Patents by Inventor Ford Grigg

Ford Grigg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6107122
    Abstract: A semiconductor package and method for fabricating the package are provided. The package includes a housing having individual channels, each adapted to retain a semiconductor die in electrical communication with electrical connectors. The dice can include solder bumps, formed on electrodes, using electroless deposition and wave soldering. For fabricating the package, the dice can be inserted into the channels, with the electrical connectors on the housing proximate to the solder bumps on the dice. The solder bumps can then be reflowed to form bonded connections with the electrical connectors. In an alternate embodiment, conductive adhesive bumps, rather than solder bumps, are formed on the dice to provide compliant connections with the electrical connectors on the housing. In addition, the conductive adhesive bumps can be cured while in contact with the electrical connectors to form bonded connections.
    Type: Grant
    Filed: August 4, 1997
    Date of Patent: August 22, 2000
    Assignee: Micron Technology, Inc.
    Inventors: Alan G. Wood, Warren M. Farnworth, Ford Grigg, Salman Akram