Abstract: A pick and place LED testing apparatus, comprising: a test station operative in use to power a group of LEDs; a bondhead operative in use to pick said group of LEDs from a source wafer and place said group of LEDs on said test station for testing; and an optical sensor operative in use to measure an optical characteristic of said group of LEDs when tested, wherein at least a portion of said bondhead is translucent to provide an optical path from said group of LEDs to said optical sensor.

Abstract: A pick and place LED testing apparatus, comprising: a test station operative in use to power a group of LEDs; a bondhead operative in use to pick said group of LEDs from a source wafer and place said group of LEDs on said test station for testing; and an optical sensor operative in use to measure an optical characteristic of said group of LEDs when tested, wherein at least a portion of said bondhead is translucent to provide an optical path from said group of LEDs to said optical sensor.

Abstract: A cooling apparatus is provided for a bond head which has a collet to hold a semiconductor die and a heater to heat the semiconductor die held by the collet. The cooling apparatus includes a dielectric liquid supply for supplying a dielectric liquid and a gas supply for supplying a gas. A spray nozzle is located next to a surface of the heater, and is connected to both the dielectric liquid supply and the gas supply. In order to cool the heater, the spray nozzle sprays a liquid-gas mixture of the dielectric liquid and the gas towards the surface of the heater.

Abstract: An atomization mechanism for cooling a bond head comprises an atomization module and a conduit. In use, the atomization module receives gas and liquid from a gas supply and a liquid supply respectively to form an atomized spray and the conduit conveys the atomized spray from the atomization module to a spray inlet located at the bond head to receive the atomized spray into the bond head for cooling the bond head.

Abstract: A nozzle assembly having a nozzle body with nozzle bore extending between a proximal portion and a distal portion of the nozzle body; and a tube having a lumen extending between a proximal end and a distal end of the tube, wherein the tube is joined to the nozzle body through the nozzle bore, such that the proximal end of the tube extends beyond the proximal portion of the nozzle body and the distal end of the tube extends beyond the distal portion of the nozzle body.

Abstract: A pick arm for a pick and place apparatus for semiconductor devices, the pick arm comprising first and second ends along a longitudinal axis of the pick arm, and a pick tool located at the first end of the pick arm for picking up semiconductor devices. The pick arm further comprises a winged part extending in a direction transverse to the longitudinal axis between the first and second ends of the pick arm, wherein the winged part comprising a sloping surface. The sloping surface is inclined between a top portion and a bottom portion of the winged part such that the sloping surface is nearer to the longitudinal axis at the top portion than at the bottom portion of the winged part.

Abstract: An atomization mechanism for cooling a bond head comprises an atomization module and a conduit. In use, the atomization module receives gas and liquid from a gas supply and a liquid supply respectively to form an atomized spray and the conduit conveys the atomized spray from the atomization module to a spray inlet located at the bond head to receive the atomized spray into the bond head for cooling the bond head.

Abstract: A pick arm for a pick and place apparatus for semiconductor devices, the pick arm comprising first and second ends along a longitudinal axis of the pick arm, and a pick tool located at the first end of the pick arm for picking up semiconductor devices. The pick arm further comprises a winged part extending in a direction transverse to the longitudinal axis between the first and second ends of the pick arm, wherein the winged part comprising a sloping surface. The sloping surface is inclined between a top portion and a bottom portion of the winged part such that the sloping surface is nearer to the longitudinal axis at the top portion than at the bottom portion of the winged part.

Abstract: A cooling apparatus is provided for a bond head which has a collet adapted to hold a semiconductor die and a heater which is adapted to heat the semiconductor die held by the collet. The cooling apparatus comprises a dielectric liquid supply for supplying a dielectric liquid and a gas supply for supplying a gas. A spray nozzle is located next to a surface of the heater, and is operatively connected to both the dielectric liquid supply and the gas supply. In order to cool the heater, the spray nozzle is operative to spray a liquid-gas mixture comprising the dielectric liquid and the gas towards the surface of the heater.

Abstract: A bond head for thermal compression die bonding comprises a collet operative to support a die on a first side of the collet during die bonding and a bond head heater located on a second side of the collet opposite to the first side for heating the collet and the die. A die vacuum suction hole on the bond head heater applies a vacuum suction force to hold the collet, and a collet vacuum suction hole on the bond head heater applies a vacuum suction force to hold the die. At least one vacuum distribution channel that is formed on the second side of the collet is in fluid communication with the collet vacuum suction hole and distributes the vacuum suction force across a surface of the second side of the collet for securing the collet.

Abstract: Disclosed is an apparatus for determining an alignment of a bondhead of a die bonder relative to a workchuck. Specifically, the apparatus comprises: i) a sensor configured to measure a distance between the bondhead and the sensor; and ii) a positioning device coupled to the sensor, the positioning device being configured to position the sensor relative to a plurality of locations on the bondhead facing the sensor. In particular, the sensor is operative to measure a set of distances between each of the plurality of locations on the bondhead and the sensor, the set of distances being for determining the alignment of the bondhead. A method of determining an alignment of a bondhead of a die bonder relative to a workchuck is also disclosed.

Abstract: A linear switched reluctance motor comprises a movable coil bracket including first and second coil assemblies. Each of the first and second coil assemblies further comprises a plurality of coils separately wound around a plurality of motor coil cores, each of the coils being configured to receive a sinusoidal current at a different phase from other coils comprised in the same coil assembly. Tooth members of a stator track are located adjacent to the motor coil cores such that a magnetic flux path is created which passes through the motor coil core, the stator track and an air gap between the motor coil core and the stator track. A multiple-phase motor driver electrically connected to the first and second coil assemblies generates symmetric multiple-phase sinusoidal currents for driving the motor.

Abstract: A direct current motor comprises a magnet assembly having a pair of magnets for generating a magnetic field and a coil assembly located between the pair of magnets, the coil assembly and the magnet assembly being movable relative to each other. The coil assembly further comprises a first coil section and a second coil section which are electrically connected to each other. A current generator is electrically connected to the coil assembly and is operative to provide first, second and third currents. The first current is electrically connected directly to the first coil section and the second current is electrically connected directly to the second coil section whereas the third current is electrically connected to the first and second coil sections at a position connecting the first and second coil sections.

Abstract: A bond head for thermal compression die bonding comprises a collet operative to support a die on a first side of the collet during die bonding and a bond head heater located on a second side of the collet opposite to the first side for heating the collet and the die. A die vacuum suction hole on the bond head heater applies a vacuum suction force to hold the collet, and a collet vacuum suction hole on the bond head heater applies a vacuum suction force to hold the die. At least one vacuum distribution channel that is formed on the second side of the collet is in fluid communication with the collet vacuum suction hole and distributes the vacuum suction force across a surface of the second side of the collet for securing the collet.

Abstract: Disclosed is an apparatus for determining an alignment of a bondhead of a die bonder relative to a workchuck. Specifically, the apparatus comprises: i) a sensor configured to measure a distance between the bondhead and the sensor; and ii) a positioning device coupled to the sensor, the positioning device being configured to position the sensor relative to a plurality of locations on the bondhead facing the sensor. In particular, the sensor is operative to measure a set of distances between each of the plurality of locations on the bondhead and the sensor, the set of distances being for determining the alignment of the bondhead. A method of determining an alignment of a bondhead of a die bonder relative to a workchuck is also disclosed.

Abstract: An apparatus for aligning a bonding tool of a die bonder with respect to a bond stage is disclosed. The apparatus comprises: a connecting member to which the bonding tool is coupleable such that the connecting member is located between the bonding tool and a main body of a die bonder; and a plurality of actuators engaged to the connecting member. In particular, the plurality of actuators are actuable to rotate the connecting member and the bonding tool relative to the main body of the die bonder about a plurality of axes, to align the bonding tool with respect to the bond stage.

Abstract: A system for maintaining thermal stability of a motion stage driven by a motor comprises a motion current generator operative to produce a motion current to drive the motion stage to move and a thermal current generator operative to produce a thermal current to dissipate heat in the motion stage for controlling a temperature of the motion stage without producing corresponding movement of the motion stage. A summation controller is operative to combine the motion current with the thermal current, and to produce a combined current output to the motor.

Abstract: A collet mounting assembly for a die bonder comprises a collet mount having a first end attached to the die bonder and a second end opposite the first end with a cavity defined in the second end for receiving a shaft of the collet. The collet mounting assembly further comprises a fastener for securing the collet inside the cavity of the collet mount. A compression force is generated around the shaft of the collet received in the collet mount by the flexing of the fastener when it is attached to the collet mount, for securing the collet within the cavity of the collet mount.

Abstract: A linear switched reluctance motor comprises a movable coil bracket including first and second coil assemblies. Each of the first and second coil assemblies further comprises a plurality of coils separately wound around a plurality of motor coil cores, each of the coils being configured to receive a sinusoidal current at a different phase from other coils comprised in the same coil assembly. Tooth members of a stator track are located adjacent to the motor coil cores such that a magnetic flux path is created which passes through the motor coil core, the stator track and an air gap between the motor coil core and the stator track. A multiple-phase motor driver electrically connected to the first and second coil assemblies generates symmetric multiple-phase sinusoidal currents for driving the motor.

Abstract: A gantry system is provided that comprises a gantry beam having a first section and a second section and first and second motors cooperating to drive the respective first and second sections in parallel directions to position the gantry beam along a linear axis. A flexure is connected between the first and second sections about which the second section is deflectable relative to the first section, which is advantageous to reduce any stresses that may be caused in the gantry system when driving the gantry beam.