Patents by Inventor Eric Yakobson

Eric Yakobson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ADHESION PROMOTION IN PRINTED CIRCUIT BOARDS
    Publication number: 20070227625
    Abstract: An adhesion promotion process and composition for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. The composition contains a corrosion inhibitor, an inorganic acid, and an alcohol which is effective to increase copper-loading in the composition.
    Type: Application
    Filed: June 7, 2007
    Publication date: October 4, 2007
    Applicant: ENTHONE, INC.
    Inventors: Abayomi Owei, Hiep Nguyen, Eric Yakobson
  • Capping of metal interconnects in integrated circuit electronic devices
    Patent number: 7268074
    Abstract: A multilayer metal cap over a metal-filled interconnect feature in a dielectric layer for incorporation into a multilayer integrated circuit device, and a method for forming the cap.
    Type: Grant
    Filed: June 14, 2004
    Date of Patent: September 11, 2007
    Assignee: Enthone, Inc.
    Inventors: Eric Yakobson, Richard Hurtubise, Christian Witt, Qingyun Chen
  • Adhesion promotion in printed circuit boards
    Patent number: 7232478
    Abstract: An adhesion promotion process and composition for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. The composition contains a corrosion inhibitor, an inorganic acid, and an alcohol which is effective to increase copper-loading in the composition.
    Type: Grant
    Filed: July 14, 2003
    Date of Patent: June 19, 2007
    Assignee: Enthone Inc.
    Inventors: Abayomi I. Owei, Hiep X. Nguyen, Eric Yakobson
  • Cobalt and nickel electroless plating in microelectronic devices
    Publication number: 20060083850
    Abstract: An electroless plating method and composition for depositing Co, Ni, or alloys thereof onto a metal-based substrate in manufacture of microelectronic devices, involving a source of deposition ions selected from the group consisting of Co ions and Ni ions, a reducing agent for reducing the depositions ions to metal onto the substrate, and a hydrazine-based leveling agent.
    Type: Application
    Filed: March 21, 2005
    Publication date: April 20, 2006
    Applicant: Enthone Inc.
    Inventors: Charles Valverde, Nicolai Petrov, Eric Yakobson, Qingyun Chen, Vincent Paneccasio, Richard Hurtubise, Christian Witt
  • Capping of metal interconnects in integrated circuit electronic devices
    Publication number: 20050275100
    Abstract: A multilayer metal cap over a metal-filled interconnect feature in a dielectric layer for incorporation into a multilayer integrated circuit device, and a method for forming the cap.
    Type: Application
    Filed: June 14, 2004
    Publication date: December 15, 2005
    Inventors: Eric Yakobson, Richard Hurtubise, Christian Witt, Qingyun Chen
  • Adhesion promotion in printed circuit boards
    Publication number: 20050011400
    Abstract: An adhesion promotion process and composition for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. The composition contains a corrosion inhibitor, an inorganic acid, and an alcohol which is effective to increase copper-loading in the composition.
    Type: Application
    Filed: July 14, 2003
    Publication date: January 20, 2005
    Inventors: Abayomi Owei, Hiep Nguyen, Eric Yakobson
  • Resist stripping process
    Patent number: 6440647
    Abstract: A process for removing patterned negative working resist from the surface of a substrate during manufacture of printed wiring boards is disclosed. The process includes the steps of contacting the patterned resist with a stripping solution containing an alkalinity source as well as a source of ammonium ions. The stripping solution is characterized in that it does not contain volatile organic compounds (VOCs).
    Type: Grant
    Filed: October 3, 2000
    Date of Patent: August 27, 2002
    Assignee: Alpha Metals, Inc.
    Inventor: Eric Yakobson
  • Cathodic photoresist stripping process
    Patent number: 6436276
    Abstract: A novel photoresist stripping process is disclosed. Specifically, it has been found that if a printed wiring board panel having photoresist on its surface is used as a cathode during electrolysis in an alkaline solution, the result is a rapid and complete photoresist removal with minimal sheeting of removed photoresist and no evidence of chemical attack upon metallic traces on the printed wiring board.
    Type: Grant
    Filed: October 6, 2000
    Date of Patent: August 20, 2002
    Assignee: Polyclad Laminates, Inc.
    Inventor: Eric Yakobson
  • Post-treatment for copper on printed circuit boards
    Patent number: 6294220
    Abstract: A post-treatment method for copper on printed circuit boards is disclosed. The method comprises forming a cupric-based organometallic conversion coating on a copper surface of a printed circuit board, and then converting the cupric-based organometallic conversion coating to a cuprous-based organometallic conversion coating. The resulting cuprous-based organometallic conversion coating is desirable in that it improves copper to dielectric bond integrity.
    Type: Grant
    Filed: June 30, 1999
    Date of Patent: September 25, 2001
    Assignee: Alpha Metals, Inc.
    Inventors: Peter T. McGrath, Abayomi Owei, Saeed Sardar, Eric Yakobson
  • Method for enhancing the solderability of a surface
    Patent number: 5935640
    Abstract: A process for enhancing the solderability of a surface through the use of immersion silver deposits is disclosed. In the preferred embodiment two immersion deposits are utilized in sequence. A composition for immersion silver plating is also disclosed.
    Type: Grant
    Filed: December 2, 1997
    Date of Patent: August 10, 1999
    Assignee: MacDermid, Incorporated
    Inventors: Donald Ferrier, Eric Yakobson
  • Process for preparing a non-conductive substrate for electroplating
    Patent number: 5759378
    Abstract: The modification of carbon particles is proposed to achieve enhanced plating upon a non-conductive surface which has been previously treated with said modified carbon particles. The invention is particularly useful in plating through holes of printed circuit boards.
    Type: Grant
    Filed: February 26, 1997
    Date of Patent: June 2, 1998
    Assignee: MacDermid, Incorporated
    Inventors: Donald Ferrier, Rosa Martinez, Eric Yakobson
  • Method for enhancing the solderability of a surface
    Patent number: 5733599
    Abstract: A process for enhancing the solderability of a surface through the use of immersion silver deposits is disclosed. In the preferred embodiment two immersion deposits are utilized in sequence. A composition for immersion silver plating is also disclosed.
    Type: Grant
    Filed: March 22, 1996
    Date of Patent: March 31, 1998
    Assignee: MACDermid, Incorporated
    Inventors: Donald Ferrier, Eric Yakobson
  • Process for preparing a non-conductive substrate for electroplating
    Patent number: 5632927
    Abstract: The modification of carbon particles is disclosed for achieving enhanced plating upon a non-conductive surface which has been previously treated with said modified carbon particles. The invention is particularly useful in plating through holes of printed circuit boards.
    Type: Grant
    Filed: February 21, 1996
    Date of Patent: May 27, 1997
    Assignee: MacDermid, Incorporated
    Inventors: Donald Ferrier, Rosa Martinez, Eric Yakobson
  • Process for preparing a non-conductive substrate for electroplating
    Patent number: 5536386
    Abstract: The modification of carbon particles is disclosed for achieving enhanced plating upon a non-conductive surface which has been previously treated with said modified carbon particles. The invention is particularly useful in plating through holes of printed circuit boards.
    Type: Grant
    Filed: February 10, 1995
    Date of Patent: July 16, 1996
    Assignee: MacDermid, Incorporated
    Inventors: Donald Ferrier, Rosa Martinez, Eric Yakobson
  • Composition and method for selective plating
    Patent number: 5518760
    Abstract: This invention proposes the addition of imidazole and imidazole derivatives to various activator solutions for the selective activation and plating of metallic surfaces. The invention is particularly useful in plating exposed copper surfaces on printed circuit boards without substantial extraneous plating on the solder mask surfaces.
    Type: Grant
    Filed: March 22, 1995
    Date of Patent: May 21, 1996
    Assignee: MacDermid, Incorporated
    Inventors: Donald Ferrier, Eric Yakobson
  • Composition and method for selective plating
    Patent number: 5468515
    Abstract: This invention proposes the addition of imidazole and imidazole derivatives to various activator solutions for the selective activation and plating of metallic surfaces. The invention is particularly useful in plating exposed copper surfaces on printed circuit boards without substantial extraneous plating on the solder mask surfaces.
    Type: Grant
    Filed: October 14, 1994
    Date of Patent: November 21, 1995
    Assignee: MacDermid, Incorporated
    Inventors: Donald Ferrier, Eric Yakobson