Abstract: Methods, systems, and devices for parallel drift cancellation are described. In some instances, during a first duration, a first voltage may be applied to a word line to threshold one or more memory cells included in a first subset of memory cells. During a second duration, a second voltage may be applied to the word line to write a first logic state to one or more memory cells included in the first subset and to threshold one or more memory cells included in a second subset of memory cells. During a third duration, a third voltage may be applied to the word line to write a second logic state to one or more memory cells included in the second subset of memory cells.

Abstract: The disclosed technology relates generally to integrated circuit devices, and in particular to cross-point memory arrays and methods for fabricating the same. In one aspect, a method of fabricating cross-point memory arrays comprises forming a memory cell material stack which includes a first active material and a second active material over the first active material, wherein one of the first and second active materials comprises a storage material and the other of the first and second active materials comprises a selector material.

Abstract: Methods, systems, and devices for dirty write on power off are described. In an example, the described techniques may include writing memory cells of a device according to one or more parameters (e.g., reset current amplitude), where each memory cell is associated with a storage element storing a value based on a material property associated with the storage element. Additionally, the described techniques may include identifying, after writing the memory cells, an indication of power down for the device and refreshing, before the power down of the device, a portion of the memory cells based on identifying the indication of the power down for the device. In some cases, refreshing includes modifying at least one of the one or more parameters for a write operation for the portion of the memory cells.

Abstract: Methods and systems include memory devices with a memory array comprising a plurality of memory cells. The memory devices include a control circuit operatively coupled to the memory array and configured to receive a read request for data and to apply a plurality of read voltages to the memory array based on the read request. The control circuit is further configured to perform a data analysis for a first set of data read based on the application of the plurality of read voltages and to derive a demarcation bias voltage (VDM) based on the data analysis. The control circuit is also configured to apply the VDM to the memory array to read a second set of data.

Abstract: Systems, methods and apparatus to determine a programming mode of a set of memory cells without having bit values stored in the memory cells to include an identifier of the programming mode. During the test of which of the memory cells in the set is in a lowest voltage region, which is a common operation for reading the memory cells programmed in different mode, the statistics of the memory cells found to be in the lowest voltage region can be compared to the known, different behaviors of the memory cell set programmed in different modes. A match with the behavior of one of the modes can be used to identify the matching mode as the programming mode of the set of memory cells.

Abstract: An example apparatus can include a memory array and control circuitry. The memory array can include a first portion including a first plurality of memory cells. The memory array can further include a second portion including a second plurality of memory cells. The control circuitry can be configured to designate the first portion as active responsive to a determination that the first portion passed a performance test. The control circuitry can be configured to designate the second portion as inactive responsive to a determination that the second portion failed the performance test.

Abstract: The present disclosure includes three dimensional memory arrays, and methods of processing the same. A number of embodiments include a plurality of conductive lines separated from one other by an insulation material, a plurality of conductive extensions arranged to extend substantially perpendicular to the plurality of conductive lines, and a storage element material formed around each respective one of the plurality of conductive extensions and having two different contacts with each respective one of the plurality of conductive lines, wherein the two different contacts with each respective one of the plurality of conductive lines are at two different ends of that respective conductive line.

Abstract: Methods, systems, and devices for a decoding architecture for memory devices are described. Word line plates of a memory array may each include a sheet of conductive material that includes a first portion extending in a first direction within a plane along with multiple fingers extending in a second direction within the plane. Two word line plates in a same plane may be activated via a shared electrode. Memory cells coupled with the two word line plates sharing the electrode, or a subset thereof, may represent a logical page for accessing memory cells. A memory cell may be accessed via a first voltage applied to a word line plate coupled with the memory cell and a second voltage applied to a pillar electrode coupled with the memory cell. Parallel or simultaneous access operations may be performed for two or more memory cells within a same page of memory cells.

Abstract: Methods, systems, and devices for decoding for a memory device are described. A decoder may include a first vertical n-type transistor and a second vertical n-type transistor that extends in a third direction relative to a die of a memory array. The first vertical n-type transistor may be configured to selectively couple an access line with a source node and the second n-type transistor may be configured to selectively couple the access line with a ground node. To activate the access line coupled with the first and second vertical n-type transistors, the first vertical n-type transistor may be activated, the second vertical n-type transistor may be deactivated, and the source node coupled with the first vertical n-type transistor may have a voltage applied that differs from a ground voltage.

Abstract: A semiconductor device includes first conductive lines extending in a first direction, second conductive lines extending in a second direction, memory cells disposed between the first conductive lines and the second conductive lines, each memory cell disposed at an intersection of a first conductive line and a second conductive line, and a passive material between the memory cells and at least one of the first conductive lines and the second conductive lines. Related semiconductor devices and electronic devices are disclosed.

Abstract: Methods, systems, and devices for techniques for forming self-aligned memory structures are described. Aspects include etching a layered assembly of materials including a first conductive material and a first sacrificial material to form a first set of channels along a first direction that creates a first set of sections. An insulative material may be deposited within each of the first set of channels and a second sacrificial material may be deposited onto the first set of sections and the insulating material. A second set of channels may be etched into the layered assembly of materials along a second direction that creates a second set of sections, where the second set of channels extend through the first and second sacrificial materials. Insulating material may be deposited in the second set of channels and the sacrificial materials removed leaving a cavity. A memory material may be deposited in the cavity.

Abstract: Methods, systems, and devices for self-selecting memory with horizontal access lines are described. A memory array may include first and second access lines extending in different directions. For example, a first access line may extend in a first direction, and a second access line may extend in a second direction. At each intersection, a plurality of memory cells may exist, and each plurality of memory cells may be in contact with a self-selecting material. Further, a dielectric material may be positioned between a first plurality of memory cells and a second plurality of memory cells in at least one direction. each cell group (e.g., a first and second plurality of memory cells) may be in contact with one of the first access lines and second access lines, respectively.

Abstract: Methods, systems, and devices for tapered memory cell profiles are described. A tapered profile memory cell may mitigate shorts in adjacent word lines, which may be leveraged for accurately reading a stored value of the memory cell. The memory device may include a self-selecting memory component with a bottom surface and a top surface opposite the bottom surface. In some cases, the self-selecting memory component may taper from the bottom surface to the top surface. In other examples, the self-selecting memory component may taper from the top surface to the bottom surface. The top surface of the self-selecting memory component may be coupled to a top electrode, and the bottom surface of the self-selecting memory component may be coupled to a bottom electrode.

Abstract: Methods, systems, and devices for dirty write on power off are described. In an example, the described techniques may include writing memory cells of a device according to one or more parameters (e.g., reset current amplitude), where each memory cell is associated with a storage element storing a value based on a material property associated with the storage element. Additionally, the described techniques may include identifying, after writing the memory cells, an indication of power down for the device and refreshing, before the power down of the device, a portion of the memory cells based on identifying the indication of the power down for the device. In some cases, refreshing includes modifying at least one of the one or more parameters for a write operation for the portion of the memory cells.

Abstract: Methods, systems, and devices for decoding for a memory device are described. A decoder of a memory device may include transistors in a first layer between a memory array and a second layer that includes one or more components associated with the memory array. The second layer may include CMOS pre-decoding circuitry, among other components. The decoder may include CMOS transistors in the first layer. The CMOS transistors may control which voltage source is coupled with an access line based on a gate voltage applied to a p-type transistor and a n-type transistor. For example, a first gate voltage applied to a p-type transistor may couple a source node with the access line and bias the access line to a source voltage. A second gate voltage applied to the n-type transistor may couple a ground node with the access line and bias the access line to a ground voltage.

Abstract: Methods, systems, and devices for memory arrays having graded memory stack resistances are described. An apparatus may include a first subset of memory stacks having a first resistance based on a physical and/or electrical distance of the first subset of memory stacks from at least one of a first driver component or a second driver component. The apparatus may include a second subset of memory stacks having a second resistance that is less than the first resistance based on a physical and/or electrical distance of the second subset of memory from at least one of the first driver component or the second driver component.

Abstract: An output, representing synaptic weights of a neural network can be received from first memory elements. The output can be compared to a known correct output. A random number can be generated with a tuned bias via second memory elements. The weights can be updated based on the random number and a difference between the output and the known correct output.

Abstract: Systems, methods and apparatus to determine a programming mode of a set of memory cells without having bit values stored in the memory cells to include an identifier of the programming mode. During the test of which of the memory cells in the set is in a lowest voltage region, which is a common operation for reading the memory cells programmed in different mode, the statistics of the memory cells found to be in the lowest voltage region can be compared to the known, different behaviors of the memory cell set programmed in different modes. A match with the behavior of one of the modes can be used to identify the matching mode as the programming mode of the set of memory cells.

Abstract: A semiconductor device includes first conductive lines extending in a first direction, second conductive lines extending in a second direction, memory cells disposed between the first conductive lines and the second conductive lines, each memory cell disposed at an intersection of a first conductive line and a second conductive line, and a passive material between the memory cells and at least one of the first conductive lines and the second conductive lines. Related semiconductor devices and electronic devices are disclosed.

Abstract: Disclosed herein is a memory cell including a memory element and a selector device. Data may be stored in both the memory element and selector device. The memory cell may be programmed by applying write pulses having different polarities and magnitudes. Different polarities of the write pulses may program different logic states into the selector device. Different magnitudes of the write pulses may program different logic states into the memory element. The memory cell may be read by read pulses all having the same polarity. The logic state of the memory cell may be detected by observing different threshold voltages when the read pulses are applied. The different threshold voltages may be responsive to the different polarities and magnitudes of the write pulses.