Patents by Inventor Guy NESHER

Guy NESHER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240075679
    Abstract: Systems and methods in which a material or materials (e.g., a viscous material) are printed or otherwise transferred onto an intermediate substrate at a printing unit(s). The intermediate substrate having an image of material printed thereon is subsequently transferred to a sample building unit, and the image of material is transferred from the intermediate substrate to a sample at the sample building unit. Optionally, the printing unit(s) includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred from the donor substrate onto the intermediate substrate at the printing unit(s). Each of the printing units may employ a variety of printing or other transfer technologies. The system may also include material curing, heating, sintering, ablating, material filling, imaging and cleaning units to aid in the overall process.
    Type: Application
    Filed: November 9, 2023
    Publication date: March 7, 2024
    Inventors: Michael Zenou, Ziv Gilan, Guy Nesher
  • Publication number: 20240064897
    Abstract: Systems and methods for printing a printed circuit board (PCB) from substrate to full integration utilize a laser-assisted deposition (LAD) system to print a flowable material on top of a substrate by laser jetting to create a PCB structure to be used as an electronic device. One such system for PCB printing includes a jet printing unit, an imaging unit, curing units, and a drilling unit to print metals and other materials (epoxies, solder masks, etc.) directly on a PCB substrate such as a glass-reinforced epoxy laminate material (e.g., FR4) or others. The jet printing unit can also be used for sintering and/or ablation of materials. Printed materials are cured by heating or by infrared (IR) or ultraviolet (UV) radiation. PCB s produced according to the present systems and methods may be single-sided or double-sided.
    Type: Application
    Filed: October 31, 2023
    Publication date: February 22, 2024
    Inventors: Michael Zenou, Guy Nesher
  • Patent number: 11872750
    Abstract: Methods and apparatus for the fabrication of solid three-dimensional objects from liquid polymerizable materials at high resolution. A material is coated on a film non-digitally, excess material is removed digitally, by laser, leaving an image of a layer to be printed, and the image is then engaged with existing portions of an object being fabricated and exposed to a non-digital heat source. Since the only part of the process that is digital is the material removal, and this part is done by laser, the speed of printing and the robustness of the manufacturing process is improved significantly over conventional additive or 3D fabrication techniques.
    Type: Grant
    Filed: May 1, 2023
    Date of Patent: January 16, 2024
    Assignee: IO Tech Group Ltd.
    Inventors: Ziv Gilan, Michael Zenou, Guy Nesher
  • Patent number: 11877398
    Abstract: Systems and methods for printing a printed circuit board (PCB) from substrate to full integration utilize a laser-assisted deposition (LAD) system to print a flowable material on top of a substrate by laser jetting to create a PCB structure to be used as an electronic device. One such system for PCB printing includes a jet printing unit, an imaging unit, curing units, and a drilling unit to print metals and other materials (epoxies, solder masks, etc.) directly on a PCB substrate such as a glass-reinforced epoxy laminate material (e.g., FR4) or others. The jet printing unit can also be used for sintering and/or ablation of materials. Printed materials are cured by heating or by infrared (IR) or ultraviolet (UV) radiation. PCBs produced according to the present systems and methods may be single-sided or double-sided.
    Type: Grant
    Filed: February 24, 2021
    Date of Patent: January 16, 2024
    Assignee: IO Tech Group Ltd.
    Inventors: Michael Zenou, Guy Nesher
  • Patent number: 11865767
    Abstract: Systems and methods in which a material or materials (e.g., a viscous material) are printed or otherwise transferred onto an intermediate substrate at a printing unit(s). The intermediate substrate having an image of material printed thereon is subsequently transferred to a sample building unit, and the image of material is transferred from the intermediate substrate to a sample at the sample building unit. Optionally, the printing unit(s) includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred from the donor substrate onto the intermediate substrate at the printing unit(s). Each of the printing units may employ a variety of printing or other transfer technologies. The system may also include material curing, heating, sintering, ablating, material filling, imaging and cleaning units to aid in the overall process.
    Type: Grant
    Filed: April 20, 2023
    Date of Patent: January 9, 2024
    Assignee: IO Tech Group Ltd.
    Inventors: Michael Zenou, Ziv Gilan, Guy Nesher
  • Patent number: 11860557
    Abstract: In an example, a print apparatus comprises an intermediate transfer member to receive thermoplastic print agent from a photoconductive surface, a rotatably mounted endless cleaning surface to receive a layer of thermoplastic print agent from the intermediate transfer member and a heater, to heat the endless cleaning surface. The endless cleaning surface may be to engage with the intermediate transfer member when heated to transfer residue from the intermediate transfer member to the layer of thermoplastic print agent on the endless cleaning surface.
    Type: Grant
    Filed: January 21, 2022
    Date of Patent: January 2, 2024
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Amir Kedem, Michael Kokotov, Elina Ploshnik, Guy Nesher, Alex Feygelman, Eran Shiran, Nadav Shalem, Chen Talmor
  • Publication number: 20230294353
    Abstract: Systems and methods in which a material or materials (e.g., a viscous material) are printed or otherwise transferred onto an intermediate substrate at a printing unit(s). The intermediate substrate having an image of material printed thereon is subsequently transferred to a sample building unit, and the image of material is transferred from the intermediate substrate to a sample at the sample building unit. Optionally, the printing unit(s) includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred from the donor substrate onto the intermediate substrate at the printing unit(s). Each of the printing units may employ a variety of printing or other transfer technologies. The system may also include material curing, heating, sintering, ablating, material filling, imaging and cleaning units to aid in the overall process.
    Type: Application
    Filed: April 20, 2023
    Publication date: September 21, 2023
    Inventors: Michael Zenou, Ziv Gilan, Guy Nesher
  • Publication number: 20230264416
    Abstract: Methods and apparatus for the fabrication of solid three-dimensional objects from liquid polymerizable materials at high resolution. A material is coated on a film non-digitally, excess material is removed digitally, by laser, leaving an image of a layer to be printed, and the image is then engaged with existing portions of an object being fabricated and exposed to a non-digital heat source. Since the only part of the process that is digital is the material removal, and this part is done by laser, the speed of printing and the robustness of the manufacturing process is improved significantly over conventional additive or 3D fabrication techniques.
    Type: Application
    Filed: May 1, 2023
    Publication date: August 24, 2023
    Inventors: Ziv Gilan, Michael Zenou, Guy Nesher
  • Publication number: 20230240022
    Abstract: Systems and methods for printing a printed circuit board (PCB) from substrate to full integration utilize a laser-assisted deposition (LAD) system to print a flowable material on top of a substrate by laser jetting to create a PCB structure to be used as an electronic device. One such system for PCB printing includes a jet printing unit, an imaging unit, curing units, and a drilling unit to print metals and other materials (e.g., epoxies, solder masks, etc.) directly on a PCB substrate such as a glass-reinforced epoxy laminate material (e.g., FR4). The jet printing unit can also be used for sintering and/or ablating materials. Printed materials are cured by heat or by infrared (IR) or ultraviolet (UV) radiation. PCBs produced according to the present systems and methods may be single-sided or double-sided.
    Type: Application
    Filed: January 27, 2022
    Publication date: July 27, 2023
    Inventors: Ralph S. Birnbaum, Guy Nesher, Alexander Slavomir Stepinski, Michael Zenou
  • Patent number: 11697245
    Abstract: Methods and apparatus for the fabrication of solid three-dimensional objects from liquid polymerizable materials at high resolution. A material is coated on a film non-digitally, excess material is removed digitally, by laser, leaving an image of a layer to be printed, and the image is then engaged with existing portions of an object being fabricated and exposed to a non-digital UV curing light source. Since the only part of the process that is digital is the material removal, and this part is done by laser, the speed of printing and the robustness of the manufacturing process is improved significantly over conventional additive or 3D fabrication techniques.
    Type: Grant
    Filed: November 5, 2021
    Date of Patent: July 11, 2023
    Assignee: IO Tech Group Ltd.
    Inventors: Ziv Gilan, Michael Zenou, Guy Nesher
  • Patent number: 11697166
    Abstract: Systems and methods in which dot-like portions of a material (e.g., a viscous material such as a solder paste) are printed or otherwise transferred onto an intermediate substrate at a first printing unit, the intermediate substrate having the dot-like portions of material printed thereon is transferred to a second printing unit, and the dot-like portions of material are transferred from the intermediate substrate to a final substrate at the second printing unit. Optionally, the first printing unit includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred in the individual dot-like portions from the donor substrate onto the intermediate substrate at the first printing unit. Each of the first and second printing units may employ a variety of printing or other transfer technologies. The system may also include material curing and imaging units to aid in the overall process.
    Type: Grant
    Filed: August 8, 2022
    Date of Patent: July 11, 2023
    Assignee: IO TECH GROUP LTD.
    Inventors: Michael Zenou, Ziv Gilan, Guy Nesher
  • Patent number: 11691332
    Abstract: Systems and methods in which a material or materials (e.g., a viscous material) are printed or otherwise transferred onto an intermediate substrate at a printing unit(s). The intermediate substrate having an image of material printed thereon is subsequently transferred to a sample building unit, and the image of material is transferred from the intermediate substrate to a sample at the sample building unit. Optionally, the printing unit(s) includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred from the donor substrate onto the intermediate substrate at the printing unit(s). Each of the printing units may employ a variety of printing or other transfer technologies. The system may also include material curing, heating, sintering, ablating, material filling, imaging and cleaning units to aid in the overall process.
    Type: Grant
    Filed: January 4, 2021
    Date of Patent: July 4, 2023
    Assignee: IO Tech Group Ltd.
    Inventors: Michael Zenou, Ziv Gilan, Guy Nesher
  • Publication number: 20230202098
    Abstract: In systems for printing a viscous material, the printing and post processing of the viscous material are performed sequentially one after another. In an initial step, a viscous material is printed on a sample mounted on a receiver substrate using a donor module and a laser scanner, and then the donor module is replaced with a post processing system for performing a post processing operation (and vice versa). Multiple post processing operations can be performed, and multiple different materials can be printed on the same layer. The systems can increase the speed, resolution and diversity of materials printed on the same sample, and opens the possibilities for new designs.
    Type: Application
    Filed: December 13, 2022
    Publication date: June 29, 2023
    Inventors: Ziv Gilan, Michael Zenou, Guy Nesher
  • Patent number: 11642202
    Abstract: A three-dimensional device is fabricated in a layer-by-layer approach using a support material. The support material is deposited in a liquid form on a surface, hardened by cooling or ultraviolet (UV) curing, and selectively ablated to create an area within which the desired structure of the device will be formed. Active material is deposited into this area, and the layer-by-layer process repeated until the three-dimensional device has been completed. Thereafter, any remaining support material is removed by water or other solvent.
    Type: Grant
    Filed: October 4, 2021
    Date of Patent: May 9, 2023
    Assignee: IO Tech Group Ltd.
    Inventors: Michael Zenou, Guy Nesher, Ziv Gilan
  • Publication number: 20230048439
    Abstract: A vacuum chuck system may include a vacuum chuck and a vacuum stopper collection and dispensing system. The vacuum chuck may include a ceramic plate with a retaining surface. The retaining surface may include a plurality of depressions and a plurality of openings, each of the openings being disposed on a bottom surface of one of the depressions and fluidly coupled to a vacuum pump. Vacuum stoppers may be used to seal one or more of the openings so as to restrict the vacuum area of the vacuum chuck. The vacuum stopper collection and dispensing system may be used to collect vacuum stoppers from and dispense vacuum stoppers onto the retaining surface. In addition or in the alternative, an electromagnet or a robotic arm may be used to move a vacuum stopper from a blocking position to a non-blocking position on the retaining surface.
    Type: Application
    Filed: August 13, 2021
    Publication date: February 16, 2023
    Inventors: Ziv Gilan, Moshe Koko Havive, Guy Nesher, Daniel Liptz, Rachel Krause
  • Patent number: 11573507
    Abstract: In an example of the disclosure, a blanket servicing system includes a rotatably mounted endless cleaning surface and a scraper. The endless cleaning surface is to have a first engagement with a blanket to obtain a layer of thermoplastic print agent from the blanket. The endless cleaning surface is to have a second engagement with the blanket to receive residue from the blanket onto the layer of thermoplastic print agent. The scraper is to scrape the endless cleaning surface to transfer the residue from the endless cleaning surface to a collection element.
    Type: Grant
    Filed: September 16, 2021
    Date of Patent: February 7, 2023
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Amir Kedem, Michael Kokotov, Alex Feygelman, Guy Nesher, Nadav Shalem, Michael Vinokur
  • Publication number: 20220379396
    Abstract: Systems and methods in which dot-like portions of a material (e.g., a viscous material such as a solder paste) are printed or otherwise transferred onto an intermediate substrate at a first printing unit, the intermediate substrate having the dot-like portions of material printed thereon is transferred to a second printing unit, and the dot-like portions of material are transferred from the intermediate substrate to a final substrate at the second printing unit. Optionally, the first printing unit includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred in the individual dot-like portions from the donor substrate onto the intermediate substrate at the first printing unit. Each of the first and second printing units may employ a variety of printing or other transfer technologies. The system may also include material curing and imaging units to aid in the overall process.
    Type: Application
    Filed: August 8, 2022
    Publication date: December 1, 2022
    Inventors: Michael Zenou, Ziv Gilan, Guy Nesher
  • Patent number: 11446750
    Abstract: Systems and methods in which dot-like portions of a material (e.g., a viscous material such as a solder paste) are printed or otherwise transferred onto an intermediate substrate at a first printing unit, the intermediate substrate having the dot-like portions of material printed thereon is transferred to a second printing unit, and the dot-like portions of material are transferred from the intermediate substrate to a final substrate at the second printing unit. Optionally, the first printing unit includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred in the individual dot-like portions from the donor substrate onto the intermediate substrate at the first printing unit. Each of the first and second printing units may employ a variety of printing or other transfer technologies. The system may also include material curing and imaging units to aid in the overall process.
    Type: Grant
    Filed: March 3, 2020
    Date of Patent: September 20, 2022
    Assignee: IO Tech Group Ltd.
    Inventors: Michael Zenou, Ziv Gilan, Guy Nesher
  • Patent number: 11440241
    Abstract: Manufacture of a 3D object by a printing method that enables the use of several reactive materials sequentially. A laser-enhanced jetting-based 3D printer forms successive layers of reactive compositions on one another and the first and subsequent layers are allowed to crosslink between the printings to ultimately form the 3D object. Additional reactive compositions may be printed prior to the crosslinking. The crosslinking may be effected by heating, with or without a catalyst, and post printing curing may be employed after the 3D object is formed.
    Type: Grant
    Filed: May 18, 2020
    Date of Patent: September 13, 2022
    Assignee: IO Tech Group Ltd.
    Inventors: Michael Zenou, Guy Nesher
  • Publication number: 20220256698
    Abstract: Systems and methods for printing a printed circuit board (PCB) from substrate to full integration utilize a laser-assisted deposition (LAD) system to print a flowable material on top of a substrate by laser jetting to create a PCB structure to be used as an electronic device. One such system for PCB printing includes a jet printing unit, an imaging unit, curing units, and a drilling unit to print metals and other materials (epoxies, solder masks, etc.) directly on a PCB substrate such as a glass-reinforced epoxy laminate material (e.g., FR4) or others. The jet printing unit can also be used for sintering and/or ablation of materials. Printed materials are cured by heating or by infrared (IR) or ultraviolet (UV) radiation. PCBs produced according to the present systems and methods may be single-sided or double-sided.
    Type: Application
    Filed: February 24, 2021
    Publication date: August 11, 2022
    Inventors: Michael Zenou, Guy Nesher