Abstract: An electronic device structure having a shielding structure includes a substrate with an electronic component electrically connected to the substrate. The shielding structure includes conductive spaced-apart pillar structures that have proximate ends connected to the substrate and distal ends spaced apart from the substrate, and that are laterally spaced apart from the first electronic component. In one embodiment, the conductive pillar structures are conductive wires attached at one end to the substrate with an opposing end extending away from the substrate so that the conductive wires are provided generally perpendicular to the substrate. A package body encapsulates the electronic component and the conductive spaced-apart pillar structures. In one embodiment, the shielding structure further includes a shielding layer disposed adjacent to the package body, which is electrically connected to the conductive spaced-apart pillar structures.

Abstract: Provided are a polymer polyol dispersion stabilizer, which is prepared by reacting a first polyol having a hydroxyl value (OHV) of 5 to 50 mgKOH/g and an ethylene oxide content of less than 20 wt %, a second polyol having an OHV of 50 to 100 mgKOH/g and an ethylene oxide content of 20 wt % or more, and a reactive unsaturated compound having one or more carbon-carbon double bonds and two or more carbon-oxygen double bonds, and a method of preparing the same.

Abstract: An electronic device structure having a shielding structure includes a substrate with an electronic component electrically connected to the substrate. The shielding structure includes conductive spaced-apart pillar structures that have proximate ends connected to the substrate and distal ends spaced apart from the substrate, and that are laterally spaced apart from the first electronic component. In one embodiment, the conductive pillar structures are conductive wires attached at one end to the substrate with an opposing end extending away from the substrate so that the conductive wires are provided generally perpendicular to the substrate. A package body encapsulates the electronic component and the conductive spaced-apart pillar structures. In one embodiment, the shielding structure further includes a shielding layer disposed adjacent the package body, which is electrically connected to the conductive spaced-apart pillar structures. In one embodiment, the electrical connection is made through the package.

Abstract: Disclosed is a process for producing a polymer polyol, comprising: (a) reacting a first mixture comprising an initiator, a polyol, a diluent, a stabilizer, a styrene-based monomer and a nitrile-based monomer; and (b) continuously adding, to the first mixture, a second mixture comprising an initiator, a polyol, a stabilizer, a styrene-based monomer and a nitrile-based monomer to react, wherein the first mixture and second mixture comprise the stabilizer in a weight ratio of 1:1 to 3, respectively, and a polymer polyol produced according to the process.

Abstract: Disclosed is a method for preparing polymer polyol comprising the steps of: (a) polymerizing polyol and aromatic vinyl monomer in the presence of an organic diluting agent; (b) additionally inputting and polymerizing polyol, aromatic vinyl monomer and unsaturated nitrile monomer in the product of step (a); and (c) removing the organic diluting agent from the product of step (b), wherein the organic diluting agent is compatible with the polymer of the aromatic vinyl monomer.

Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.

Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.

Abstract: An electronic device structure having a shielding structure includes a substrate with an electronic component electrically connected to the substrate. The shielding structure includes conductive spaced-apart pillar structures that have proximate ends connected to the substrate and distal ends spaced apart from the substrate, and that are laterally spaced apart from the first electronic component. In one embodiment, the conductive pillar structures are conductive wires attached at one end to the substrate with an opposing end extending away from the substrate so that the conductive wires are provided generally perpendicular to the substrate. A package body encapsulates the electronic component and the conductive spaced-apart pillar structures. In one embodiment, the shielding structure further includes a shielding layer disposed adjacent the package body, which is electrically connected to the conductive spaced-apart pillar structures. In one embodiment, the electrical connection is made through the package.

Abstract: Provided is a method of preparing a polymer polyol, including steps of: (a) polymerizing a polyol and a monomer in presence of a diluent to prepare a primary particle dispersed liquid; and (b) feeding an additional polyol and monomer into the primary particle dispersed liquid and polymerizing to prepare a secondary particle dispersed liquid.

Abstract: An electronic device structure having a shielding structure includes a substrate with an electronic component electrically connected to the substrate. The shielding structure includes conductive spaced-apart pillar structures that have proximate ends connected to the substrate and distal ends spaced apart from the substrate, and that are laterally spaced apart from the first electronic component. In one embodiment, the conductive pillar structures are conductive wires attached at one end to the substrate with an opposing end extending away from the substrate so that the conductive wires are provided generally perpendicular to the substrate. A package body encapsulates the electronic component and the conductive spaced-apart pillar structures. In one embodiment, the shielding structure further includes a shielding layer disposed adjacent the package body, which is electrically connected to the conductive spaced-apart pillar structures. In one embodiment, the electrical connection is made through the package.

Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.

Abstract: Provided is a method of preparing a polymer polyol including steps of (a) respectively batchwise feeding a polyol and a monomer in a weight ratio of 40 to 60:40 to 60 into a reactor to prepare a mixture; and (b) polymerizing the mixture for 1 to 5 hours to prepare monodispersed particles.

Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.

Abstract: An electronic device structure having a shielding structure includes a substrate with an electronic component electrically connected to the substrate. The shielding structure includes conductive spaced-apart pillar structures that have proximate ends connected to the substrate and distal ends spaced apart from the substrate, and that are laterally spaced apart from the first electronic component. In one embodiment, the conductive pillar structures are conductive wires attached at one end to the substrate with an opposing end extending away from the substrate so that the conductive wires are provided generally perpendicular to the substrate. A package body encapsulates the electronic component and the conductive spaced-apart pillar structures. In one embodiment, the shielding structure further includes a shielding layer disposed adjacent the package body, which is electrically connected to the conductive spaced-apart pillar structures. In one embodiment, the electrical connection is made through the package.

Abstract: Provided is a method of preparing a polymer polyol including steps of (a) respectively batchwise feeding a polyol and a monomer in a weight ratio of 40 to 60:40 to 60 into a reactor to prepare a mixture; and (b) polymerizing the mixture for 1 to 5 hours to prepare monodispersed particles.

Abstract: Provided is a method of preparing a polymer polyol, including steps of: (a) polymerizing a polyol and a monomer in presence of a diluent to prepare a primary particle dispersed liquid; and (b) feeding an additional polyol and monomer into the primary particle dispersed liquid and polymerizing to prepare a secondary particle dispersed liquid.

Abstract: An electronic device structure having a shielding structure includes a substrate with an electronic component electrically connected to the substrate. The shielding structure includes conductive spaced-apart pillar structures that have proximate ends connected to the substrate and distal ends spaced apart from the substrate, and that are laterally spaced apart from the first electronic component. In one embodiment, the conductive pillar structures are conductive wires attached at one end to the substrate with an opposing end extending away from the substrate so that the conductive wires are provided generally perpendicular to the substrate. A package body encapsulates the electronic component and the conductive spaced-apart pillar structures. In one embodiment, the shielding structure further includes a shielding layer disposed adjacent the package body, which is electrically connected to the conductive spaced-apart pillar structures. In one embodiment, the electrical connection is made through the package.

Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.

Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.

Abstract: A semiconductor package and a method of manufacturing a semiconductor package.