Abstract: Embodiments of the invention include a method of singulating IC chips from a wafer. The method can include receiving the wafer having a substrate formed under active layers. The wafer includes a chip that includes a first portion of the active layers and a first portion of the substrate. A separation trench is formed by using an etch operation to remove a first segment of the active layers and a first segment of the substrate that are beneath a first separation channel of the wafer. The separation trench separates the first portion of the active layers from a remaining portion of the active layers; and separates the first portion of the substrate from a remaining portion of the substrate. The first IC chip is seperated from the wafer by removing a first section of the remaining portion of the substrate that is underneath the first portion of the substrate.

Abstract: Attach a smart chip to a carrier, and attach a memory chip to the carrier in communication with the smart chip. The memory chip has a larger footprint than the smart chip, overlies the smart chip, and is attached to the carrier by connections around the periphery of the smart chip. Removably attach an energy storage device (ESD) to the carrier and electrically connect the ESD to the carrier via a flex bridge.

Abstract: Methods of forming semiconductor packages include providing a lead frame having leads and no tie-bars. Tape is attached to the lead frame and one or more semiconductor die are coupled therewith. Electrical contacts of the die are interconnected with the leads using electrical connectors. An encapsulated assembly is formed by at least partially encapsulating the die and electrical connectors. The assembly is singulated to form a semiconductor package. The tape is detached from the package or encapsulated assembly. One or more die attach flags may be attached to the tape and the die may be attached thereto. Semiconductor packages formed using the methods include one or more semiconductor die at least partially encapsulated, pins exposed through the encapsulant, electrical connectors within the encapsulant and electrically interconnecting the pins with electrical contacts of the die, and no tie-bars coupling the die with the pins. Packages may also include die attach flags.

Abstract: The present invention relates to a system and method of assisting a paving vehicle e.g. an asphalt paver or the operator of such vehicle to improve a paving job performed by said vehicle. The steps performed comprises—receiving job data relating to the paving job, —receiving paving best practices data relating to any paving job, —processing the job data and the paving best practices data according to an algorithm and based thereon, generating feedback data for improving the paving job, —assisting said paving vehicle or said operator of said vehicle by making said generated feedback data available. Thereby, improved paving jobs can be performed.

Abstract: A tetherless system-in-package includes a first integrated circuit (IC) chip having interconnects and energy harvesting elements. A super-capacitor is configured to store a charge output by the energy harvesting elements. At least a second IC chipset including a smart chip and an optical I/O or an RF I/O is aligned and bonded to at least one of the interconnects of the first IC chip. The first IC chip and the second IC chip are configured to receive a portion of the charge stored by the super-capacitor.

Abstract: Methods of forming semiconductor packages include providing a lead frame having leads and no tie-bars. Tape is attached to the lead frame and one or more semiconductor die are coupled therewith. Electrical contacts of the die are interconnected with the leads using electrical connectors. An encapsulated assembly is formed by at least partially encapsulating the die and electrical connectors. The assembly is singulated to form a semiconductor package. The tape is detached from the package or encapsulated assembly. One or more die attach flags may be attached to the tape and the die may be attached thereto. Semiconductor packages formed using the methods include one or more semiconductor die at least partially encapsulated, pins exposed through the encapsulant, electrical connectors within the encapsulant and electrically interconnecting the pins with electrical contacts of the die, and no tie-bars coupling the die with the pins. Packages may also include die attach flags.

Abstract: Devices, computer-implemented methods, and systems that can facilitate radio frequency identification components are provided. According to an embodiment, a device can comprise a memory that can be coupled to an integrated circuit device that can have a processor and an accelerator component that can execute a cryptographic module. The device can further comprise a radio frequency identification device that can be coupled to the integrated circuit device that can communicate with a radio frequency identification reader device based on the cryptographic module.

Abstract: Systems and processes for operating an intelligent automated assistant are provided. In one example, a user request for a media item is received. Based on the user request, at least one media item and a description of the at least one media item are identified. A confidence level is obtained that an identified media item of the at least one media item corresponds to the requested media item. In accordance with a determination that the confidence level exceeds a first confidence threshold, a length of the identified description is reduced to obtain a modified description and the modified description of the identified media item is provided in a first spoken response.

Abstract: An interconnect for a semiconductor device includes: a carrier; a UV programmable chip mounted on the carrier using a first array of solder connections; a UV light source mounted on the carrier using a second array of solder connections, the UV light source being in optical communication with the UV programmable chip; and a plurality of transmission lines extending on or through the carrier and providing electrical communication between the UV programmable chip and the UV light source.

Abstract: A hard mask and a method of creating thereof are provided. A first layer is deposited that is configured to provide at least one of a chemical and a mechanical adhesion to a layer immediately below it. A second layer is deposited having an etch selectivity that is faster than the first layer. A third layer is deposited having an etch selectivity that is slower than the first and second layers. The third layer has a composite strength that is higher than the first and second layers. A photoresist layer is deposited on top of the third layer and chemically removed above an inner opening. The third layer and part of the second layer are anisotropically etched through the inner opening. The second layer and the first layer are isotropically etched to create overhang regions of the third layer.

Abstract: A silicon chip carrier includes at least two of a photosensitive P-I-N diode, a non-photosensitive P-I-N diode, a photosensitive P-(metal)-N diode, a non-photosensitive P-(metal)-N diode, and a Schottky diode all integrally formed in the same layers of the chip carrier. In some embodiments, diodes formed in the chip carrier provide photovoltaic power and power regulation to a circuit mounted on the chip carrier.

Abstract: Attach a smart chip to a carrier, and attach a memory chip to the carrier in communication with the smart chip. The memory chip has a larger footprint than the smart chip, overlies the smart chip, and is attached to the carrier by connections around the periphery of the smart chip. Removably attach an energy storage device (ESD) to the carrier and electrically connect the ESD to the carrier via a flex bridge.

Abstract: A silicon chip carrier includes at least two of a photosensitive P-I-N diode, a non-photosensitive P-I-N diode, a photosensitive P-(metal)-N diode, a non-photosensitive P-(metal)-N diode, and a Schottky diode all integrally formed in the same layers of the chip carrier. In some embodiments, diodes formed in the chip carrier provide photovoltaic power and power regulation to a circuit mounted on the chip carrier.

Abstract: An energy storage device for an integrated circuit carrier package. One or more energy storage elements have contact elements arranged thereon that include an anode, a cathode, and an isolated common pad. The energy storage element is configured for arrangement in a stack of energy storage elements in which the isolated common pad is shorted to one of the anode or the cathode by bonded conductive interconnects.

Abstract: An energy storage device for an integrated circuit carrier package. One or more energy storage elements have contact elements arranged thereon that include an anode, a cathode, and an isolated common pad. The energy storage element is configured for arrangement in a stack of energy storage elements in which the isolated common pad is shorted to one of the anode or the cathode by bonded conductive interconnects.

Abstract: A tetherless system-in-package includes a first integrated circuit (IC) chip having interconnects and energy harvesting elements. A super-capacitor is configured to store a charge output by the energy harvesting elements. At least a second IC chipset including a smart chip and an optical I/O or an RF I/O is aligned and bonded to at least one of the interconnects of the first IC chip. The first IC chip and the second IC chip are configured to receive a portion of the charge stored by the super-capacitor.

Abstract: A solid state electrochemical battery fabrication device and a method of creating the solid state electrochemical battery are provided. There is a first chamber comprising a first magnetron and a second chamber comprising a second magnetron, coupled to the first chamber. There is a third chamber comprising a vapor source for a polymer deposition, coupled to the second chamber. A Knudsen cell is coupled to the third chamber and configured to deposit lithium on a battery being fabricated. A linear hollow shaft connects the first, second, and third chambers, and provides a hermetic seal. A first telescopic arm having a housing is coupled to a first end of the hollow shaft and configured to extend out of its housing from the first chamber to the second chamber.

Abstract: Programmable devices and methods for fabricating the programmable devices are described. In an example, a method for fabricating a programmable device can include bonding a UV light source to a computer chip by flip-chip mounting the UV light source to the computer chip. The UV light source can be configured to emit UV light towards a UV erasable area of the computer chip to perform UV erasing on the computer chip. The method can further include bonding a carrier to the computer chip by flip chip mounting the computer chip to the carrier using a second array of bond pads.

Abstract: Devices, computer-readable media, and methods for allocating a source specific multicast internet protocol address to a streaming media content are disclosed. For example, a processor of a device may receive a streaming media content, allocate a source specific multicast internet protocol address to the streaming media content for a base station of a cellular network, allocate a first broadcast channel of the base station to the streaming media content, and associate the first broadcast channel with the source specific multicast internet protocol address. The processor may further generate a manifest file, the manifest file including an identification of the streaming media content and the source specific multicast internet protocol address, transmit the manifest file via a second broadcast channel of the base station, and transmit the streaming media content via the first broadcast channel of the base station.

Abstract: The present invention provides a method for post-emergence selective weed control in turf sites by applying an herbicidal composition comprising sulfentrazone and quinclorac to a locus where weeds are present.