Patents by Inventor Evan G. Colgan
Evan G. Colgan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20180182686Abstract: A structure for cooling an integrated circuit. The structure may include; an interposer cold plate having at least two expanding channels, each expanding channel having a flow direction from a channel inlet to a channel outlet, the flow direction having different directions for at least two of the at least two expanding channels, the channel inlet having an inlet width and the channel outlet having an outlet width, wherein the inlet width is less than the outlet width.Type: ApplicationFiled: February 13, 2018Publication date: June 28, 2018Inventors: Thomas J. Brunschwiler, Timothy J. Chainer, Evan G. Colgan, Arvind Raj Mahankali Sridhar, Chin Lee Ong, Pritish R. Parida, Gerd Schlottig, Mark D. Schultz, Joel A. Silberman
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Patent number: 10006571Abstract: Conduit connectors for liquid manifolds and methods of fabrication are provided. In one embodiment, a conduit connector is integrated, at least in part, within a liquid manifold, and includes a conduit-receiving opening or socket and at least one releasable retention component. The conduit-receiving opening is disposed within the liquid manifold and in fluid communication with at least one liquid-carrying channel of the liquid manifold. The releasable retention component(s) is selectively operative to threadlessly secure in a fluid-tight manner a conduit within the conduit-receiving opening in fluid communication with the at least one liquid-carrying channel of the liquid manifold to facilitate flow of liquid through the liquid-carrying channel(s), or to release the conduit from the conduit-receiving opening of the conduit connector. The releasable retention component(s) resides at least partially within the liquid manifold when operatively holding the conduit within the conduit-receiving opening.Type: GrantFiled: August 27, 2014Date of Patent: June 26, 2018Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Thomas J. Brunschwiler, Evan G. Colgan, Michael J. Ellsworth, Jr., Gerd Schlottig
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Publication number: 20180149294Abstract: Conduit connectors for liquid manifolds and methods of fabrication are provided. In one embodiment, a conduit connector is recessed, at least in part, within a liquid manifold, and includes a conduit-receiving opening or socket and at least one releasable retention component. The conduit-receiving opening is disposed within the liquid manifold and in fluid communication with at least one liquid-carrying channel of the liquid manifold. The releasable retention component(s) is selectively operative to threadlessly secure in a fluid-tight manner a conduit within the conduit-receiving opening in fluid communication with the at least one liquid-carrying channel of the liquid manifold to facilitate flow of liquid through the liquid-carrying channel(s), or to release the conduit from the conduit-receiving opening of the conduit connector. The releasable retention component(s) resides at least partially within the liquid manifold when operatively holding the conduit within the conduit-receiving opening.Type: ApplicationFiled: January 25, 2018Publication date: May 31, 2018Inventors: Thomas J. BRUNSCHWILER, Evan G. COLGAN, Michael J. ELLSWORTH, JR., Gerd SCHLOTTIG
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Patent number: 9941788Abstract: A switching power supply in an integrated circuit, an integrated circuit comprising a switching power supply, and a method of assembling a switching power supply in an integrated circuit are disclosed. In one embodiment, the invention provides a three-dimensional switching power supply in an integrated circuit comprising a device layer. The switching power supply comprises three distinct strata arranged in series with the device layer, the three distinct strata including a switching layer including switching circuits, a capacitor layer including banks of capacitors, and an inductor layer including inductors. This switching power supply further comprises a multitude of connectors electrically and mechanically connecting together the device layer, the switching layer, the capacitor layer, and the inductor layer. The switching circuits, the capacitors and the inductors form a switching power supply for supplying power to the device layer.Type: GrantFiled: May 2, 2017Date of Patent: April 10, 2018Assignee: International Business Machines CorporationInventors: Paul S. Andry, Leland Chang, Evan G. Colgan, John U. Knickerbocker, Bucknell C. Webb, Robert Wisnieff
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Patent number: 9941189Abstract: A structure for cooling an integrated circuit. The structure may include; an interposer cold plate having at least two expanding channels, each expanding channel having a flow direction from a channel inlet to a channel outlet, the flow direction having different directions for at least two of the at least two expanding channels, the channel inlet having an inlet width and the channel outlet having an outlet width, wherein the inlet width is less than the outlet width.Type: GrantFiled: December 21, 2015Date of Patent: April 10, 2018Assignee: International Business Machines CorporationInventors: Thomas J. Brunschwiler, Timothy J. Chainer, Evan G. Colgan, Arvind Raj Mahankali Sridhar, Chin Lee Ong, Pritish R. Parida, Gerd Schlottig, Mark D. Schultz, Joel A. Silberman
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Patent number: 9941250Abstract: A package structure to implement two-phase cooling includes a chip stack disposed on a substrate, and a package lid that encloses the chip stack. The chip stack includes a plurality of conjoined chips, a central inlet manifold formed through a central region of the chip stack, and a peripheral outlet manifold. The central input manifold includes inlet nozzles to feed liquid coolant into flow cavities formed between adjacent conjoined chips. The peripheral outlet manifold outputs heated liquid and vapor from the flow cavities. The package lid includes a central coolant supply inlet aligned to the central inlet manifold, and a peripheral liquid-vapor outlet to output heated liquid and vapor that exits from the peripheral outlet manifold. Guiding walls may be included in the flow cavities to guide a flow of liquid and vapor, and the guiding walls can be arranged to form radial flow channels that are feed by different inlet nozzles of the central inlet manifold.Type: GrantFiled: January 11, 2017Date of Patent: April 10, 2018Assignee: International Business Machines CorporationInventors: Thomas J. Brunschwiler, Evan G. Colgan, John U. Knickerbocker, Bruno Michael, Chin Lee Ong, Cornelia K. Tsang
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Publication number: 20180061732Abstract: An integrated circuit (IC) chip module includes a carrier, a stiffening frame, an IC chip, and a first directional heat spreader. A second directional heat spreader may further be arranged orthogonal to the first directional heat spreader. The carrier has a top surface and a bottom surface configured to be electrically connected to a motherboard. The stiffening frame includes an opening that accepts the IC chip and may be attached to the top surface of the carrier. The IC chip is concentrically arranged within the opening of the stiffening frame. The first directional heat spreader is attached to the stiffening frame and to the IC chip and generally removes heat in a first opposing bivector direction. When included in the IC chip module, the second directional heat spreader is attached to the stiffening frame and to the first directional heat spreader and generally removes heat in a second opposing bivector direction orthogonal to the first opposing bivector direction.Type: ApplicationFiled: November 3, 2017Publication date: March 1, 2018Inventors: Evan G. Colgan, Yi Pan, Hilton T. Toy, Jeffrey A. Zitz
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Publication number: 20180061733Abstract: An integrated circuit (IC) chip module includes a carrier, a stiffening frame, an IC chip, and a first directional heat spreader. A second directional heat spreader may further be arranged orthogonal to the first directional heat spreader. The carrier has a top surface and a bottom surface configured to be electrically connected to a motherboard. The stiffening frame includes an opening that accepts the IC chip and may be attached to the top surface of the carrier. The IC chip is concentrically arranged within the opening of the stiffening frame. The first directional heat spreader is attached to the stiffening frame and to the IC chip and generally removes heat in a first opposing bivector direction. When included in the IC chip module, the second directional heat spreader is attached to the stiffening frame and to the first directional heat spreader and generally removes heat in a second opposing bivector direction orthogonal to the first opposing bivector direction.Type: ApplicationFiled: November 3, 2017Publication date: March 1, 2018Inventors: Evan G. Colgan, Yi Pan, Hilton T. Toy, Jeffrey A. Zitz
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Patent number: 9818054Abstract: A data readout device is provided and includes a reflective base, reflective sidewalls disposed about the reflective base and an actuation system. The actuation system is configured to modify relative positioning of one of the reflective base and the reflective sidewalls to either reflect incoming radiation back toward an origin thereof or to reflect the incoming radiation away from the origin thereof.Type: GrantFiled: January 16, 2017Date of Patent: November 14, 2017Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Evan G. Colgan, Fuad E. Doany, Li-Wen Hung, Reinaldo A. Vega, Bucknell C. Webb
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Publication number: 20170237344Abstract: A switching power supply in an integrated circuit, an integrated circuit comprising a switching power supply, and a method of assembling a switching power supply in an integrated circuit are disclosed. In one embodiment, the invention provides a three-dimensional switching power supply in an integrated circuit comprising a device layer. The switching power supply comprises three distinct strata arranged in series with the device layer, the three distinct strata including a switching layer including switching circuits, a capacitor layer including banks of capacitors, and an inductor layer including inductors. This switching power supply further comprises a multitude of connectors electrically and mechanically connecting together the device layer, the switching layer, the capacitor layer, and the inductor layer. The switching circuits, the capacitors and the inductors form a switching power supply for supplying power to the device layer.Type: ApplicationFiled: May 2, 2017Publication date: August 17, 2017Inventors: Paul S. Andry, Leland Chang, Evan G. Colgan, John U. Knickerbocker, Bucknell C. Webb, Robert Wisnieff
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Publication number: 20170179001Abstract: A structure for cooling an integrated circuit. The structure may include; an interposer cold plate having at least two expanding channels, each expanding channel having a flow direction from a channel inlet to a channel outlet, the flow direction having different directions for at least two of the at least two expanding channels, the channel inlet having an inlet width and the channel outlet having an outlet width, wherein the inlet width is less than the outlet width.Type: ApplicationFiled: December 21, 2015Publication date: June 22, 2017Inventors: Thomas J. Brunschwiler, Timothy J. Chainer, Evan G. Colgan, Arvind Raj Mahankali Sridhar, Chin Lee Ong, Pritish R. Parida, Gerd Schlottig, Mark D. Schultz, Joel A. Silberman
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Patent number: 9660525Abstract: A switching power supply in an integrated circuit, an integrated circuit comprising a switching power supply, and a method of assembling a switching power supply in an integrated circuit are disclosed. In one embodiment, the invention provides a three-dimensional switching power supply in an integrated circuit comprising a device layer. The switching power supply comprises three distinct strata arranged in series with the device layer, the three distinct strata including a switching layer including switching circuits, a capacitor layer including banks of capacitors, and an inductor layer including inductors. This switching power supply further comprises a multitude of connectors electrically and mechanically connecting together the device layer, the switching layer, the capacitor layer, and the inductor layer. The switching circuits, the capacitors and the inductors form a switching power supply for supplying power to the device layer.Type: GrantFiled: December 1, 2016Date of Patent: May 23, 2017Assignee: International Business Machines CorporationInventors: Paul S. Andry, Leland Chang, Evan G. Colgan, John U. Knickerbocker, Bucknell C. Webb, Robert Wisnieff
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Patent number: 9648782Abstract: A package structure to implement two-phase cooling includes a chip stack disposed on a substrate, and a package lid that encloses the chip stack. The chip stack includes a plurality of conjoined chips, a central inlet manifold formed through a central region of the chip stack, and a peripheral outlet manifold. The central input manifold includes inlet nozzles to feed liquid coolant into flow cavities formed between adjacent conjoined chips. The peripheral outlet manifold outputs heated liquid and vapor from the flow cavities. The package lid includes a central coolant supply inlet aligned to the central inlet manifold, and a peripheral liquid-vapor outlet to output heated liquid and vapor that exits from the peripheral outlet manifold. Guiding walls may be included in the flow cavities to guide a flow of liquid and vapor, and the guiding walls can be arranged to form radial flow channels that are feed by different inlet nozzles of the central inlet manifold.Type: GrantFiled: February 11, 2016Date of Patent: May 9, 2017Assignee: International Business Machines CorporationInventors: Thomas J. Brunschwiler, Evan G. Colgan, John U. Knickerbocker, Bruno Michael, Chin Lee Ong, Cornelia K. Tsang
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Publication number: 20170125388Abstract: A package structure to implement two-phase cooling includes a chip stack disposed on a substrate, and a package lid that encloses the chip stack. The chip stack includes a plurality of conjoined chips, a central inlet manifold formed through a central region of the chip stack, and a peripheral outlet manifold. The central input manifold includes inlet nozzles to feed liquid coolant into flow cavities formed between adjacent conjoined chips. The peripheral outlet manifold outputs heated liquid and vapor from the flow cavities. The package lid includes a central coolant supply inlet aligned to the central inlet manifold, and a peripheral liquid-vapor outlet to output heated liquid and vapor that exits from the peripheral outlet manifold. Guiding walls may be included in the flow cavities to guide a flow of liquid and vapor, and the guiding walls can be arranged to form radial flow channels that are feed by different inlet nozzles of the central inlet manifold.Type: ApplicationFiled: January 11, 2017Publication date: May 4, 2017Inventors: Thomas J. Brunschwiler, Evan G. Colgan, John U. Knickerbocker, Bruno Michael, Chin Lee Ong, Cornelia K. Tsang
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Publication number: 20170085173Abstract: A switching power supply in an integrated circuit, an integrated circuit comprising a switching power supply, and a method of assembling a switching power supply in an integrated circuit are disclosed. In one embodiment, the invention provides a three-dimensional switching power supply in an integrated circuit comprising a device layer. The switching power supply comprises three distinct strata arranged in series with the device layer, the three distinct strata including a switching layer including switching circuits, a capacitor layer including banks of capacitors, and an inductor layer including inductors. This switching power supply further comprises a multitude of connectors electrically and mechanically connecting together the device layer, the switching layer, the capacitor layer, and the inductor layer. The switching circuits, the capacitors and the inductors form a switching power supply for supplying power to the device layer.Type: ApplicationFiled: December 1, 2016Publication date: March 23, 2017Inventors: Paul S. Andry, Leland Chang, Evan G. Colgan, John U. Knickerbocker, Bucknell C. Webb, Robert Wisnieff
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Patent number: 9568960Abstract: A semiconductor structure includes a substrate with cooling layers, cooling channels, coolant inlets and outlets in fluid communication with the cooling channels, and a device layer on the cooling layers with one or more connection points and a device layer area. The device layer thermal coefficient of expansion is substantially equal to that of the cooling layers. A plurality of laminate substrates are disposed on, and electrically attached to, the device layer. The laminate substrate thermal coefficient of expansion differs from that of the device layer, each laminate substrate is smaller than the device layer portion to which it is attached, and each laminate substrate includes gaps between sides of adjacent laminate substrates. The laminate substrates are not electrically or mechanically connected to each other across the gaps therebetween and the laminate substrates are small enough to prevent warping of the device, interconnection and cooling layers due to thermal expansion.Type: GrantFiled: February 20, 2015Date of Patent: February 14, 2017Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Evan G. Colgan, Monty M. Denneau, John Knickerbocker
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Patent number: 9520779Abstract: A switching power supply in an integrated circuit, an integrated circuit comprising a switching power supply, and a method of assembling a switching power supply in an integrated circuit are disclosed. In one embodiment, the invention provides a three-dimensional switching power supply in an integrated circuit comprising a device layer. The switching power supply comprises three distinct strata arranged in series with the device layer, the three distinct strata including a switching layer including switching circuits, a capacitor layer including banks of capacitors, and an inductor layer including inductors. This switching power supply further comprises a multitude of connectors electrically and mechanically connecting together the device layer, the switching layer, the capacitor layer, and the inductor layer. The switching circuits, the capacitors and the inductors form a switching power supply for supplying power to the device layer.Type: GrantFiled: March 17, 2016Date of Patent: December 13, 2016Assignee: International Business Machines CorporationInventors: Paul S. Andry, Leland Chang, Evan G. Colgan, John U. Knickerbocker, Bucknell C. Webb, Robert Wisnieff
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Publication number: 20160358836Abstract: An integrated circuit (IC) chip module includes a carrier, a stiffening frame, an IC chip, and a first directional heat spreader. A second directional heat spreader may further be arranged orthogonal to the first directional heat spreader. The carrier has a top surface and a bottom surface configured to be electrically connected to a motherboard. The stiffening frame includes an opening that accepts the IC chip and may be attached to the top surface of the carrier. The IC chip is concentrically arranged within the opening of the stiffening frame. The first directional heat spreader is attached to the stiffening frame and to the IC chip and generally removes heat in a first opposing bivector direction. When included in the IC chip module, the second directional heat spreader is attached to the stiffening frame and to the first directional heat spreader and generally removes heat in a second opposing bivector direction orthogonal to the first opposing bivector direction.Type: ApplicationFiled: June 5, 2015Publication date: December 8, 2016Inventors: Evan G. Colgan, Yi Pan, Hilton T. Toy, Jeffrey A. Zitz
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Patent number: 9470439Abstract: Apparatuses and methods are provided for facilitating cooling of an electronic component. The apparatus includes a vapor-compression refrigeration system, which includes an expansion component, an evaporator, a compressor and a condenser coupled in fluid communication. The evaporator is coupled to and cools the electronic component. The apparatus further includes a contaminant separator coupled in fluid communication with the refrigerant flow path. The separator includes a refrigerant cold filter and a thermoelectric array. At least a portion of refrigerant passing through the refrigerant flow path passes through the cold filter, and the thermoelectric array provides cooling to the cold filter to cool refrigerant passing through the filter. By cooling refrigerant passing through the filter, contaminants solidify from the refrigerant, and are deposited in the cold filter.Type: GrantFiled: October 30, 2013Date of Patent: October 18, 2016Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Levi A. Campbell, Richard C. Chu, Evan G. Colgan, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons
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Patent number: 9437515Abstract: Embodiments of the invention comprise a homogeneous heat spreading cap element in chip packages to facilitate better heat spreading and dissipation. The heat spreading cap comprises a single high-K graphite layer supported by a copper frame for increased stability and reduced thermal warpage during handling and operation while minimizing thermal penalty by reducing the amount of material having a relatively low heat conductivity that is needed in conventional heat spreading caps.Type: GrantFiled: August 28, 2015Date of Patent: September 6, 2016Assignee: International Business Machines CorporationInventors: Evan G. Colgan, Taryn J. Davis, Chenzhou Lian, Yi Pan, Kamal K. Sikka, Jeffrey A. Zitz