Abstract: Embodiments of inductive communication devices include first and second IC die and an inductive coupling substrate. The first IC die has a first coil. The inductive coupling substrate has a second coil and a first signal communication interface (e.g., a third coil or a contact). The second IC die has a second signal communication interface (e.g., a fourth coil or a contact). The first IC die and the inductive coupling substrate are arranged so that the first and second coils are aligned across a gap between the first IC die and the inductive coupling substrate. A dielectric component is positioned within the gap between the first and second coils to galvanically isolate the first IC die and the inductive coupling substrate. During operation, signals are conveyed between the first and second IC die through inductive coupling between the coils and communication through the signal communication interfaces.

Abstract: An embodiment of a transformer-based system or galvanic isolation device includes a first coil, a second coil aligned with the first coil across a gap, and a first capacitor coupled between the first coil and a first voltage reference. A first electrode of the first capacitor may be formed from a conductive electrode structure that is electrically isolated from the first coil, and a second electrode of the first capacitor may be formed from at least a portion of the first coil. The system or device also may include a second capacitor coupled between the second coil and a second voltage reference. The first and second coils may form portions of first and second IC die, respectively, and the system or device may also include one or more dielectric components within the gap between the IC die, where the dielectric component(s) are positioned directly between the first and second coils.

Abstract: An interface for processing a variable reluctance sensor signal provided by a variable reluctance sensor including an integrator, an arming comparator and a detect circuit. The integrator includes an input for receiving the variable reluctance sensor signal and an output providing an integrated signal indicative of total flux change of the variable reluctance sensor. The arming comparator compares the integrated signal with a predetermined arming threshold and provides an armed signal indicative thereof. The detect circuit provides a reset signal after the armed signal is provided to reset the integrator. A corresponding method of processing the variable reluctance sensor signal is also described.

Abstract: An interface for processing a variable reluctance sensor signal provided by a variable reluctance sensor including an integrator, an arming comparator and a detect circuit. The integrator includes an input for receiving the variable reluctance sensor signal and an output providing an integrated signal indicative of total flux change of the variable reluctance sensor. The arming comparator compares the integrated signal with a predetermined arming threshold and provides an armed signal indicative thereof. The detect circuit provides a reset signal after the armed signal is provided to reset the integrator. A corresponding method of processing the variable reluctance sensor signal is also described.

Abstract: Embodiments of inductive communication devices include first and second IC die and an inductive coupling substrate. The first IC die has a first coil. The inductive coupling substrate has a second coil and a first signal communication interface (e.g., a third coil or a contact). The second IC die has a second signal communication interface (e.g., a fourth coil or a contact). The first IC die and the inductive coupling substrate are arranged so that the first and second coils are aligned across a gap between the first IC die and the inductive coupling substrate. A dielectric component is positioned within the gap between the first and second coils to galvanically isolate the first IC die and the inductive coupling substrate. During operation, signals are conveyed between the first and second IC die through inductive coupling between the coils and communication through the signal communication interfaces.

Abstract: A circuit performs a method for controlling turn-off of a semiconductor switching element. The method includes determining at least one operating parameter for the semiconductor switching element during an operating cycle and determining a gate discharge current based on the at least one operating parameter. The method further includes supplying the gate discharge current to a gate of the semiconductor switching element during a subsequent operating cycle to turn off the semiconductor switching element.

Abstract: A variable reluctance sensor system for processing a variable reluctance sensor signal including an arming comparator and an arming circuit. The arming comparator compares the variable reluctance sensor signal with an arming threshold which decreases proportional to 1/t from a predetermined maximum level and asserts an armed signal when the variable reluctance sensor signal reaches the arming threshold. The arming threshold may be decreased based on a scaling factor multiplied by 1/t to ensure detection of each pulse of the variable reluctance sensor signal. The arming threshold may decrease to a predetermined minimum level sufficiently low to intersect the variable reluctance sensor signal and sufficiently high relative to an expected noise level. The arming threshold is reset in response to a timing event, such as zero crossing of the variable reluctance sensor signal.

Abstract: Embodiments of inductive communication devices include first and second galvanically isolated IC die and a dielectric structure. Each IC die has a coil proximate to a first surface of the IC die. The IC die are arranged so that the first surfaces of the IC die face each other, and the first coil and the second coil are aligned across a gap between the first and second IC die. The dielectric structure is positioned within the gap directly between the first and second coils, and a plurality of conductive structures are positioned in or on the dielectric structure and electrically coupled with the second IC die. The conductive structures include portions configured to function as bond pads, and the bond pads may be coupled to package leads using wirebonds. During operation, signals are conveyed between the IC die through inductive coupling between the coils.

Abstract: Embodiments of inductive communication devices include first and second galvanically isolated IC die. The first IC die has a first coil proximate to a first surface of the first IC die, and the second IC die has a second coil proximate to a first surface of the second IC die. The first and second IC die are arranged so that the first surfaces of the first and second IC die face each other, and the first coil and the second coil are aligned across a gap between the first and second IC die. One or more dielectric components are positioned within the gap directly between the first and second coils. During operation, a first signal is provided to the first coil, and the first coil converts the signal into a time-varying magnetic field. The magnetic field couples with the second coil, which produces a corresponding second signal.

Abstract: An interface for processing a variable reluctance sensor signal provided by a variable reluctance sensor including an integrator, an arming comparator and a detect circuit. The integrator includes an input for receiving the variable reluctance sensor signal and an output providing an integrated signal indicative of total flux change of the variable reluctance sensor. The arming comparator compares the integrated signal with a predetermined arming threshold and provides an armed signal indicative thereof. The detect circuit provides a reset signal after the armed signal is provided to reset the integrator. A corresponding method of processing the variable reluctance sensor signal is also described.

Abstract: A variable reluctance sensor system for processing a variable reluctance sensor signal including an arming comparator and an arming circuit. The arming comparator compares the variable reluctance sensor signal with an arming threshold which decreases proportional to 1/t from a predetermined maximum level and asserts an armed signal when the variable reluctance sensor signal reaches the arming threshold. The arming threshold may be decreased based on a scaling factor multiplied by 1/t to ensure detection of each pulse of the variable reluctance sensor signal. The arming threshold may decrease to a predetermined minimum level sufficiently low to intersect the variable reluctance sensor signal and sufficiently high relative to an expected noise level. The arming threshold is reset in response to a timing event, such as zero crossing of the variable reluctance sensor signal.

Abstract: An apparatus for presenting a substantially linear capacitive output at at least one output locus in response to a voltage input at an input locus, the voltage input varying over a voltage range, includes a plurality of switching units coupled with the input locus. Each respective switching unit of the plurality of switching units is coupled with one output locus of the at least one output locus. Each respective switching unit presents a contributing capacitive output at the one output locus. The contributing capacitive output exhibits a generally linear response to the voltage input over a segment of the voltage range. All the respective switching units cooperate to establish the substantially linear capacitive output over substantially all of the voltage range.