Abstract: An electronic device can include a frame configured to receive and support an electronic component, a shell defining an internal volume sized to encompass the frame and the electronic component, the shell being slidably removable from the frame, the electronic component positioned within the internal volume and including an aperture, and a sealing member including a seal body and a compressible lip extending from the seal body, the sealing member at least partially surrounding the electronic component. The compressible lip is oriented such that the shell compresses the lip in a direction against the seal body at a first position adjacent to the electronic component and in the direction against the seal body at a second position adjacent to the electronic component opposite the first position.

Abstract: Computer modules that can have a high-capacity, can simplify the design of a computer system housing the modules, can utilize system resources in a highly configurable manner, can provide a variety of functionality, and can be readily inserted into, and removed from, a computer system.

Abstract: An electronic device can include a housing that defines an internal volume. The electronic device can also include a component within the internal volume that divides the internal volume into a first volume and a second volume. The first volume and second volume can be fluidically isolated except at an aperture defined by the component. An air-moving system can produce a positive air pressure in the first volume and a negative air pressure in the second volume.

Abstract: A desktop computing system having at least a central core surrounded by housing having a shape that defines a volume in which the central core resides is described. The housing includes a first opening and a second opening axially displaced from the first opening. The first opening having a size and shape in accordance with an amount of airflow used as a heat transfer medium for cooling internal components, the second opening defined by a lip that engages a portion of the airflow in such a way that at least some of the heat transferred to the air flow from the internal components is passed to the housing.

Abstract: An electronic device includes an outer housing having an upper enclosure and a foot coupled thereto, a heat generating component, and a fan assembly integrated into the foot and situated proximate a bottom surface of the heat generating component. The foot can include inlet and outlet vents. The fan assembly can include an inlet, outlet, impeller with blades, shroud and fin stack. The electronic device can also include a heat pipe, a heat transfer stage, a PCB, and a bottom shield. Airflow through the electronic device can be directed across the fin stack, heat pipe, heat transfer stage, and bottom shield. Airflow can occur over a substantially level path through the electronic device from the inlet to outlet vents.

Abstract: Systems and methods are provided for mitigating recirculation of backflow fluid through a fan. The fan includes a housing having a channel that extends from an inlet to an outlet of the housing. A rotor assembly is positioned within the channel and is configured to direct a fluid flow from the inlet to the outlet. The rotor assembly includes a hub, a plurality of fan blades, and a shroud disposed about a circumference of the fan blades, where a radial gap extends between the shroud and the housing. The radial gap is configured to receive a portion of the fluid flow from the outlet as backflow fluid. The rotor assembly also includes an inlet flange that is configured receive the backflow fluid from the radial gap and to direct the backflow fluid in a direction away from the inlet prior to discharge of the backflow fluid from the radial gap.

Abstract: An electronic device may be provided with a housing surrounding an interior portion of the electronic device. The housing may have one or more layers of material such as fabric layers, polymer layers, and metal layers. An outer fabric layer may have openings between adjacent strands of material such as openings between adjacent warp and weft strands. An inner housing layer such as a layer of plastic or metal may have openings that define airflow entrance and exit ports. The outer fabric layer may overlap the openings of the airflow entrance and exit ports. A fan may draw cooling air into the interior through the airflow entrance port and may expel air through the airflow exit port. An airflow controller in the interior may be controlled by control circuitry based on measurements from temperature sensors. The airflow controller may steer airflow to cool appropriate electronic components in the interior.

Abstract: A thermal management system that includes a fan assembly, a heat exchanger, and an insulating box is described. The fan assembly can have two impellers and a housing that includes two scroll portions. An internal portion of the scroll wall can be truncated. A motor housing can be connected to the fan housing via multiple struts. The struts can be oriented angularly with a tangential component and can slope inward to increase the effective inlet area. The heat exchanger can be formed of a fin stack that has a curved body that defines an airflow path that turns radially from the inlet to the exhaust. The heat exchanger can have an inlet that is smaller than the exhaust. The heat exchanger can be connected to one or more heat pipes. The insulating box can have a grid that directs air to certain specific directions.

Abstract: A desktop computing system having at least a central core surrounded by housing having a shape that defines a volume in which the central core resides is described. The housing includes a first opening and a second opening axially displaced from the first opening. The first opening having a size and shape in accordance with an amount of airflow used as a heat transfer medium for cooling internal components, the second opening defined by a lip that engages a portion of the airflow in such a way that at least some of the heat transferred to the air flow from the internal components is passed to the housing.

Abstract: A thermal management system that includes a fan assembly, a heat exchanger, and an insulating box is described. The fan assembly can have two impellers and a housing that includes two scroll portions. An internal portion of the scroll wall can be truncated. A motor housing can be connected to the fan housing via multiple struts. The struts can be oriented angularly with a tangential component and can slope inward to increase the effective inlet area. The heat exchanger can be formed of a fin stack that has a curved body that defines an airflow path that turns radially from the inlet to the exhaust. The heat exchanger can have an inlet that is smaller than the exhaust. The heat exchanger can be connected to one or more heat pipes. The insulating box can have a grid that directs air to certain specific directions.

Abstract: An electronic device includes an outer housing having an upper enclosure and a foot coupled thereto, a heat generating component, and a fan assembly integrated into the foot and situated proximate a bottom surface of the heat generating component. The foot can include inlet and outlet vents. The fan assembly can include an inlet, outlet, impeller with blades, shroud and fin stack. The electronic device can also include a heat pipe, a heat transfer stage, a PCB, and a bottom shield. Airflow through the electronic device can be directed across the fin stack, heat pipe, heat transfer stage, and bottom shield. Airflow can occur over a substantially level path through the electronic device from the inlet to outlet vents.

Abstract: An electronic device includes an outer housing having an upper enclosure and a foot coupled thereto, a heat generating component, and a fan assembly integrated into the foot and situated proximate a bottom surface of the heat generating component. The foot can include inlet and outlet vents. The fan assembly can include an inlet, outlet, impeller with blades, shroud and fin stack. The electronic device can also include a heat pipe, a heat transfer stage, a PCB, and a bottom shield. Airflow through the electronic device can be directed across the fin stack, heat pipe, heat transfer stage, and bottom shield. Airflow can occur over a substantially level path through the electronic device from the inlet to outlet vents.

Abstract: The present application describes various embodiments regarding systems and methods for providing efficient heat rejection for a lightweight and durable compact computing system having a small form factor. The compact computing system can take the form of a desktop computer. The desktop computer can include a monolithic top case having an integrated support system formed therein, the integrated support system providing structural support that distributes applied loads through the top case preventing warping and bowing. A mixed flow fan is utilized to efficiently pull cooling air through the compact computing system.

Abstract: An electronic device includes an outer housing having an upper enclosure and a foot coupled thereto, a heat generating component, and a fan assembly integrated into the foot and situated proximate a bottom surface of the heat generating component. The foot can include inlet and outlet vents. The fan assembly can include an inlet, outlet, impeller with blades, shroud and fin stack. The electronic device can also include a heat pipe, a heat transfer stage, a PCB, and a bottom shield. Airflow through the electronic device can be directed across the fin stack, heat pipe, heat transfer stage, and bottom shield. Airflow can occur over a substantially level path through the electronic device from the inlet to outlet vents.

Abstract: An electronic device such as a portable computer may be provided with a lower housing and an upper housing. The electronic device may include hinge structures which allow the upper housing to rotate about a rotational axis relative to the lower housing. The electronic device may include a ventilation port structure with intake openings that allow air to be drawn into the electronic device. The ventilation structure may also include exhaust openings that are used to expel air from the lower housing. When the electronic device is in an open position, it may be desirable for the ventilation structure to form more exhaust openings than when the electronic device is in a closed position. The ventilation structure may form lower exhaust openings when the electronic device is in the closed position and form upper and lower exhaust openings when the electronic device is in the open position.

Abstract: An electronic device such as a portable computer may be provided with a lower housing and an upper housing. The electronic device may include hinge structures which allow the upper housing to rotate about a rotational axis relative to the lower housing. The electronic device may include a ventilation port structure with intake openings that allow air to be drawn into the electronic device. The ventilation structure may also include exhaust openings that are used to expel air from the lower housing. When the electronic device is in an open position, it may be desirable for the ventilation structure to form more exhaust openings than when the electronic device is in a closed position. The ventilation structure may form lower exhaust openings when the electronic device is in the closed position and form upper and lower exhaust openings when the electronic device is in the open position.

Abstract: A desktop computing system having at least a central core surrounded by housing having a shape that defines a volume in which the central core resides is described. The housing includes a first opening and a second opening axially displaced from the first opening. The first opening having a size and shape in accordance with an amount of airflow used as a heat transfer medium for cooling internal components, the second opening defined by a lip that engages a portion of the airflow in such a way that at least some of the heat transferred to the air flow from the internal components is passed to the housing.

Abstract: A desktop computing system having at least a central core surrounded by housing having a shape that defines a volume in which the central core resides is described. The housing includes a first opening and a second opening axially displaced from the first opening. The first opening having a size and shape in accordance with an amount of airflow used as a heat transfer medium for cooling internal components, the second opening defined by a lip that engages a portion of the airflow in such a way that at least some of the heat transferred to the air flow from the internal components is passed to the housing.

Abstract: The present application describes various embodiments regarding systems and methods for providing efficient heat rejection for a lightweight and durable compact computing system having a small form factor. The compact computing system can take the form of a desktop computer. The desktop computer can include a monolithic top case having an integrated support system formed therein, the integrated support system providing structural support that distributes applied loads through the top case preventing warping and bowing. A mixed flow fan is utilized to efficiently pull cooling air through the compact computing system.

Abstract: A desktop computing system having at least a central core surrounded by housing having a shape that defines a volume in which the central core resides is described. The housing includes a first opening and a second opening axially displaced from the first opening. The first opening having a size and shape in accordance with an amount of airflow used as a heat transfer medium for cooling internal components, the second opening defined by a lip that engages a portion of the airflow in such a way that at least some of the heat transferred to the air flow from the internal components is passed to the housing.