Patents by Inventor Gen-Ping Deng

Gen-Ping Deng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat dissipation device having heat pipe
    Patent number: 7100681
    Abstract: A heat dissipation device includes a base, a plurality of first fins, a plate, a plurality of second fins and two heat pipes. Each heat pipe includes a heat-receiving portion sandwiched between the base and the first fins, a heat-exchange portion sandwiched between the plate and the first fins, a connecting portion connecting the heat-receiving portion and the heat-exchange portion, a heat-discharging portion extending through the plate and inserted into the second fins. At least one of the heat pipes defines two different planes which intercross at the heat-exchange portion of the at least one of the heat pipes.
    Type: Grant
    Filed: October 31, 2005
    Date of Patent: September 5, 2006
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Yi-Qiang Wu, Wei Deng, Liang-Hui Zhao, Gen-Ping Deng