Abstract: Embodiments introduce redundant optical channels to significantly extend the lifetime of parallel optical transceivers. A plurality of transmitters, N, transmit on a plurality of optical channels, where N is an integer number of optical channels greater than 1. One or more redundant channels, M, are also provided. N+M multiple input shift registers provide multiple paths for signals from each of the transmitters to connect to N+M laser diodes. In the event up to M of the N+M laser diodes fail, the multiple input shift registers connect the N transmitters to functioning ones of the N+M laser diodes thus extending the life of the device. A corresponding scheme is also described for the receiver side.

Abstract: A storage controller that operates under elevated temperature conditions includes a memory, a memory controller, and a CPU that detects a temperature of the memory controller has exceeded a threshold while operating at a first frequency and responsively places the memory into self-refresh mode, reduces the memory controller frequency to a second frequency, and then takes the memory out of self-refresh mode. The clock frequency of a bus bridge or communications link circuit may also be reduced when their temperatures exceed a threshold. The bus bridge may deny access to requestors of access to the memory while the frequency is being reduced. Message transfers on a communications link between redundant storage controllers in a system may be suspended while the link frequency is being reduced. Finally, the system may fail over to one controller while the other controller reduces the frequencies and then fail back.

Abstract: A woven construction belt is fabricated by a method to manufacture said belt and, said belt has a surface, at least one warp, at least two wefts, at least two locking wefts and a binding layer. The method has a preparing step, a weaving step, a dipping step and a fixing step. In The preparing step, warp fibers, at least two wefts and at least two locking wefts are made from tempered fibers. In the weaving step, the wefts are first woven transversely through the warp fibers, the locking wefts are subsequently woven through the warp fibers and the wefts to form a woven belt. In the dipping step, the woven belt is dipped into a macerate tank to apply binding material to the woven belt. In the fixing step, the binding material on the woven belt is cured to form a binding layer and complete the woven construction belt.

Abstract: The invention provided a heatsink thermal module with noise improvement, which has a heatsink thermal module additionally consisting of a heat pipe, a heatsink fins set and a fan module; the fan module is combined with the heatsink fins set which consists of multiple heatsink fins with different lengths and is combined to the fan module with its end with a special geometric shape having the function of lowering the wind drag; by lowering the wind drag, not only the heat dissipation efficiency can be increased, but the noise caused by the heatsink thermal module can also be improved.

Abstract: A fastening structure for securing a heatsink module is provided. The structure includes at least a first fastening piece attached to the circuit board and having a first fastening member, a heat spreader having its attached side connected to the heatsink module, hence able to swing vertically, and a pair of first positioning members protrudingly provided on the thermal spread; a second fastening piece having a second fastening member to connect to the first fastening member and a fulcrum to suppress the heat spreader, the second fastening piece having suitable elasticity for the second fastening member to swing vertically and axially around the fulcrum; and a suppressing member having a pair of second positioning members to engage the first positioning members and having a portion press against the top of fulcrum to ensure the state of engagement between the first fastening piece and the second fastening piece.

Abstract: A heat dissipation module including a housing, a fan module, a cooling fin set, and a heat pipe is provided. The housing has a fan accommodation area, a first heat dissipation area, a second heat dissipation area, and a heat conducting area. The fan module is disposed in the fan accommodation area, and the cooling fin set is disposed in the first heat dissipation area. The heat pipe has a heat absorbing portion, a curved portion, and a heat dissipation portion, and the curved portion connects the heat absorbing portion and the heat dissipation portion. The curved portion is in thermal contact with the second dissipation area, and the heat dissipation portion is in thermal contact with the cooling fin set. Thus, the efficiency of heat dissipation of the heat pipe is improved.

Abstract: A heat-dissipation device having a dust-disposal mechanism for removing dust from cooling metallic fins is provided, which includes a heat-conducting module and a dust-disposal mechanism. The heat-conducting module has a plurality of metallic fins arranged in the same direction and apart with a gap formed therebetween. The dust-disposal mechanism has a cleaning unit corresponding to the metallic fins so as to insert into the gap between the metallic fins and clear or absorb the dust accumulated on the metallic fins, thereby enhancing the cooling efficiency of the heat-conducting module.

Abstract: A heat-dissipation apparatus for a hard disk is provided, which is adapted for being configured on a hard disk or in a hard disk slot, and includes a heat-conducting layer and at least one heat-conducting pad disposed on a surface of the heat-conducting layer corresponding to the hard disk. The heat-conducting pad contacts the hard disk and the waste heat is conducted from the hard-disk to the heat-conducting layer through the heat-conducting pad, and then transferred outside the hard disk or the hard disk slot through the heat-conducting layer. Therefore, the operating temperature of the hard disk in high speed operation is lowered and the service life of the hard disk is prolonged.

Abstract: A heat-dissipation device with dust-disposal function for removing dust from cooling metallic fins is provided, which includes a heat-conducting module and a vibrator. The heat-conducting module has a plurality of metallic fins, and the vibrator is directly or indirectly connected to the heat-conducting module to provide a vibrating source for the metallic fins, such that the dust accumulated on the metallic fins is shook off by vibration. The vibrator may be a piezoelectricity element or an eccentric motor. In addition, the vibrator may be an ultrasonic generator disposed near the heat-conducting module to provide a non-contact vibrating source for the metallic fins.

Abstract: The present invention provides for a data storage system having a number of virtual storage devices. Each of the virtual storage devices may include a number of physical storage devices. The physical storage devices need not be separately addressable by a host system. Each virtual storage device unit may comprise a field replaceable unit encompassing no more than a single virtual storage device. Physical storage devices included in a virtual storage device that are not in active use may be powered down, even while one or more other physical devices included in that virtual storage device are powered up.

Abstract: A motor overcurrent protection device connectable to a motor. The motor has a rotary shaft and a controlling port. The motor overcurrent protection device includes a sensing unit, a driving unit and a controlling unit. The sensing unit includes a magnetic block arranged on a circumference of the rotary shaft and a Hall device positioned beside the rotary shaft. The magnetic block is rotatable along with the rotary shaft to be instantaneously aligned with the Hall device. The driving unit is electrically connected with the controlling port of the motor. The controlling unit is electrically connected with the sensing unit and the driving unit. When the motor operates, each time the magnetic block is aligned with the Hall device, the Hall device outputs a pulse signal which is stored in the controller of the controlling unit. All the pulse signals are summed up in a preset sensing time of the controller.

Abstract: The invention provided a heatsink thermal module with noise improvement, which has a heatsink thermal module additionally consisting of a heat pipe, a heatsink fins set and a fan module; the fan module is combined with the heatsink fins set which consists of multiple heatsink fins with different lengths and is combined to the fan module with its end with a special geometric shape having the function of lowering the wind drag; by lowering the wind drag, not only the heat dissipation efficiency can be increased, but the noise caused by the heatsink thermal module can also be improved.

Abstract: A data storage system configured for efficient operation in a single controller mode and to facilitate an upgrade from single controller operation to dual redundant active-active controller operation is provided. More particularly, a first controller having a segmented write cache is provided. The first segment of the write cache is associated with logical unit numbers (LUNs) owned by the first controller. The second segment is associated with LUNs that are designated as being owned by a second controller. During single controller operation, the segments of the write cache operate as primary write cache. The system may be converted to dual redundant controller operation by adding a second controller having a write cache segmented like the write cache of the first controller. Upon adding a second controller, primary control of the LUNs owned by or zoned to the second controller is taken over by the second controller.

Abstract: Disclosed is a heat sink module for an electronic device, comprising a substrate having at least a fixed hole, at least a heat sink fin set disposed on the substrate and having a plurality of heat sink fins and at least a resilient plate disposed on the substrate and having at least a mount hole mounting the substrate on an electronic device component in the electronic device in coordination with the fixed hole so that the substrate can be closely bonded to a surface of the electronic component. Further, since the heat sink fin set is formed on the substrate by punching method, an advantage of low cost of the heat sink module is provided.

Abstract: A protective cover with a heat-conductive medium of a heat sink apparatus is provided, which is used to cover and protect the heat-conductive medium placed at the bottom surface of a base of the heat sink apparatus. It includes a sheet-like board, an elastic wall, and an accommodation chamber, wherein the sheet-like board is concave and located at one side of the protective cover with the heat-conductive medium; the elastic wall is extended along the edge of the sheet-like board so as to provide a clipping force for clipping with the heat sink apparatus; and the accommodation chamber is formed by the concave portion of the sheet-like board to mask and cover the heat-conductive medium; while the sheet-like board is clipped to the heat sink apparatus through the elastic wall, such that the accommodation chamber is used to mask and cover the heat-conductive medium.

Abstract: An environment-friendly golf ball includes a core body, a bonding material, and a cover for enclosing the core body. The core body is made of a dissoluble material, which is mixed with the bonding material at a predetermined ratio, so as to make the dissoluble material become an aggregation of specific shape. The shaped structure is steamed and solidified, so as to eliminate the water in the structure. The cover is molded from a dissoluble molding and covering material. The whole structure is water dissoluble and becomes the food of marine life and would not cause pollution to environmental ecology when the golf ball falls into water and could not be collected.

Abstract: Disclosed is a heatsink device of video graphics array (VGA) and chipset. The main characteristic is making an integrated design for heatsink devices. Using a heatsink plate stacks on VGA and chipset instead of several ones as before. The heatsink plate has more heat dissipation area than that of conventional heatsink. The device also integrates other heat generated elements stacking below the heatsink plate to dissipating more heat, so as to increase heat dissipation effect of the heatsink plate. The device makes the operation of VGA and chipset more effectively and increases their life-time.

Abstract: An injector with a coating head, for uniformly coating a heat sink paste onto a surface to be coated is provided, which includes a body, a piston, and a coating head, wherein the piston is pressed to force the heat sink paste out of the body through the coating head, and the heat sink paste is molded by the coating head into a shape suitable for uniformly coating the surface to be coated, and is also quantified. Moreover, a scraping surface is provided at the opening of the coating head, for scraping off the redundant heat sink paste from the steel plate and for smoothing the surface of the heat sink paste, in the case that a steel plate is used to assist the quantifying operation of the heat sink paste.

Abstract: A heatsink module of heat-generating electronic elements on a circuit board is provided. The heatsink module is used to conduct and dissipate the heat generated by heat-generating electronic elements. The heatsink module includes a heat-conducting substrate contacting the heat-generating electronic elements. The heat-conducting substrate is locked on the heat-generating electronic element by a spring fastening. With die elastic force, the spring fastening can continuously press the heat-conducting substrate, such that the heat is conducted from the heat-generating electronic element to the heat-conducting substrate efficiently. Also, a heat pipe is disposed in the heat-conducting substrate, thus shortening the path between the heat pipe and the heat-generating electronic element for conducting heat, and increasing the contact area and improving the heat dissipation.

Abstract: A protective cover with a heat-conductive medium of a heat sink apparatus is provided, which is used to cover and protect the heat-conductive medium placed at the bottom surface of a base of the heat sink apparatus. It includes a sheet-like board, an elastic wall, and an accommodation chamber, wherein the sheet-like board is concave and located at one side of the protective cover with the heat-conductive medium; the elastic wall is extended along the edge of the sheet-like board so as to provide a clipping force for clipping with the heat sink apparatus; and the accommodation chamber is formed by the concave portion of the sheet-like board to mask and cover the heat-conductive medium; while the sheet-like board is clipped to the heat sink apparatus through the elastic wall, such that the accommodation chamber is used to mask and cover the heat-conductive medium.