Abstract: A heat dissipation device configured for dissipating heat of a memory module includes two fin assemblies pivotally assembled together through a pivot, two heat spreaders adapted for being arranged at two opposite side surfaces of the memory module, and two heat pipes. Each of the two heat pipes includes an evaporation section and a condensation section formed at two opposite ends thereof. The condensation sections of the heat pipes are respectively attached to the fin assemblies, and the evaporation sections of the heat pipes are respectively and thermally attached to the heat spreaders, whereby the heat of the memory module is transferred by the heat pipes from the heat spreaders to the fin assemblies for dissipation.

Abstract: A heat dissipation device includes a base, first and second fin units, two heat pipes, and a fan. The first fin unit is located on the base, and the second fin unit is located on the first fin unit. Each fin unit comprises a plurality of parallel fins with a plurality of channels defined therebetween. Each fin comprises an inlet section, an outlet section and a neck section interconnecting the inlet and outlet sections. A height of the neck section reduces gradually from the inlet section to the outlet section. Each heat pipe comprises an evaporating portion connecting with the base and a condensing portion inserting into a corresponding one of the outlet sections of the first and second fin units. The fan is located above the base and mounted onto the inlet sections of the first and second fin units.

Abstract: A heat dissipation device for removing heat from an electronic device and electronic components, includes a base plate in contact with the electronic device, a first fin set and a second fin set mounted on the base plate. The first fin set includes a plurality of first fins perpendicularly arranged on the base plate. The second fin set includes a plurality of second fins attached to a lateral side of the first fin set and perpendicular to both the first fins and the base plate. A fan is mounted on tops of the first fin set and the second fin set to cover both of them. Air generated by the fan flows through the first and second fin sets to cool the electronic components mounted on orthogonally neighboring sides of the heat dissipation device.

Abstract: A projector includes first, second and third light sources and first, second and third heat dissipation devices attached to and thermally connecting with the light sources for dissipating heat generated thereby. The first heat dissipation device includes a first heat sink located adjacent to a lateral side of the projector from which a lens protrudes, a fin assembly and a bent heat pipe connecting the first heat sink and the fin assembly. The second heat dissipation device includes a base and a plurality of fins located at a rear side of the projector and defining a stepped portion on which the fin assembly of the first heat dissipation device is mounted. The third heat dissipation device includes a base and a plurality of fins and is located adjacent to an opposite lateral side of the projector.

Abstract: A heat dissipation device removing heat from a heat generating electronic device on a printed circuit board includes a base, a plurality of fins attached to the base and a clip for mounting the base and the fins onto the heat generating electronic device. Each of the fins defines a closed through hole therein. The holes of the fins cooperatively define a channel. The clip includes a locking beam extending through the channel of the fins and two fasteners engaging the locking beam mounting the base and the fins onto the heat generating electronic device.

Abstract: A fastener for fastening a heat sink to a printed circuit board via a back plate comprises a head and a shaft extending from the head. The shaft comprises a first and second engaging portions and a connecting portion therebetween. The first and second engaging portions have outer threads on exteriors thereof. Two cutouts are defined in the connecting portion. The back plate defines four thread holes machined with inner threads for engaging with the outer threads. In use of the fastener, an elastic force is produced to the fastener due to a deformation of the two cutouts during the threading. The elastic force helps the outer threads to have a secure engagement with the inner threads whereby the fastener can firmly engage with the back plate even when the fastener is subject to vibration or shock.

Abstract: A portable projector with a heat dissipation system, includes a housing and two LED light sources located in the housing. Each of the LED light sources includes a circuit aboard, an LED device mounted on the circuit aboard and a heat pipe. The heat pipe has an evaporating section thermally contacting the circuit board, and a condensing section. A fin set thermally contacts with the condensing section of the heat pipe for dissipating heat therefrom. The fin set of one LED light source is located behind the evaporating section of the heat pipe of the other light source and closely adjacent to a wall of the housing.

Abstract: A portable projector includes a housing, a first light source and a second light source located in the housing. A board thermally contacts the first light source for absorbing heat from the first light source. A heat pipe connects the board and a first heat sink for transferring the heat generated by the first light source from the board to the first heat sink. A second heat sink thermally contacts the second light source for dissipating heat from the second light source.

Abstract: A blind (10) for a projector includes a bracket (20) mounted to the projector, and a folded fin (30) fixed on the bracket and covering a hot air vent of the projector. The folded fin includes a plurality of parallel fins (32) and a plurality of upper and lower tabs (34, 36) interconnecting the fins. Each of the fins defines an angle of 135 degrees with a plane defined by the lower tabs. Furthermore, a projection of each of the fins on the plane defined by the lower tabs overlaps a part of a corresponding adjacent fin. Thus, the blind can prevent a light leakage from the projector, while allow a heated airflow to be expelled out of the projector simultaneously.

Abstract: A heat dissipation device for dissipating heat from heat-generating components on a printed circuit board includes a cover for covering the printed circuit board and a radiator mounted on the cover. The cover defines a plurality of holes corresponding to the heat-generating components on the printed circuit board. The radiator includes a plurality of contacting portions extending through the holes of the cover for contacting the heat-generating components, respectively. The cover and the radiator are made of different materials by different manufacturing techniques, i.e. aluminum die-casting and aluminum extrusion.

Abstract: A heat dissipation device includes a heat sink having a base with thermal interface material thereon and a protective cap covering the base. The protective cap includes a body shielding the thermal interface material and sidewalls extending from the body and engaging with a periphery of the base of the heat sink. A rotatable portion is rotatable relative to the body of the protective cap. The rotatable portion includes a base-wall being rotatably connected with the body of the protective cap and a plurality of positioning sides extending from the base-wall and engaging lateral sides of a corner of the base of the heat sink.

Abstract: A heat dissipation device for dissipating heat from heat-generating components on a printed circuit board includes a cover for covering the printed circuit board and a radiator mounted on the cover. The cover defines a plurality of holes corresponding to the heat-generating components on the printed circuit board. The radiator includes a plurality of contacting portions extending through the holes of the cover for contacting the heat-generating components, respectively. The cover and the radiator are made of different materials by different manufacturing techniques, i.e. aluminum die-casting and aluminum extrusion.

Abstract: A method of manufacturing a heat dissipation device, the method includes the steps of: a) affording a base, a plurality of fins, a plurality of flakes and solder, wherein the base includes a soldering face at a top surface thereof and defines a plurality of through holes therein; b) adhering the flakes to the soldering face of the base for covering the through holes; c) placing the solder onto the soldering face of the base and placing the fins onto the soldering face, whereby the solder is sandwiched between the base and the fins; d) heating the heat dissipation device at a determined temperature to melt the solder; and e) cooling the heat dissipation device to solder the fins onto the base.

Abstract: A heat sink (10) for removing heat from heat-generating devices includes a plurality of fins (12) interconnected together by a fastener (20) extending therethrough. Each fin comprises a main body (14) and a flange (16) bent from an edge of the body. The main body has a thickness and defines a through hole (141, 142, 143) therein. The fastener comprises a plurality of alternating bars (200) and positioned portions (212). Each positioned portion has a same thickness as the main body and is accommodated in the through hole. Each bar is sandwiched between two adjacent main bodies, for fixing the fins in position and preventing the fin from sliding along a length direction of the fastener. The bar has a width larger than a diameter of the through hole.

Abstract: A heat sink includes a base adapted for absorbing heat from a heat-generating component, and a plurality of parallel fins having channels defined therebetween. Each of the fins includes a main body standing on the base. A row of protruding portions and openings is alternately arranged on the main body along a direction from a lateral side to an opposite lateral side of the heat sink. The protruding portions disturb and deflect an airflow flowing in the channels from the lateral side to the opposite side of the heat sink. The openings intercommunicate the channels with each other so that the airflow can flow from one of the channels to the other of the channels.

Abstract: A heat sink (10) for removing heat from heat-generating devices includes a plurality of fins (12) interconnected together by a fastener (20) extending therethrough. Each fin comprises a main body (14) and a flange (16) bent from an edge of the body. The main body has a thickness and defines a through hole (141, 142, 143) therein. The fastener comprises a plurality of alternating bars (200) and positioned portions (212). Each positioned portion has a same thickness as the main body and is accommodated in the through hole. Each bar is sandwiched between two adjacent main bodies, for fixing the fins in position and preventing the fin from sliding along a length direction of the fastener. The bar has a width larger than a diameter of the through hole.

Abstract: A heat dissipating device (8) for cooling a number of electronic devices. The heat dissipating device includes a heat sink (7), a fan (6) mounted to a side of the heat sink and a fan duct (5). The heat sink includes a heat spreader (70), a cover (74) and fins (72) disposed between the heat spreader and the cover. The fan duct includes a mounting plate (50), a faceplate (52) extending downwardly from and perpendicular to the mounting plate, and baffle walls (506, 508) extending downwardly from the mounting plate. The mounting plate defines locating holes (540) for permitting screws (82) to pass through the locating holes and to engage with threaded holes (740) defined in the cover. An airflow generated by the fan flows through the fins and an outlet (524) defined between the baffle walls and the heat sink.

Abstract: A heat pipe type heat dissipation device for an electronic component comprises a base, a bended heat pipe with an evaporating portion connected to the base and at least one condensing portion extending from the evaporating portion, and at least two heat sinks thermally combined together and sandwiching the condensing portion of the heat pipe therebetween. A turning angle of more than 90 degrees and less than 180 degrees, preferably ranging from 120 degrees to 150 degrees, is defined between the evaporating portion and the condensing portion of the heat pipe. The heat sinks each have a heat spreader and a plurality of fins extending from a lateral face of the heat spreader. The condensing portion of the heat pipe is sandwiched between the heat spreaders of the heat sinks.

Abstract: A heat dissipating device (8) for cooling a number of electronic devices. The heat dissipating device includes a heat sink (7), a fan (6) mounted to a side of the heat sink and a fan duct (5). The heat sink includes a heat spreader (70), a cover (74) and fins (72) disposed between the heat spreader and the cover. The fan duct includes a mounting plate (50), a faceplate (52) extending downwardly from and perpendicular to the mounting plate, and baffle walls (506, 508) extending downwardly from the mounting plate. The mounting plate defines locating holes (540) for permitting screws (82) to pass through the locating holes and to engage with threaded holes (740) defined in the cover. An airflow generated by the fan flows through the fins and an outlet (524) defined between the baffle walls and the heat sink.

Abstract: A heat pipe type heat dissipation device for an electronic component comprises a base, a heat dissipation member and two U-shaped heat pipes connecting the heat dissipation member with the base. The heat pipes each have an evaporation section connected to the base and two condensation sections perpendicularly extending from opposite ends of the evaporation section. The heat dissipation member comprises a cylindrical heat transfer wall constructed around and separated from an axis thereof perpendicular to the base, which defines a through opening. A plurality of fins extends in the through opening from an inner face of the heat transfer wall toward the axis so as to define a plurality of air channels between the fins which extend from one open end of the heat transfer wall to the other.