Patents by Inventor Garlen C. Leung
Garlen C. Leung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10651098Abstract: A method of controlling polishing includes storing a base measurement, the base measurement being a measurement of a substrate after deposition of at least one layer overlying a semiconductor wafer and before deposition of an outer layer over the at least one layer, after deposition of the outer layer over the at least one layer and during polishing of the outer layer on substrate, receiving a sequence of raw measurements of the substrate from an in-situ monitoring system, normalizing each raw measurement in the sequence of raw measurement to generate a sequence of normalized measurements using the raw measurement and the base measurement, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on at least the sequence of normalized measurements.Type: GrantFiled: June 3, 2016Date of Patent: May 12, 2020Assignee: Applied Materials, Inc.Inventors: Tomohiko Kitajima, Jeffrey Drue David, Jun Qian, Taketo Sekine, Garlen C. Leung, Sidney P. Huey
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Patent number: 9811077Abstract: A method of controlling polishing includes storing a base spectrum, the base spectrum being a spectrum of light reflected from a substrate after deposition of a deposited dielectric layers overlying a metallic layer or semiconductor wafer and before deposition of a non-metallic layer over the plurality of deposited dielectric layer. After deposition of the non-metallic layer and during polishing of the non-metallic layer on the substrate, measurements of a sequence of raw spectra of light reflected the substrate during polishing are received from an in-situ optical monitoring system. Each raw spectrum is normalized to generate a sequence of normalized spectra using the raw spectrum and the base spectrum. At least one of a polishing endpoint or an adjustment for a polishing rate is determined based on at least one normalized predetermined spectrum from the sequence of normalized spectra.Type: GrantFiled: July 16, 2014Date of Patent: November 7, 2017Assignee: Applied Materials, Inc.Inventors: Tomohiko Kitajima, Jeffrey Drue David, Jun Qian, Taketo Sekine, Garlen C. Leung, Sidney P. Huey
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Publication number: 20160284615Abstract: A method of controlling polishing includes storing a base measurement, the base measurement being a measurement of a substrate after deposition of at least one layer overlying a semiconductor wafer and before deposition of an outer layer over the at least one layer, after deposition of the outer layer over the at least one layer and during polishing of the outer layer on substrate, receiving a sequence of raw measurements of the substrate from an in-situ monitoring system, normalizing each raw measurement in the sequence of raw measurement to generate a sequence of normalized measurements using the raw measurement and the base measurement, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on at least the sequence of normalized measurements.Type: ApplicationFiled: June 3, 2016Publication date: September 29, 2016Applicant: Applied Materials, Inc.Inventors: Tomohiko Kitajima, Jeffrey Drue David, Jun Qian, Taketo Sekine, Garlen C. Leung, Sidney P. Huey
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Patent number: 9362186Abstract: A method of controlling polishing includes storing a base measurement, the base measurement being an eddy current measurement of a substrate after deposition of at least one layer overlying a semiconductor wafer and before deposition of a conductive layer over the at least one layer, after deposition of the conductive layer over the at least one layer and during polishing of the conductive layer on substrate, receiving a sequence of raw measurements of the substrate from an in-situ eddy current monitoring system, normalizing each raw measurement in the sequence of raw measurement to generate a sequence of normalized measurements using the raw measurement and the base measurement, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on at least the sequence of normalized measurements.Type: GrantFiled: July 15, 2015Date of Patent: June 7, 2016Assignee: Applied Materials, Inc.Inventors: Tomohiko Kitajima, Jeffrey Drue David, Jun Qian, Taketo Sekine, Garlen C. Leung, Sidney P. Huey
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Publication number: 20160020157Abstract: A method of controlling polishing includes storing a base measurement, the base measurement being an eddy current measurement of a substrate after deposition of at least one layer overlying a semiconductor wafer and before deposition of a conductive layer over the at least one layer, after deposition of the conductive layer over the at least one layer and during polishing of the conductive layer on substrate, receiving a sequence of raw measurements of the substrate from an in-situ eddy current monitoring system, normalizing each raw measurement in the sequence of raw measurement to generate a sequence of normalized measurements using the raw measurement and the base measurement, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on at least the sequence of normalized measurements.Type: ApplicationFiled: July 15, 2015Publication date: January 21, 2016Inventors: Tomohiko Kitajima, Jeffrey Drue David, Jun Qian, Taketo Sekine, Garlen C. Leung, Sidney P. Huey
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Publication number: 20160018815Abstract: A method of controlling polishing includes storing a base spectrum, the base spectrum being a spectrum of light reflected from a substrate after deposition of a deposited dielectric layers overlying a metallic layer or semiconductor wafer and before deposition of a non-metallic layer over the plurality of deposited dielectric layer. After deposition of the non-metallic layer and during polishing of the non-metallic layer on the substrate, measurements of a sequence of raw spectra of light reflected the substrate during polishing are received from an in-situ optical monitoring system. Each raw spectrum is normalized to generate a sequence of normalized spectra using the raw spectrum and the base spectrum. At least one of a polishing endpoint or an adjustment for a polishing rate is determined based on at least one normalized predetermined spectrum from the sequence of normalized spectra.Type: ApplicationFiled: July 16, 2014Publication date: January 21, 2016Inventors: Tomohiko Kitajima, Jeffrey Drue David, Jun Qian, Taketo Sekine, Garlen C. Leung, Sidney P. Huey
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Publication number: 20140237905Abstract: A chemical mechanical polishing article can be a single contiguous layer having a polishing surface, the layer being an elongated substantially rectangular sheet having a width and a length at least four times greater than the width. Forming a polishing article can include depositing a liquid precursor on a moving belt, at least partially curing the liquid precursor while on the moving belt to form a polishing layer, and detaching the polishing layer from the belt.Type: ApplicationFiled: May 5, 2014Publication date: August 28, 2014Applicant: Applied Materials, Inc.Inventors: Benjamin A. Bonner, Gopalakrishna B. Prabhu, Erik S. Rondum, Gregory E. Menk, Anand N. Iyer, Peter McReynolds, Garlen C. Leung
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Patent number: 8439723Abstract: A chemical mechanical apparatus comprises a polishing platen, a roller pad assembly capable of advancing a polishing pad across the platen, a substrate carrier to press a substrate against the polishing pad, and a heater to heat the substrate to a temperature sufficiently high to provide a rate of removal of material from the substrate that compensates for the wear of the polishing pad.Type: GrantFiled: August 11, 2008Date of Patent: May 14, 2013Assignee: Applied Materials, Inc.Inventors: Robert A. Marks, Christopher Heung-Gyun Lee, Garlen C. Leung, Gregory E. Menk, Jie Diao, Erik S. Rondum
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Patent number: 8211325Abstract: A method and apparatus for polishing or planarizing a pre-metal dielectric layer by a chemical mechanical polishing process are provided. The method comprises providing a semiconductor substrate having feature definitions formed thereon, forming a pre-metal dielectric layer over the substrate, wherein the as-deposited pre-metal dielectric layer has an uneven surface topography, and planarizing the uneven surface topography of the pre-metal dielectric layer using chemical mechanical polishing techniques, wherein planarizing the uneven surface topography comprises polishing the pre-metal dielectric layer with a fixed abrasive polishing pad and a first polishing composition to remove a bulk portion of the pre-metal dielectric layer and achieve a first predetermined planarity, and polishing the pre-metal dielectric layer with a non-abrasive polishing pad and high selectivity slurry to remove a residual portion of the pre-metal dielectric and achieve a second predetermined planarity.Type: GrantFiled: April 9, 2010Date of Patent: July 3, 2012Assignee: Applied Materials, Inc.Inventors: Jie Diao, Garlen C. Leung, Christopher Heung-Gyun Lee, Lakshmanan Karuppiah
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Publication number: 20120021671Abstract: A method and apparatus for monitoring the condition of a surface of a retaining ring disposed on a carrier head in a polishing module is described. In one embodiment, a method for monitoring at least one surface of a retaining ring coupled to a carrier head is provided. The method includes moving the carrier head adjacent a sensor device disposed in a polishing module, transmitting energy from the sensor device toward the retaining ring, receiving energy reflected from the retaining ring, and determining a condition of the retaining ring based on the received energy.Type: ApplicationFiled: July 26, 2010Publication date: January 26, 2012Applicant: APPLIED MATERIALS, INC.Inventors: Peter McReynolds, Eric S. Rondum, Garlen C. Leung, Adam H. Zhong, Gregory E. Menk, Gopalakrishna B. Prabhu, Thomas H. Osterheld
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Patent number: 7841925Abstract: A polishing article includes a polishing layer having a polishing surface and a solid light-transmissive window in the polishing layer, the window having a first non-linear edge that extends along a first axis parallel to the polishing surface, the first non-linear edge including a plurality of projections and a plurality of recesses extending parallel to the polishing surface and disposed in an alternating pattern along the first axis.Type: GrantFiled: June 19, 2009Date of Patent: November 30, 2010Assignee: Applied Materials, Inc.Inventors: Gregory E. Menk, Peter McReynolds, Erik S. Rondum, Anand N. Iyer, Gopalakrishna B. Prabhu, Garlen C. Leung
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Publication number: 20100285666Abstract: A method and apparatus for polishing or planarizing a pre-metal dielectric layer by a chemical mechanical polishing process are provided. The method comprises providing a semiconductor substrate having feature definitions formed thereon, forming a pre-metal dielectric layer over the substrate, wherein the as-deposited pre-metal dielectric layer has an uneven surface topography, and planarizing the uneven surface topography of the pre-metal dielectric layer using chemical mechanical polishing techniques, wherein planarizing the uneven surface topography comprises polishing the pre-metal dielectric layer with a fixed abrasive polishing pad and a first polishing composition to remove a bulk portion of the pre-metal dielectric layer and achieve a first predetermined planarity, and polishing the pre-metal dielectric layer with a non-abrasive polishing pad and high selectivity slurry to remove a residual portion of the pre-metal dielectric and achieve a second predetermined planarity.Type: ApplicationFiled: April 9, 2010Publication date: November 11, 2010Applicant: APPLIED MATERIALS, INC.Inventors: JIE DIAO, Garlen C. Leung, Christopher Heung-Gyun Lee, Lakshmanan Karuppiah
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Publication number: 20100112919Abstract: A chemical mechanical polishing article can be a single contiguous layer having a polishing surface, the layer being an elongated substantially rectangular sheet having a width and a length at least four times greater than the width. Forming a polishing article can include depositing a liquid precursor on a moving belt, at least partially curing the liquid precursor while on the moving belt to form a polishing layer, and detaching the polishing layer from the belt.Type: ApplicationFiled: November 3, 2008Publication date: May 6, 2010Inventors: Benjamin A. Bonner, Gopalakrishna B. Prabhu, Erik S. Rondum, Gregory E. Menk, Anand N. Iyer, Peter McReynolds, Garlen C. Leung
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Publication number: 20100035515Abstract: A chemical mechanical apparatus comprises a polishing platen, a roller pad assembly capable of advancing a polishing pad across the platen, a substrate carrier to press a substrate against the polishing pad, and a heater to heat the substrate to a temperature sufficiently high to provide a rate of removal of material from the substrate that compensates for the wear of the polishing pad.Type: ApplicationFiled: August 11, 2008Publication date: February 11, 2010Inventors: Robert Marks, Christopher Heung-Gyun Lee, Garlen C. Leung, Gregory E. Menk, Jie Diao, Erik S. Rondum
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Patent number: 7601050Abstract: A polishing apparatus is described. The polishing apparatus includes a rotatable platen, a drive mechanism to incrementally advance a polishing sheet having a polishing surface in a linear direction across the platen, a subpad on the platen to support the polishing sheet, the subpad having a groove formed therein, and a vacuum source connected to the groove of the subpad and configured to apply a vacuum sufficient to pull portions of the polishing sheet into the groove of the subpad to induce a groove in the polishing surface.Type: GrantFiled: February 15, 2007Date of Patent: October 13, 2009Assignee: Applied Materials, Inc.Inventors: Steven M. Zuniga, Peter McReynolds, Erik S. Rondum, Benjamin A. Bonner, Henry H. Au, Gregory E. Menk, Gopalakrishna B. Prabhu, Anand N. Iyer, Garlen C. Leung
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Publication number: 20090253358Abstract: A polishing article includes a polishing layer having a polishing surface and a solid light-transmissive window in the polishing layer, the window having a first non-linear edge that extends along a first axis parallel to the polishing surface, the first non-linear edge including a plurality of projections and a plurality of recesses extending parallel to the polishing surface and disposed in an alternating pattern along the first axis.Type: ApplicationFiled: June 19, 2009Publication date: October 8, 2009Applicant: APPLIED MATERIALS, INC.Inventors: Gregory E. Menk, Peter McReynolds, Erik S. Rondum, Anand N. Iyer, Gopalakrishna B. Prabhu, Garlen C. Leung
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Patent number: 7553214Abstract: A method is described. The method includes contacting a non-solid material to a non-linear edge of a sheet of polishing material, and causing the non-solid material to solidify to form a window that contacts the non-linear edge of the polishing material.Type: GrantFiled: February 15, 2007Date of Patent: June 30, 2009Assignee: Applied Materials, Inc.Inventors: Gregory E. Menk, Peter McReynolds, Erik S. Rondum, Anand N. Iyer, Gopalakrishna B. Prabhu, Garlen C. Leung
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Publication number: 20080182413Abstract: Methods and compositions for planarizing a substrate surface with selective removal rates and low dishing are provided. One embodiment provides a method for selectively removing a dielectric disposed on a substrate having at least a first and a second dielectric material disposed thereon. The method generally includes positioning the substrate in proximity with a fixed abrasive polishing pad, dispensing an abrasive free polishing composition having at least one organic compound and a surfactant therein between the substrate and the polishing pad, and selectively polishing the second dielectric material relative to the first dielectric material.Type: ApplicationFiled: August 15, 2007Publication date: July 31, 2008Inventors: GREGORY E. MENK, Robert L. Jackson, Garlen C. Leung, Gopalakrishna B. Prabhu, Peter McReynolds, Anand N. Iyer
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Patent number: 7063597Abstract: Methods and compositions are provided for planarizing a substrate surface with reduced or minimal topographical defect formation during a polishing process for dielectric materials. In one aspect a method is provided for polishing a substrate containing two or more dielectric layers, such as silicon oxide, silicon nitride, silicon oxynitride, with at least one processing step using a fixed-abrasive polishing article as a polishing article. The processing steps may be used to remove all, substantially all, or a portion of the one or more dielectric layers, which may include removal of the topography, the bulk dielectric, or residual dielectric material of a dielectric layer in two or more steps.Type: GrantFiled: October 24, 2003Date of Patent: June 20, 2006Assignee: Applied MaterialsInventors: Gopalakrishna B. Prabhu, Thomas H. Osterheld, Garlen C. Leung, Adam H. Zhong, Peter McReynolds, Yi-Yung Tao, Gregory E. Menk, Vasanth N. Mohan, Christopher Heung-Gyun Lee
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Publication number: 20040142640Abstract: Methods and compositions are provided for planarizing a substrate surface with reduced or minimal topographical defect formation during a polishing process for dielectric materials. In one aspect a method is provided for polishing a substrate containing two or more dielectric layers, such as silicon oxide, silicon nitride, silicon oxynitride, with at least one processing step using a fixed-abrasive polishing article as a polishing article. The processing steps may be used to remove all, substantially all, or a portion of the one or more dielectric layers, which may include removal of the topography, the bulk dielectric, or residual dielectric material of a dielectric layer in two or more steps.Type: ApplicationFiled: October 24, 2003Publication date: July 22, 2004Applicant: APPLIED MATERIALS, INC.Inventors: Gopalakrishna B. Prabhu, Thomas H. Osterheld, Garlen C. Leung, Adam H. Zhong, Peter McReynolds, Yi-Yung Tao, Gregory E. Menk, Vasanth N. Mohan, Christopher Heung-Gyun Lee