Abstract: An apparatus for automatic placement of gaskets on a housing includes a base, the second feeding mechanism, a first detecting member, a bearing mechanism, an assembly mechanism, and a controller. The first detecting member can detect the position of the gaskets relative to the preset position. The detected results are transmitted to the controller by the first detecting member. The controller controls the second feeding mechanism to accurately adjust the position of the gaskets to preset position. Therefore, a projection of the gasket is accurately engaged in a mounting hole of the housing by the assembly mechanism.

Abstract: The present document relates to Near Field Communication (NFC). In particular, the present document relates to the routing of application related information in a system comprising multiple NFC Execution environments (NFCEE). A method for identifying an application on an NFC enabled device (200) comprising a plurality of NFC execution environments (204, 205, 206, 207) is described, wherein the application is hosted by one of the plurality of NFC execution environments (204, 205, 206, 207).

Abstract: An ejecting mechanism provides an ejecting executing portion driven by an ejecting driving portion for pushing a secondary machine out of a primary machine and for separating a secondary connector and a primary connector connected to each other. It allows the secondary machine to be ejected out of the primary machine automatically and prevents damage of the secondary connector and the primary connector caused by applying an external pulling force on the secondary machine directly. Furthermore, when a first external force overcomes a resilient driving force to push the secondary machine into a slot, the ejecting executing portion contacting with the secondary machine swings toward a rear end of a connecting surface of the primary connector. Additionally, an ejecting locking portion moving with the swing of the ejecting executing portion can be locked by a locking executing portion, such that the automatic ejection of the secondary machine is restrained.

Abstract: A data report process method and a device thereof are disclosed. The computer technology field is related for resolving issues that the data report of prior art which can hardly satisfy self demands of various application programs with few demonstration possibilities. The method comprises: receiving and demonstrating preset element configuration information; receiving a configuration content selected in the element configuration information by an user; establishing the data report, and configuring respective elements in the data report according to the configuration content, and the data report comprises index information; obtaining data content corresponding to respective indexes in the index information according to the index information; writing the data content in the data report. The present invention is applied to data analysis service.

Abstract: An apparatus for automatic placement of gaskets on a housing includes a base, the second feeding mechanism, a first detecting member, a bearing mechanism, an assembly mechanism, and a controller. The first detecting member can detect the position of the gaskets relative to the preset position. The detected results are transmitted to the controller by the first detecting member. The controller controls the second feeding mechanism to accurately adjust the position of the gaskets to preset position. Therefore, a projection of the gasket is accurately engaged in a mounting hole of the housing by the assembly mechanism.

Abstract: A printed circuit board structure comprises a base layer, an insulation layer, and a signal layer sandwiched between the base layer and the insulation layer. The insulation layer includes a plurality of conductive regions. The conductive regions are used for providing a current reflowing path. Each of the conductive regions comprises a plurality of empty regions which are spaced from each other. A space inside the empty region is substantially hollow, and spaces between adjacent empty region are filled with cooper.

Abstract: An approach for unit testing an Enterprise JavaBeans® (EJB®) bean is presented. A test case for unit testing the EJB® bean is initiated. An indication of a JUnit or an in-container testing mode is received. The unit testing of the EJB® bean in the indicated mode is initiated by injecting the EJB® bean by an injection functionality included in a test framework if the JUnit testing mode is indicated, or by an EJB® container if the in-container testing mode is indicated. A test object in the injected EJB® bean operates business logic on business data by inserting, updating or deleting business data, or by selecting business data to send to a client, thereby generating a set of resulting business data. An assertion operation on the set of resulting business data against expected data determines whether the test case succeeds or fails.

Abstract: A printed circuit board (PCB) includes an edge-component welded to the edge, which includes a plurality of pins. The PCB includes a base board and at least one slot set at edges of the base board. The pins are plugged into the base board through the at least one slot, the at least one slot is set right below the pins, and the position of the at least one slot is designed without copper pouring. In production, copper foil in the at least one slot is cut off, preventing the pins from touching the copper foil on the base board.

Abstract: An electronic device includes a casing with plurality of openings, a printed circuit board (PCB), a heat radiation member, and a conductive member. The PCB with at least one heating element and a plurality of connectors is received in the casing. The heat radiation member is mounted on the PCB and received in the casing. The conductive member is connected with the connectors and the heat radiation member. The connectors correspond to the openings in a one-to-one relationship. Each of the connectors is partly inserted into the corresponding openings. The heat radiation member conducts the heat generated by the heating element to the connectors for dissipating the heat to the outside of the electronic device through the corresponding openings.

Abstract: An infrared emitting diode driving circuit includes a first resistor includes a first terminal and a second terminal, a second resistor, and a transistor with the emitter grounded via the second resistor. The circuit further includes an infrared emitting diode with the anode connected to a power source and the cathode connected to the collector of the transistor. A control chip of the circuit turns the transistor on and off. The control chip is connected to a first terminal of the first resistor. The circuit further includes a voltage clamping unit to clamp voltage at the base of the transistor to a fixed value. One end of the voltage clamping unit is connected to the second terminal of the first resistor and the base of the transistor, and another end of the voltage clamping unit is grounded.

Abstract: An infrared control method is configured to remotely control a plurality of terminals via a remote control of an electronic device. The electronic device includes a first communication unit, a second communication unit, a storage unit storing an ID code of each terminal. The method includes the following steps. Obtaining a remote signal from the remote control received via the first communication unit and decoding the obtained remote signal. In addition, an ID code of a currently controlled terminal is obtained from the storage unit and then a control signal recognizable by the currently controlled terminal according to the decoded remote signal and the ID code of the currently controlled terminal is generated. Then, the generated control signal is sent to the currently controlled terminal via the second communication unit to direct the determined terminal to take an action.

Abstract: A printed circuit board structure comprises a base layer, an insulation layer, and a signal layer sandwiched between the base layer and the insulation layer. The insulation layer includes a plurality of conductive regions. The conductive regions are used for providing a current reflowing path. Each of the conductive regions comprises a plurality of empty regions which are spaced from each other. A space inside the empty region is substantially hollow, and spaces between adjacent empty region are filled with cooper.

Abstract: An electronic device comprises a control unit, a power supply, a switch unit, a driving unit, and an illumination unit. The control unit generates a pulse width modulation (PWM) signal with a first level signal and a second level signal. The switch unit establishes a connection between the power supply and the driving unit or cuts off the connection in response to the PWM signal. The driving unit generates a variable driving voltage. The illumination unit emits light when the variable driving voltage is more than a first predetermine value, and the brightness of the illumination unit is gradually changed in response to the variable driving voltage.

Abstract: An electronic device connected to a power supply comprises a load, an protection module, and an indicating circuit. The protection module is connected between the power supply and the load, and is capable of establishing a connection between the power supply and the load or cutting off the connection. The indicating circuit connected to the power supply and the protection module is capable of outputting different indicating information based on different states of the protection module. When the protection module establishes the connection between the power supply and the load, the indicating circuit outputs first indicating information. When the protection module cuts off the connection between the power supply and the load, the indicating circuit outputs second indicating information.

Abstract: The present document relates to Near Field Communication (NFC). In particular, the present document relates to the routing of application related information in a system comprising multiple NFC Execution environments (NFCEE). A method for identifying an application on an NFC enabled device (200) comprising a plurality of NFC execution environments (204, 205, 206, 207) is described, wherein the application is hosted by one of the plurality of NFC execution environments (204, 205, 206, 207).

Abstract: An approach for unit testing an Enterprise JavaBeans® (EJB®) bean is presented. A test case for unit testing the EJB® bean is initiated. An indication of a JUnit or an in-container testing mode is received. The unit testing of the EJB® bean in the indicated mode is initiated by injecting the EJB® bean by an injection functionality included in a test framework if the JUnit testing mode is indicated, or by an EJB® container if the in-container testing mode is indicated. A test object in the injected EJB® bean operates business logic on business data by inserting, updating or deleting business data, or by selecting business data to send to a client, thereby generating a set of resulting business data. An assertion operation on the set of resulting business data against expected data determines whether the test case succeeds or fails.

Abstract: An electronic device receives a voltage from a power source. The electronic device comprises a voltage converting module, an energy storing module, a switching module, and an illuminating module. The voltage converting module converts the voltage provided by the power source into a working voltage. The energy storing module is capable of being charged by the working voltage. The switching module is connected between the voltage converting module and the illuminating module. The illuminating module is capable of emitting light for indicating the voltage of the energy storing module. When the working voltage is suddenly changed, the switching module turns off and cuts off an electrical connection between the voltage converting module and the illuminating module. The illuminating module stops emitting light.

Abstract: A printed circuit board includes a first conductive metal layer, a ground layer and a first insulating layer arranged between the first conductive metal layer and the ground layer. A through-hole runs through the first conductive metal layer, the first insulating layer and the ground layer. The through-hole is configured for an insertion of a ground pin of an electronic component. A second insulation layer is formed on an inside wall of the first conductive metal layer in the through-hole, thereby the ground pin inserted in the through-hole being insulated from the first conductive metal layer. A second conductive metal layer is formed on an inside wall of the ground layer and an inside wall of the first insulating layer in the through-hole, to electrically connect the ground pin to the ground layer, to provide a ground path for the electronic component.

Abstract: An infrared remotely controlled circuit employed in an electronic device which includes a display panel and a host machine. The infrared remotely controlled circuitry includes a first remotely controlled circuit, a second remotely controlled circuit, and a microprogrammed control unit (MCU). The first remotely controlled circuit includes a first infrared receiver for mounting in the display panel and a first diode with the cathode connected to a first port of the first infrared receiver. The second remotely controlled circuit includes a second infrared receiver for mounting in the host machine and a second diode with the cathode connected to a first port of the second infrared receiver. The MCU is connected to the anode of the first diode to form a first signal input port and the anode of the second diode to form a second signal input port.

Abstract: A print circuit board (PCB) includes a first surface defining a number of first pads and a second surface defining a number of second pads. The number of the first pads is equal to the number of the second pads. Each first pad corresponds to one second pad and the first pad and the corresponding second pad form a pair of pads. Each pair of pads defines at least one via hole and each of the via hole connects the first pad and the second pad of each pair of pads.