a component within the internal volume that divides the internal volume into a first volume and a second volume. The first volume and second volume can be fluidically isolated except at an aperture defined by the component. An air-moving system can produce a positive air pressure in the first volume and a negative air pressure in the second volume.

Abstract: An electronic device can include a housing that defines an internal volume. The electronic device can also include a component within the internal volume that divides the internal volume into a first volume and a second volume. The first volume and second volume can be fluidically isolated except at an aperture defined by the component. An air-moving system can produce a positive air pressure in the first volume and a negative air pressure in the second volume.

Abstract: Systems and methods are provided for mitigating recirculation of backflow fluid through a fan. The fan includes a housing having a channel that extends from an inlet to an outlet of the housing. A rotor assembly is positioned within the channel and is configured to direct a fluid flow from the inlet to the outlet. The rotor assembly includes a hub, a plurality of fan blades, and a shroud disposed about a circumference of the fan blades, where a radial gap extends between the shroud and the housing. The radial gap is configured to receive a portion of the fluid flow from the outlet as backflow fluid. The rotor assembly also includes an inlet flange that is configured receive the backflow fluid from the radial gap and to direct the backflow fluid in a direction away from the inlet prior to discharge of the backflow fluid from the radial gap.

Abstract: A desktop computing system having at least a central core surrounded by housing having a shape that defines a volume in which the central core resides is described. The housing includes a first opening and a second opening axially displaced from the first opening. The first opening having a size and shape in accordance with an amount of airflow used as a heat transfer medium for cooling internal components, the second opening defined by a lip that engages a portion of the airflow in such a way that at least some of the heat transferred to the air flow from the internal components is passed to the housing.

Abstract: An electronic device includes an outer housing having an upper enclosure and a foot coupled thereto, a heat generating component, and a fan assembly integrated into the foot and situated proximate a bottom surface of the heat generating component. The foot can include inlet and outlet vents. The fan assembly can include an inlet, outlet, impeller with blades, shroud and fin stack. The electronic device can also include a heat pipe, a heat transfer stage, a PCB, and a bottom shield. Airflow through the electronic device can be directed across the fin stack, heat pipe, heat transfer stage, and bottom shield. Airflow can occur over a substantially level path through the electronic device from the inlet to outlet vents.

Abstract: A desktop computing system having at least a central core surrounded by housing having a shape that defines a volume in which the central core resides is described. The housing includes a first opening and a second opening axially displaced from the first opening. The first opening having a size and shape in accordance with an amount of airflow used as a heat transfer medium for cooling internal components, the second opening defined by a lip that engages a portion of the airflow in such a way that at least some of the heat transferred to the air flow from the internal components is passed to the housing.

Abstract: An electronic device is disclosed. The electronic device includes a shield that provides thermal and electromagnetic interference (“EMI”) shielding benefits. The shield is secured with fan assemblies by airtight seals to prevent air leakage and promote a pressured volume when the fan assemblies are running. Further, the shield can direct airflow from the fan assemblies to one or more thermally conductive components, where the airflow can convectively cool the thermally conductive components and exit the electronic device. The shield is made from a metal, and when the shield covers a circuit board, the shield protects an EMI barrier for integrated circuits located on the circuit board. Moreover, the shield can provide a single-piece, monolithic body that provides advantages over multiple shields, such as eliminating gaps in the shield for air leakage and EMI intrusion, increasing air circulation efficiency, and decreasing costs.

Abstract: An electronic device includes an outer housing having an upper enclosure and a foot coupled thereto, a heat generating component, and a fan assembly integrated into the foot and situated proximate a bottom surface of the heat generating component. The foot can include inlet and outlet vents. The fan assembly can include an inlet, outlet, impeller with blades, shroud and fin stack. The electronic device can also include a heat pipe, a heat transfer stage, a PCB, and a bottom shield. Airflow through the electronic device can be directed across the fin stack, heat pipe, heat transfer stage, and bottom shield. Airflow can occur over a substantially level path through the electronic device from the inlet to outlet vents.