Abstract: Disclosed are embodiments of a design and manufacturing system and an associated method that allow for design analysis and for insertion, during wafer manufacture, of intra-process monitoring circuitry. These embodiments use a library of pre-qualified intra-process monitoring circuits and a cross-correlation table that links different monitoring circuits with different IC chip components. Specifically, these embodiments analyze integrated circuit chip design data to identify the components designed into the chip. Then, one or more intra-process monitoring circuits are selected from the library and the design data is modified to include the selected monitoring circuit(s).

Abstract: Disclosed are embodiments of a system and a method that allow for wireless and dynamic intra-process (i.e., during and/or between process steps) measurements of integrated circuit parameters. The embodiments incorporate the use of a passive circuit, such as an inductor-capacitor-resistor (LCR) circuit resonator, that has a predetermined sensitivity to process variations in one or more physical or electrical integrated circuit parameters. The passive circuit can be wirelessly interrogated between and/or process steps. Then, the actual behavior exhibited by the passive circuit in response to the interrogation is compared to the expected behavior of an optimal circuit in the absence of process variations in order to determine the one or more parameters. Also disclosed is an embodiment of an exemplary passive circuit that can be used to implement the disclosed system and method embodiments.

Abstract: Disclosed are embodiments of a pixel imaging circuit that incorporates a standard photodiode. However, the imaging circuit is modified with a feedback loop to provide a first photo response over a first portion of the light sensing range (e.g., at higher light intensity range) and a second reduced-sensitivity photo response over a second portion of the light sensing range (i.e., at a lower light intensity range), thereby extending the circuits dynamic range of coverage. Also disclosed are embodiments of an associated imaging method and a design structure that is embodied in a machine readable medium and used in the imaging circuit design process.

Abstract: An interconnect structure, method of fabricating the interconnect structure and method of designing the interconnect structure for use in semiconductor devices. The interconnect structure includes a damascene metal wire having a pattern of dielectric filled holes.

Abstract: An interconnect structure, method of fabricating the interconnect structure and method of designing the interconnect structure for use in semiconductor devices. The interconnect structure includes a damascene metal wire having a pattern of dielectric filled holes.

Abstract: An interconnect structure for use in semiconductor devices which interconnects a plurality of dissimilar metal wiring layers, which are connected vias, by incorporating shaped voids in the metal layers. The invention also discloses a method by which such structures are constructed.

Abstract: A method for combining a refresh operation with a parity validation for a DRAM-based content addressable memory (CAM) is disclosed. In an exemplary embodiment of the invention, the method includes implementing the memory refresh operation and examining a word included within the CAM. A determination is made as to whether data contained within the word constitutes valid data. If the data contained within the word does not constitute valid data, then the parity validation is bypassed. However, if the data contained within the word does constitute valid data, then the parity validation is implemented. The parity validation further includes reading the data contained within the word, generating a parity bit from the data contained within the word, and comparing the generated parity bit with a previously stored parity bit. If the parity validation is implemented and if the generated parity bit does not match the previously stored parity bit, then the data contained within the word is invalidated.

Abstract: A method and structure for an array of content addressable memory (CAM) cells is disclosed. Each of the CAM cells has a search line and a bitline parallel to the search line. Across the array, search lines and bit lines of the CAM cells are interdigitated so that the search lines and bitlines alternate across the array. CAM cell macro's are inverted with respect to adjacent macros to balance parasitic capacitances across the array.

Abstract: A method and structure for an array of content addressable memory (CAM) cells is disclosed. Each of the CAM cells has a search line and a bitline parallel to the search line. Across the array, search lines and bit lines of the CAM cells are interdigitated so that the search lines and bitlines alternate across the array. CAM cell macro's are inverted with respect to adjacent macros to balance parasitic capacitances across the array.

Abstract: An interconnect structure for use in semiconductor devices which interconnects a plurality of dissimilar metal wiring layers, which are connected vias, by incorporating shaped voids in the metal layers. The invention also discloses a method by which such structures are constructed.

Abstract: A method for combining a refresh operation with a parity validation for a DRAM-based content addressable memory (CAM) is disclosed. In an exemplary embodiment of the invention, the method includes implementing the memory refresh operation and examining a word included within the CAM. A determination is made as to whether data contained within the word constitutes valid data. If the data contained within the word does not constitute valid data, then the parity validation is bypassed. However, if the data contained within the word does constitute valid data, then the parity validation is implemented. The parity validation further includes reading the data contained within the word, generating a parity bit from the data contained within the word, and comparing the generated parity bit with a previously stored parity bit. If the parity validation is implemented and if the generated parity bit does not match the previously stored parity bit, then the data contained within the word is invalidated.

Abstract: An interconnect structure for use in semiconductor devices which interconnects a plurality of dissimilar metal wiring layers, which are connected vias, by incorporating shaped voids in the metal layers. The invention also discloses a method by which such structures are constructed.