Abstract: To simplify the burn-in process and reduce its cost for a surface-emitting type wafer and its manufacturing method, and for a burn-in method for a surface-emitting type wafer. A surface-emitting type wafer includes a substrate 10 and a plurality of surface-emitting type elements 1 formed above the substrate 10. Each of the surface-emitting type elements 1 includes a light emitting element section 20, first and second electrodes 30, 32 for driving the light emitting element section 20, and a rectification element section 40. The rectification element section 40 is connected in parallel between the first and second electrodes 30, 32, and has a rectification action in a reverse direction with respect to the light emitting element-section 20. The plurality of surface-emitting type elements 1 are connected in series in a direction in which forward directions of the respective light emitting element sections 20 coincide with one another.

Abstract: To prevent electrostatic breakdown and improve reliability concerning surface-emitting type devices and methods for manufacturing the same.

Abstract: To provide a optical element array in which a plurality of optical elements can be monolithically integrated, and each of the optical elements can be independently driven.

Abstract: A method is provided to provide a photodetector that can enhance the light receiving sensitivity with a relatively simple structure, and that can maintain a high speed responsiveness. A photodetector having a MSM (Metal-Semiconductor-Metal) structure, including a substrate, a multilayer film that is disposed over the substrate and includes a low refractive index layer and a high refractive index layer that are alternately laminated as a unit cycle. At least one of the low refractive index layer and the high refractive index layer is a photoabsorption layer composed of semiconductor, and a portion that is embedded in the multilayer film, the portion having at least one pair of opposing electrodes within the multilayer film.

Abstract: To provide a light-receiving element that is capable of high-speed operation and includes an optical element with controlled setting position, shape and size, a manufacturing method for the light-receiving element, and an optical module and an optical transmitting device including the light-receiving element, a light-receiving element includes a base member provided over a light-receiving surface, and an optical element provided on a top surface of the base member.

Abstract: To provide a light-receiving element capable of high-speed operation including an optical member whose setting position, shape and size are advantageously controlled and its manufacturing method, and an optical module and an optical transmitting device including the light-receiving element, a light-receiving element includes a columnar part provided in a substrate. A top surface of the columnar part includes a receiving surface, and an optical member is provided on the top surface of the columnar part. The columnar part includes a first conductive type layer, a light absorbing layer, and a second conductive type layer. The light absorbing layer is formed between the first conductive type layer and the second conductive type layer.