Abstract: An integrated device is provided. The integrated device includes a substrate having a doped upper surface section and an insulator to define first and second substrate regions on opposite sides thereof. Vertical transistors are operably arranged on the doped upper surface section at the first substrate region. P-I-N diodes are operably arranged on the doped upper surface section at the second substrate region.

Abstract: After forming a first-side epitaxial semiconductor region and a second-side epitaxial semiconductor region on recessed surfaces of a semiconductor portion that are not covered by a gate structure, at least one dielectric layer is formed to cover the first-side and the second-side epitaxial semiconductor regions and the gate structure. A second-side contact opening is formed within the at least one dielectric layer to expose an entirety of the second-side epitaxial semiconductor region. The exposed second-side epitaxial semiconductor region can be replaced by a new second-side epitaxial semiconductor region having a composition different from the first-side epitaxial semiconductor region or can be doped by additional dopants, thus creating an asymmetric first-side epitaxial semiconductor region and a second-side epitaxial semiconductor region. Each of the first-side epitaxial semiconductor region and the second-side epitaxial semiconducting region can function as either a source or a drain for a transistor.

Abstract: A semiconductor device includes a substrate and a field effect transistor (FET) arranged on the substrate. The FET includes a gate positioned on the substrate. The gate includes a nanosheet extending through a channel region of the gate. The FET includes a pair of source/drains arranged on opposing sides of the gate. The semiconductor device further includes a bipolar junction transistor (BJT) arranged adjacent to the FET on the substrate. The BJT includes an emitter and a collector. The BJT includes a nanosheet including a semiconductor material extending from the emitter to the collector, with a doped semiconductor material arranged above and below the nanosheet.

Abstract: An inductor device includes a substrate, and a plurality of first trenches including a first metal on the substrate to form first metal layers. The first metal layers are arranged substantially parallel to the substrate. A plurality of second trenches including a second metal is over the first metal layers and includes first portions and second portions. The first portions are substantially parallel to and interdigitate the first metal layers. The second portions are substantially perpendicular to the first portions, extend from ends of the first portions, and are oriented in opposite directions such that the second portions extend over ends of adjacent first metal layers. A plurality of vias connects the first metal layers to the second metal layers. A plurality of magnetic trenches is over the first metal layers, under the second metal layers, and substantially parallel to the second portions of the plurality of second trenches.

Abstract: Nanosheet FET devices having substrate isolation layers are provided, as well as methods for fabricating nanosheet FET devices with substrate isolation layers. For example, a semiconductor device includes a nanosheet stack structure formed on a substrate, which includes a rare earth oxide (REO) layer formed on the substrate, and a semiconductor channel layer disposed adjacent to the REO layer. A metal gate structure is formed over the nanosheet stack structure, and a gate insulating spacer is disposed on sidewalls of the metal gate structure, wherein end portions of the semiconductor channel layer are exposed through the gate insulating spacer. Source/drain regions are formed in contact with the exposed end portions of the semiconductor channel layer. A portion of the metal gate structure is disposed between the semiconductor channel layer and the REO layer, wherein the REO layer isolates the metal gate structure from the substrate.

Abstract: A method of forming a spacer for a vertical transistor is provided. The method includes forming a fin structure that includes a fin on a semiconductor substrate, forming a source junction or a drain junction at an upper surface of the semiconductor substrate and at a base of the fin and epitaxially growing a rare earth oxide (REO) spacer to have a substantially uniform thickness along respective upper surfaces of the source or drain junction and on opposite sides of the fin structure.

Abstract: Various embodiments include three-dimensional (3D) integrated circuit (IC) structures and methods of forming such structures. In some cases, a 3D IC structure includes: a substrate; a first set of transistors overlying the substrate; a first inter-level dielectric (ILD) overlying the first set of transistors and the substrate; a dielectric overlying the first ILD; a semiconductor layer overlying the dielectric; a second set of transistors overlying the semiconductor layer; a capacitor embedded within the dielectric; and a first contact extending through the semiconductor layer and the dielectric to contact one layer of the capacitor, and a second contact extending through the semiconductor layer and the dielectric to contact a second, distinct layer of the capacitor.

Abstract: Embodiments are directed to a method and resulting structures for forming thin and thick gate dielectric nanosheet transistors on the same chip. A first nanosheet stack having a first sacrificial layer between a first nanosheet and a second nanosheet is formed on a substrate. A second nanosheet stack having a first sacrificial layer between a first nanosheet and a second nanosheet is formed on the substrate. The first nanosheet of the first nanosheet stack is doped and concurrently removed with the first sacrificial layer of the first nanosheet stack and the first sacrificial layer of the second nanosheet stack.

Abstract: Embodiments are directed to a method and resulting structures for forming thin and thick gate dielectric nanosheet transistors on the same chip. A first nanosheet stack having a first sacrificial layer between a first nanosheet and a second nanosheet is formed on a substrate. A second nanosheet stack having a first sacrificial layer between a first nanosheet and a second nanosheet is formed on the substrate. The first nanosheet of the first nanosheet stack is doped and concurrently removed with the first sacrificial layer of the first nanosheet stack and the first sacrificial layer of the second nanosheet stack.

Abstract: Embodiments of the present invention provide systems and methods for generating oxide spacers in a vertical field transistor. The fin of the channel facilitates the electrical current flowing between the source terminal and the drain terminal. By employing sacrificial spacers, implanted oxidation enhancement species on a silicon surface, an implanted oxidation enhancement species can be oxidized to oxide spacers.

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to electrical and optical via connections on a same chip and methods of manufacture. The structure includes an optical through substrate via (TSV) comprising an optical material filling the TSV. The structure further includes an electrical TSV which includes a liner of the optical material and a conductive material filling remaining portions of the electrical TSV.

Abstract: A semiconductor device includes a substrate and a field effect transistor (FET) arranged on the substrate. The FET includes a gate positioned on the substrate. The gate includes a nanosheet extending through a channel region of the gate. The FET includes a pair of source/drains arranged on opposing sides of the gate. The semiconductor device further includes a bipolar junction transistor (BJT) arranged adjacent to the FET on the substrate. The BJT includes an emitter and a collector. The BJT includes a nanosheet including a semiconductor material extending from the emitter to the collector, with a doped semiconductor material arranged above and below the nanosheet.

Abstract: Embodiments of the present invention provide systems and methods for generating oxide spacers in a vertical field transistor. The fin of the channel facilitates the electrical current flowing between the source terminal and the drain terminal. By employing sacrificial spacers, implanted oxidation enhancement species on a silicon surface, an implanted oxidation enhancement species can be oxidized to oxide spacers.

Abstract: Methods of forming semiconductor devices include forming structures having an inner vertical layer and spacers on sidewalls of the inner vertical layer on a first region and a second region of a gate layer. The inner vertical layer is etched in only the first region to expose inner sidewalls of the spacers in the first region. The gate layer is etched using the remaining inner vertical layers and the spacers as a mask to form first gates in the first region and second gates in the second region. The first gates have a smaller gate length than a gate length of the second gates.

Abstract: Embodiments are directed to a method for forming a semiconductor structure by depositing a stack of alternating layers of two materials over a substrate and defining field-effect transistor (FET) and diode regions. The method further includes depositing a mask, where the mask covers only the FET region while leaving the diode region uncovered. The method further includes doping the material in the diode region with a dopant, implanting epitaxial material with another dopant to form PN junctions, stripping the mask from the structure, forming a metal gate conductor over the FET region, and depositing a metal over the substrate to create terminals.

Abstract: A semiconductor device includes a buried epitaxially grown substrate and a silicon on insulator (SOI) layer. The device also includes a buried oxide (BOX) layer between the buried epitaxially grown substrate and the SOI layer, an isolation trench having first width (w1), a contact trench having a second width (w2) and a capacitive trench having a third width (w3). Methods are described that allow the formation of the trenches in a normal process flow.

Abstract: Embodiments are directed to a method and resulting structures for forming thin and thick gate dielectric nanosheet transistors on the same chip. A first nanosheet stack having a first sacrificial layer between a first nanosheet and a second nanosheet is formed on a substrate. A second nanosheet stack having a first sacrificial layer between a first nanosheet and a second nanosheet is formed on the substrate. The first nanosheet of the first nanosheet stack is doped and concurrently removed with the first sacrificial layer of the first nanosheet stack and the first sacrificial layer of the second nanosheet stack.

Abstract: A method of manufacturing an integrated circuit is provided. According to the method, a layered fin including a plurality of sacrificial layers and semiconductor layers wherein two adjacent semiconductor layers are separated by the sacrificial layer is provided on a semiconductor substrate. A gate over the layered fin and a spacer surrounding a sidewall of the gate are then formed. The sacrificial layers are subsequently removed to provide a structure in which two adjacent semiconductor layers are separated by a gap. The method further includes forming an insulator in the gap and forming source and drain regions located on the layered fin. The insulator includes a high-K dielectric material surrounded by a low-K dielectric material, both of which are in contact with the two adjacent semiconductor layers.

Abstract: Embodiments are directed to devices and methods for integrating laterally diffused metal oxide semiconductor (LDMOS) technology on vertical field effect transistor (VFET) technology, which enables VFET applications to be broadened to include power amplifiers. By providing a combined asymmetric underlapped drain, high current, low subthreshold slope and LDMOS lightly doped drain, high drain resistance and high drain voltage are enabled.

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to electrical and optical via connections on a same chip and methods of manufacture. The structure includes an optical through substrate via (TSV) comprising an optical material filling the TSV. The structure further includes an electrical TSV which includes a liner of the optical material and a conductive material filling remaining portions of the electrical TSV.