Abstract: A testing apparatus comprises a tester comprising a plurality of racks, wherein each rack comprises a plurality of slots, wherein each slot comprises: (a) an interface board affixed in a slot of a rack, wherein the interface board comprises test circuitry and a plurality of sockets, each socket operable to receive a device under test (DUT); and (b) a carrier comprising an array of DUTs, wherein the carrier is operable to displace into the slot of the rack, and wherein each DUT in the array of DUTs aligns with a respective socket of the plurality of sockets on the interface board. The testing apparatus further comprises a pick-and-place mechanism for loading the array of DUTs into the carrier and an elevator for transporting the carrier to the slot of the rack.

Abstract: An apparatus for thermal control of a device under test (DUT) includes a cooling structure operable to provide cooling, the cooling structure operable to inlet cooling material via an inlet port thereof and operable to outlet. cooling material via an outlet port thereof, a variable thermal conductance material (VTCM) layer disposed on a surface of the cooling structure, and a heater layer operable to generate heat based on an electronic control, and wherein the VTCM layer is operable to transfer cooling from the cooling structure to the heater layer. A thermal interface material layer is disposed on the heater layer. The thermal interface material layer is operable to provide thermal coupling and mechanical compliance with respect to the DUT. The apparatus includes a compression a a mechanism for providing compression to the VTCM layer to vary a thermal conductance of the VTCM layer. The compression mechanism is also for decoupling the VTCM layer from the heater layer.

Abstract: A testing apparatus comprises a test interface board comprising a plurality of socket interface boards, wherein each socket interface board comprises: a) an open socket to hold a DUT; b) a discrete active thermal interposer comprising thermal properties and operable to make thermal contact with the DUT; c) a superstructure operable to contain the discrete active thermal interposer; and d) an actuation mechanism operable to provide a contact force to bring the discrete active thermal interposer in contact with the DUT.

Abstract: A high volume system level testing of devices with POP structures such as POP memories includes a POP array that includes floating nests that can adjust in the XY direction in order to align individually with respective pads found on the DUTs. The floating nests also include a mechanically fixed PCB that is fixed to the nest and can either mate to a memory contactor array that can accept an unattached POP device such as a memory or can include an attached memory in order to accommodate different POP requirements. In a method, the POP array includes a number of floating nests with memory loaded are aligned and presented to their respective DUTs just prior to testing the combined DUT and POP memory assemblies.

Abstract: A high volume system level testing of devices with POP structures such as POP memories includes a POP array that includes floating nests that can adjust in the XY direction in order to align individually with respective pads found on the DUTs. The floating nests also include a mechanically fixed PCB that is fixed to the nest and can either mate to a memory contactor array that can accept an unattached POP device such as a memory or can include an attached memory in order to accommodate different POP requirements. In a method, the POP array includes a number of floating nests with memory loaded are aligned and presented to their respective DUTs just prior to testing the combined DUT and POP memory assemblies.

Abstract: An evaporator (102) provides a compact design in which thermal energy can be removed from a DUT (108) in an efficient manner. The evaporator (102) can include a cover (306) which includes both input and output apertures for providing refrigerant into and out of the evaporator (102). An orifice plate (304) is located between the cover (306) and a heat exchanger (302). The heat exchanger (302) includes a plurality of pillars which help increase the surface area of the heat exchanger (302). The orifice plate (304) includes an aperture (310) which forms a nozzle which sprays refrigerant onto the heat exchanger in order to remove the heat away from the heat exchanger (302).