Patents by Inventor Haitao Cheng

Haitao Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11980058
    Abstract: A display substrate, a preparation method thereof, and a display apparatus are provide. The display substrate includes: a base substrate, an active layer disposed on the base substrate, a first gate insulating layer disposed on the active layer, a first conductive layer disposed on the first gate insulating layer, and a second conductive layer disposed on the first conductive layer and electrically connected with the first conductive layer; an orthographic projection of the first conductive layer on the base substrate does not overlap with an orthographic projection of the active layer on the base substrate; the second conductive layer includes gates; orthographic projections of the gates on the base substrate and the orthographic projection of the active layer on the base substrate have an overlap area; and the display substrate further includes: at least one insulating layer located between the first conductive layer and the gates.
    Type: Grant
    Filed: September 27, 2021
    Date of Patent: May 7, 2024
    Assignees: HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Haitao Wang, Qinghe Wang, Jun Wang, Tongshang Su, Jun Cheng
  • Patent number: 11859685
    Abstract: A formation method for liquid rubber composite nodes with middle damping holes is provided. The formation method includes adding a middle spacer sleeve between an outer sleeve and a mandrel, bonding the middle spacer sleeve and the mandrel together through rubber vulcanization, and assembling the integrated middle spacer sleeve and the mandrel into the outer sleeve; forming damping through holes which penetrate through the mandrel on the mandrel; hollowing the middle spacer sleeve to form a plurality of spaces; after vulcanization, forming a plurality of interdependent liquid cavities by using rubber and the plurality of spaces; and arranging liquid in the plurality of liquid cavities and communicating the plurality of liquid cavities through the damping through holes.
    Type: Grant
    Filed: August 18, 2020
    Date of Patent: January 2, 2024
    Assignee: ZHUZHOU TIMES RUIWEI ANTI-VIBERATION EQUIPMENT LIMITED
    Inventors: Jun Luo, Haitao Cheng, Wensong Liu, Sheng Lin, Wansheng Feng, Junhui Chen, Zhongsan Jiang, Yuxiang Zhang
  • Publication number: 20230204087
    Abstract: A hydraulic composite bushing includes: a core shaft, with a continuously spiral fluid channel groove; a rubber member, arranged around the core shaft, and having two recesses formed radially outside of the fluid channel groove and radially opposite to each other; a support ring arranged around the rubber member; an outer cover pressing on the support ring from a radially outer side thereof; and a sealing device provided at each end of a fluid channel tube arranged within the fluid channel groove. Two ends of the fluid channel tube pass through the rubber member radially to extend into two hydraulic chambers respectively, with the hydraulic chambers in communication with each other through the fluid channel tube. One end of the sealing device is arranged inside the flow channel groove and the other end thereof passes through the rubber member to extend into the hydraulic chambers.
    Type: Application
    Filed: September 30, 2020
    Publication date: June 29, 2023
    Inventors: Xingwu DING, Jiling BU, Haitao CHENG, Wensong LIU, Bo ZOU, Jun LUO, Feng WANG, Jicao ZOU, Zhangyang XIA
  • Publication number: 20230167876
    Abstract: A hydraulic composite bushing, a flow channel for same, and a method for forming the flow channel, wherein the hydraulic composite bushing includes: a core shaft; a rubber member, arranged on an outer peripheral surface of the core shaft and provided with two recesses diametrically opposite to each other; two support rings arranged around the rubber member; and an outer casing press-fitted on the support rings from a radially outer side thereof through interference fit. The outer casing covers the recesses to form two hydraulic chambers for accommodating hydraulic fluid between the rubber member and the outer casing, and the support ring is provided with a flow channel for the hydraulic fluid, so that two hydraulic chambers are in communication with each other via the flow channel. A sealing device is provided at a connection between the outer casing and each of the recesses to seal each hydraulic chamber.
    Type: Application
    Filed: September 30, 2020
    Publication date: June 1, 2023
    Inventors: Xingwu DING, Jiling BU, Haitao CHENG, Bo ZOU, Zhangyang XIA, Jicao ZOU
  • Patent number: 11639561
    Abstract: A method for preparing continuous bamboo fibers, which relates to a technical field of bamboo fiber preparation. The method includes processing bamboo raw materials into reticulated bamboo fiber strips, screening the bamboo fiber strips, dividing the reticulated bamboo fiber strips with different properties according to product requirements, performing high pressure splitting on the reticulated bamboo fiber strips which conforms to a screening condition, separating the bamboo fibers with different slenderness ratios from the bamboo fiber strips after the high pressure splitting is performed, forming a partial oriented bamboo fiber mat with uniform density by the bamboo fibers, forming an oriented bamboo fiber bundle with uniform linear density by the bamboo fiber mat, twisting the bamboo fiber bundle to form a bamboo fiber yarn, forming a rope by the bamboo fiber yarn, and forming a spindle based on a specifications.
    Type: Grant
    Filed: January 5, 2021
    Date of Patent: May 2, 2023
    Assignee: International Center for Bamboo and Rattan
    Inventors: Haitao Cheng, Mingpeng Li, Ge Wang, Wenfu Zhang, Shaohua Gu
  • Patent number: 11393619
    Abstract: A transformer has a first inductor that includes a first port. The transformer also has a second inductor magnetically coupled to the first inductor. The second inductor includes a second port. The second inductor includes a first portion configured to permit current flow in a clockwise direction and a second portion configured to permit current flow in a counter-clockwise direction. The transformer also has a third inductor magnetically coupled to the first inductor. The third inductor includes a third port. The counter-clockwise direction is opposite the clockwise direction to reduce magnetic coupling between the second inductor and the third inductor based on magnetic coupling cancellation.
    Type: Grant
    Filed: October 26, 2018
    Date of Patent: July 19, 2022
    Assignee: QUALCOMM Incorporated
    Inventors: Haitao Cheng, Sherif Mahmoud Shakib Roshdy, Abbas Abbaspour-Tamijani, Chinmaya Mishra
  • Publication number: 20220196108
    Abstract: A formation method for liquid rubber composite nodes with middle damping holes is provided. The formation method includes adding a middle spacer sleeve between an outer sleeve and a mandrel, bonding the middle spacer sleeve and the mandrel together through rubber vulcanization, and assembling the integrated middle spacer sleeve and the mandrel into the outer sleeve; forming damping through holes which penetrate through the mandrel on the mandrel; hollowing the middle spacer sleeve to form a plurality of spaces; after vulcanization, forming a plurality of interdependent liquid cavities by using rubber and the plurality of spaces; and arranging liquid in the plurality of liquid cavities and communicating the plurality of liquid cavities through the damping through holes.
    Type: Application
    Filed: August 18, 2020
    Publication date: June 23, 2022
    Applicant: ZHUZHOU TIMES RUIWEI ANTI-VIBERATION EQUIPMENT LIMITED
    Inventors: Jun LUO, Haitao CHENG, Wensong LIU, Sheng LIN, Wansheng FENG, Junhui CHEN, Zhongsan JIANG, Yuxiang ZHANG
  • Patent number: 11302773
    Abstract: A low cost capacitor (e.g., metal-insulator-metal (MIM) capacitor) is included in the back-end-of-line layers for effective routing and area savings. The capacitor has a first electrode (e.g., a first terminal of the capacitor) including a conductive back-end-of-line (BEOL) layer and a second electrode (e.g., a second terminal of the capacitor) including a nitride-based metal. The capacitor also has an etch stop layer (e.g., a dielectric of the capacitor) between the first electrode and the second electrode.
    Type: Grant
    Filed: October 9, 2018
    Date of Patent: April 12, 2022
    Assignee: Qualcomm Incorporated
    Inventors: Ye Lu, Junjing Bao, Haitao Cheng, Chao Song
  • Patent number: 11287007
    Abstract: A prepressed emergency air spring assembly includes an upper cover plate, an air bag, an upper end plate and a lower end plate. The periphery of the upper end plate is connected with an outer periphery of the lower end plate through the air bag. A steel spring is arranged between the upper cover plate and the upper end plate in a pressing mode. A plurality of hourglass elastomers are arranged between the upper cover plate and the upper end plate along a circumferential direction of the steel spring.
    Type: Grant
    Filed: August 2, 2018
    Date of Patent: March 29, 2022
    Assignee: ZHUZHOU TIMES NEW MATERIAL TECHNOLOGY CO., LTD.
    Inventors: Duomin Nong, Te Ye, Canhui Chen, Haitao Cheng, Jun Zhou, Qiang Chen, Guoqi Duan, Qinghua Chen, Yaokun Long
  • Patent number: 11289365
    Abstract: Certain aspects of the present disclosure generally relate to a semiconductor device including an air gap underneath passive devices. The semiconductor device generally includes a substrate layer, a passive device layer, and a dielectric layer disposed between the substrate layer and the passive device layer, wherein the dielectric layer includes an air gap disposed beneath at least one passive device in the passive device layer.
    Type: Grant
    Filed: November 7, 2019
    Date of Patent: March 29, 2022
    Assignee: Qualcomm Incorporated
    Inventors: Junjing Bao, Ye Lu, Haitao Cheng
  • Patent number: 11287005
    Abstract: An hourglass type air spring assembly includes an upper cover plate, an air bag, an upper end plate and a lower end plate. An outer periphery of the upper cover plate is connected with an outer periphery of the upper end plate through the air bag. A low-position hourglass elastomer and a high-position elastomer which are integrally formed are connected with each other between the upper end plate and the lower end plate. An annular notch is formed between the low-position hourglass elastomer and the high-position elastomer, and an annular rigid partition plate matched with the annular notch is arranged in the annular notch.
    Type: Grant
    Filed: August 2, 2018
    Date of Patent: March 29, 2022
    Assignee: ZHUZHOU TIMES NEW MATERIAL TECHNOLOGY CO., LTD.
    Inventors: Wenhai Chen, Te Ye, Canhui Chen, Haitao Cheng, Xuan Peng, Zhuangbing Jin, Jun Zhou, Qiang Chen
  • Patent number: 11287006
    Abstract: An emergency air spring assembly includes an upper cover plate, an air bag, an upper end plate and a lower end plate. An outer periphery of the upper end plate is connected with an outer periphery of the lower end plate through the air bag. An hourglass elastomer is connected between the upper cover plate and the upper end plate. A plurality of steel springs are arranged between the upper cover plate and the upper end plate in a circumferential direction of the sand clock elastomer in a pressing mode.
    Type: Grant
    Filed: August 2, 2018
    Date of Patent: March 29, 2022
    Assignee: ZHUZHOU TIMES NEW MATERIAL TECHNOLOGY CO., LTD.
    Inventors: Duomin Nong, Te Ye, Canhui Chen, Haitao Cheng, Jun Zhou, Qiang Chen, Guoqi Duan, Qinghua Chen, Yaokun Long
  • Patent number: 11287010
    Abstract: A combined air spring system includes an upper cover plate, an air bag, an upper end plate and a lower end plate. An outer periphery of the upper cover plate is connected with an outer periphery of the upper end plate through the air bag. A low-position sand clock elastomer is connected between the upper end plate and the lower end plate. A pressing plate is installed at a bottom portion of the upper cover plate, and a high-position elastomer is connected between the upper cover plate and the pressing plate. A limiting table is arranged at a bottom portion of the pressing plate. A limiting groove is formed in a top face of the upper end plate. The limiting table is located in the limiting groove in a deflated state.
    Type: Grant
    Filed: August 2, 2018
    Date of Patent: March 29, 2022
    Assignee: ZHUZHOU TIMES NEW MATERIAL TECHNOLOGY CO., LTD.
    Inventors: Te Ye, Duomin Nong, Canhui Chen, Haitao Cheng, Jun Zhou, Qiang Chen, Wenhai Chen, Zhuangbing Jin, Xuan Peng
  • Publication number: 20220011008
    Abstract: The disclosure relates to the technical field of air ducts, and in particular to a weather-resistant plant fiber-reinforced air duct with a multi-layer wall, and a preparation method thereof. The weather-resistant plant fiber-reinforced air duct with a multi-layer wall includes an outer isolation layer, a plant fiber-reinforced thermal insulation layer, a moisture-proof layer and a sealing layer that are arranged in sequence from inside to outside. The plant fiber-reinforced thermal insulation layer is prepared by the paving and laminating of surface fiber foam materials and core fiber foam materials or by the winding and molding of glass fibers and plant fibers. An outer isolation layer is adopted to protect the plant fiber-reinforced thermal insulation layer from being damaged by rubbing, and the moisture-proof layer and the sealing layer are adopted to ensure that the air does not leak out.
    Type: Application
    Filed: July 8, 2020
    Publication date: January 13, 2022
    Inventors: Haitao CHENG, Wenfu ZHANG, Ge WANG, Cuicui WANG, Shaohua GU, Haijun ZHENG
  • Publication number: 20210363662
    Abstract: A method for preparing continuous bamboo fibers, which relates to a technical field of bamboo fiber preparation. The method includes processing bamboo raw materials into reticulated bamboo fiber tapes, screening the bamboo fiber tapes, dividing the reticulated bamboo fiber tapes with different properties according to product requirements, performing high pressure splitting on the reticulated bamboo fiber tapes which conforms to a screening condition, separating the bamboo fibers with different slenderness ratios from the bamboo fiber tapes after the high pressure splitting is performed, forming a partial oriented bamboo fiber mat with uniform density by the bamboo fibers, forming an oriented bamboo fiber bundle with uniform linear density by the bamboo fiber mat, twisting the bamboo fiber bundle to form a bamboo fiber yarn, forming a rope by the bamboo fiber yarn, and forming a spindle based on a specifications.
    Type: Application
    Filed: January 5, 2021
    Publication date: November 25, 2021
    Inventors: Haitao CHENG, Mingpeng LI, Ge WANG, Wenfu ZHANG, Shaohua GU
  • Patent number: 11073189
    Abstract: A pre-compression type emergency air spring assembly includes an upper cover plate, an air bag, an upper end plate, and a lower end plate. A periphery of the upper end plate is connected with a periphery of the lower end plate through the air bag. A top part of the upper end plate is provided with transverse pre-compression cavities and transverse pre-compression plates arranged at transverse openings of the transverse pre-compression cavities. The transverse pre-compression cavities are internally provided with laminated spring elastomers through the transverse pre-compression plates in a pressing mode. Multiple steel springs are arranged between the upper cover plate and the upper end plate in a pressing mode along a circumferential direction of the laminated spring elastomers. The upper cover plate is arranged on a periphery of the transverse pre-compression cavities in a sleeving mode.
    Type: Grant
    Filed: August 2, 2018
    Date of Patent: July 27, 2021
    Assignee: ZHUZHOU TIMES NEW MATERIAL TECHNOLOGY CO., LTD.
    Inventors: Duomin Nong, Te Ye, Canhui Chen, Haitao Cheng, Jun Zhou, Qiang Chen, Guoqi Duan, Qinghua Chen, Yaokun Long
  • Publication number: 20210143050
    Abstract: Certain aspects of the present disclosure generally relate to a semiconductor device including an air gap underneath passive devices. The semiconductor device generally includes a substrate layer, a passive device layer, and a dielectric layer disposed between the substrate layer and the passive device layer, wherein the dielectric layer includes an air gap disposed beneath at least one passive device in the passive device layer.
    Type: Application
    Filed: November 7, 2019
    Publication date: May 13, 2021
    Inventors: Junjing BAO, Ye LU, Haitao CHENG
  • Patent number: 11004784
    Abstract: Certain aspects of the present disclosure provide a metal-on-metal (MoM) capacitor with metal layers, each layer having two different electrical conductors with orthogonally-arranged conductive arteries and orthogonally-oriented conductive fingers. One exemplary MoM capacitor generally includes a plurality of metal layers, wherein a first metal layer in the plurality of metal layers comprises a first electrical conductor providing a first node of the MoM capacitor and a second electrical conductor providing a second node of the MoM capacitor. According to aspects, the first electrical conductor comprises a first plurality of conductive fingers and the second electrical conductor comprises a second plurality of conductive fingers. Further, conductive fingers of the first plurality of conductive fingers are interdigitated with conductive fingers of the second plurality of conductive fingers.
    Type: Grant
    Filed: October 12, 2018
    Date of Patent: May 11, 2021
    Assignee: QUALCOMM Incorporated
    Inventors: Haitao Cheng, Ye Lu, Chao Song
  • Patent number: 10972068
    Abstract: An integrated circuit (IC) device includes a first resistive strip having an input terminal and an output terminal. The IC device further includes a second resistive strip having a terminal coupled to a voltage. The second resistive strip may be coplanar with the first resistive strip. The IC device further includes a capacitor formed by the first resistive strip and the second resistive strip.
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: April 6, 2021
    Assignee: QUALCOMM Incorporated
    Inventors: Chao Song, Haitao Cheng, Ye Lu, Dongjiang Qiao
  • Patent number: 10896949
    Abstract: Aspects generally relate to adjusting, or lowering, the Q of an inductor. In one embodiment, an integrated circuit includes an inductor and a conductive closed ring inside a periphery of the inductor. In another embodiment, there can be a plurality of closed rings inside the periphery of the inductor. The conductive closed rings are magnetically coupled to the inductor to adjust the Q.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: January 19, 2021
    Assignee: QUALCOMM Incorporated
    Inventors: Haitao Cheng, Chao Song, Ye Lu