Abstract: A stacked via structure including a first dielectric layer, a first conductive via, a first redistribution wiring, a second dielectric layer and a second conductive via is provided. The first dielectric layer includes a first via opening. The first conductive via is in the first via opening. A first level height offset is between a top surface of the first conductive via and a top surface of the first dielectric layer. The first redistribution wiring covers the top surface of the first conductive via and the top surface of the first dielectric layer. The second dielectric layer is disposed on the first dielectric layer and the first redistribution wiring. The second dielectric layer includes a second via opening. The second conductive via is in the second via opening. The second conductive via is electrically connected to the first redistribution wiring through the second via opening of the second dielectric layer.

Abstract: According to implementations of the subject matter described herein, a solution is proposed for three-dimensional (3D) object detection. In this solution, feature representations of a plurality of points are extracted from point cloud data related to a 3D object. Initial feature representations of a set of candidate 3D objects are determined based on the feature representations of the plurality of points. Based on the feature representations of the plurality of points and the initial feature representations of the set of candidate 3D objects, a detection result for the 3D object is generated by determining self-correlations between the set of candidate 3D objects and cross-correlations between the plurality of points and the set of candidate 3D objects. In this way, without grouping points into candidate 3D objects, the 3D object in a 3D scene can be localized and recognized based on the self-correlations and cross-correlations.

Abstract: Method, computer program product, and computer system are provided. Traffic is collected against a NoSQL database by an activity collector. A database transaction log is periodically extracted and analyzed. The collected traffic and the analyzed database transaction log are input to building a knowledge base of database access patterns. Current traffic is captured and used to compute an activity threshold. Traffic is directed to a workload processor based on the activity threshold. Traffic is directed to an intensive insert/update/delete (IUD) processor in response to the activity threshold exceeding a configured threshold. A plurality of temporary shards is generated along with an adaptive key and adaptive index in the plurality of temporary shards. The intensive IUD processor traffic is re-directed to the plurality of temporary shards while the activity threshold exceeds the configured threshold.

Abstract: A method includes the following steps. A photoresist is exposed to a first light-exposure through a first mask, wherein the first mask includes a first stitching region, and a first portion of the photoresist corresponding to a first opaque portion of the first stitching region is unexposed. The photoresist is exposed to a second light-exposure through a second mask, wherein the second mask includes a second stitching region, and a second portion of the photoresist corresponding to a second opaque portion of the second stitching region is unexposed and is overlapping with the first portion of the photoresist.

Abstract: Provided are a package structure and a method of forming the same. The method includes: forming an interconnect structure on a substrate; performing a laser grooving process to form a first opening in the interconnect structure and form a debris layer on a sidewall of the first opening in a same step; forming a protective layer to fill in the first opening and cover the debris layer and the interconnect structure; patterning the protective layer to form a second opening, wherein the second opening is spaced from the debris layer by the protective layer; performing a planarization process on the protective layer to expose a topmost contact pad of the interconnect structure; and performing a mechanical dicing process through the second opening to form a third opening in the substrate and cut the substrate into a plurality of semiconductor dies.

Abstract: A scheme for modifying an image is disclosed, which includes receiving a source image having a first image configuration; determining a second image configuration for a target image; providing the received source image to an AI engine trained to identify, based on a set of rules related to visual features, candidate regions from the source image; generating proposal images based on the candidate regions, respectively; determining, based on prior aesthetical evaluation data, an aesthetical value of each regional proposal image; and selecting, based on the determined aesthetical value of each regional proposal image, one of the regional proposal images as the target image; extracting, from the AI engine, the target image; and causing the target image to be displayed via a display of a user device.

Abstract: Aspects of the subject technology relate to systems, methods, and computer-readable media for identifying a wellbore pressure based on a predicted pump intake loss. A pump intake pressure after an intake for a submersible pump deployed downhole in a wellbore is identified. An intake loss prediction model for identifying a virtual intake loss associated with the intake for the submersible pump as a function of one or more intake loss parameters is accessed. The virtual intake loss is identified by applying the intake loss prediction model based on intake loss prediction input of the one or more intake loss parameters. A pump intake pressure before the intake for the submersible pump is determined based on the virtual intake loss and the identified pump intake pressure after the intake.

Abstract: A semiconductor device having a redistribution structure and a method of forming the same are provided. A semiconductor device includes a semiconductor structure, a redistribution structure over and electrically coupled the semiconductor structure, and a connector over and electrically coupled to the redistribution structure. The redistribution structure includes a base via and stacked vias electrically interposed between the base via and the connector. The stacked vias are laterally spaced apart from the base via.

Abstract: In an embodiment, a device includes: a molding compound; an integrated circuit die encapsulated in the molding compound; a through via adjacent the integrated circuit die; and a redistribution structure over the integrated circuit die, the molding compound, and the through via, the redistribution structure electrically connected to the integrated circuit die and the through via, the redistribution structure including: a first dielectric layer disposed over the molding compound; a first conductive via extending through the first dielectric layer; a second dielectric layer disposed over the first dielectric layer and the first conductive via; and a second conductive via extending through the second dielectric layer and into a portion of the first conductive via, an interface between the first conductive via and the second conductive via being non-planar.

Abstract: A device includes a sensor die having a sensing region at a top surface of the sensor die, an encapsulant at least laterally encapsulating the sensor die, a conductive via extending through the encapsulant, and a front-side redistribution structure on the encapsulant and on the top surface of the sensor die, wherein the front-side redistribution structure is connected to the conductive via and the sensor die, wherein an opening in the front-side redistribution structure exposes the sensing region of the sensor die, and wherein the front-side redistribution structure includes a first dielectric layer extending over the encapsulant and the top surface of the sensor die, a metallization pattern on the first dielectric layer, and a second dielectric layer extending over the metallization pattern and the first dielectric layer.

Abstract: Method, computer program product, and computer system are provided. Traffic is collected against a NoSQL database by an activity collector. A database transaction log is periodically extracted and analyzed. The collected traffic and the analyzed database transaction log are input to building a knowledge base of database access patterns. Current traffic is captured and used to compute an activity threshold. Traffic is directed to a workload processor based on the activity threshold. Traffic is directed to an intensive insert/update/delete (IUD) processor in response to the activity threshold exceeding a configured threshold. A plurality of temporary shards is generated along with an adaptive key and adaptive index in the plurality of temporary shards. The intensive IUD processor traffic is re-directed to the plurality of temporary shards while the activity threshold exceeds the configured threshold.

Abstract: An on-line detection system for defects of an MEA is provided. The detection system includes a workbench, two connecting rods are arranged inside the workbench, two ends of the two connecting rods are both connected to two side walls of the workbench by means of bearings, and conveying rollers are fixedly arranged outside the two connecting rods in a sleeving manner. One side of the workbench is fixedly provided with a first electric motor, and an output end of the first electric motor is fixedly connected to one of the connecting rods. Belt pulleys are fixedly arranged outside the two connecting rods in a sleeving manner, and a belt is arranged outside the two belt pulleys in a sleeving manner. A hollow roller is arranged on an inner side of the workbench, and a plurality of exhaust holes are provided in a top of the hollow roller.

Abstract: An HOD device, comprising: a framework; covering material, covering the frame work; at least one conductive region, provided on or in the covering material; wherein the conductive region is coupled to a capacitance detection circuit or a predetermined voltage level. The HOD device can be a vehicle control device such as a steering wheel. The conductive region comprises conductive wires which can be threads of the covering material. By this way, the arrangements of the conductive wires can be changed corresponding to the size or the shape of the frame work or any other requirements. Also, the interference caused by unstable factors can be improved since the conductive wires can be coupled to a ground source of the vehicle to provide a short capacitance sensing path.

Abstract: A sealing cover with quick-plug interface, comprising: cover body, above which a through hole is arranged, and in which a communication hole is arranged, and said through hole is connected with said communication hole; an annular sealing member and an annular fixing sleeve are arranged in said through hole, and said sealing member is arranged at the bottom of said through hole, and said fixing sleeve is arranged above said sealing member; said sealing member and said fixing sleeve are both clipped to an inner wall of the through hole, and said sealing member is made of a flexible material. There is no metal material in contact with the fluid inside the sealing cover with quick-plug interface, so there is no hidden danger of corrosion in long-term use, and the defect that the metal material is not resistant to corrosive fluids is avoided.

Abstract: A computing system including a plurality of processing devices configured to execute a Mixture-of-Experts (MoE) layer. The processing devices are configured to execute the MoE layer at least in part by receiving an input tensor including input tokens. Executing the MoE layer further includes computing a gating function output vector based on the input tensor and computing a sparse encoding of the input tensor and the gating function output vector. The sparse encoding indicates one or more destination expert sub-models. Executing the MoE layer further includes dispatching the input tensor for processing at the one or more destination expert sub-models, and further includes computing an expert output tensor. Executing the MoE layer further includes computing an MoE layer output at least in part by computing a sparse decoding of the expert output tensor. Executing the MoE layer further includes conveying the MoE layer output to an additional computing process.

Abstract: A database dependency resolver system can identify different dependencies of a user application and integrate the identified dependencies in different execution environments of a distributed database system. The different execution environments can manage different versions of a given programming language, or other types of computational architectures (e.g., different CPU types). A database user can provide a database statement (e.g., query) that activates the different dependencies in the different environments to generate results data.

Abstract: An electronic device may be provided with an antenna having a resonating element formed from a segment of peripheral conductive housing structures. A speaker may be aligned with first openings in the segment. A vent may be aligned with second openings in the segment. A connector may protrude through the segment. A trace combiner for the antenna may be patterned onto the speaker and may be coupled to the segment. Tuners for the antenna may be disposed on first and second flexible printed circuits that extend along opposing sides of the connector. The tuners may be controlled through the speaker. The second flexible printed circuit may extend along the vent. The vent may have a vent cowling with a cut-out region next to the tuner on the second flexible printed circuit.

Abstract: An electronic device may be provided with an antenna having a resonating element formed from a segment of peripheral conductive housing structures. A speaker may be aligned with first openings in the segment. A vent may be aligned with second openings in the segment. A connector may protrude through the segment. A trace combiner for the antenna may be patterned onto the speaker and may be coupled to the segment. Tuners for the antenna may be disposed on first and second flexible printed circuits that extend along opposing sides of the connector. The tuners may be controlled through the speaker. The second flexible printed circuit may extend along the vent. The vent may have a vent cowling with a cut-out region next to the tuner on the second flexible printed circuit.

Abstract: An electronic device may be provided with an antenna having a resonating element and a light source module mounted to a flexible printed circuit and a metal cowling. The module may emit light through a rear housing wall. The printed circuit may be interposed between the metal cowling and a conductive support plate in the rear housing wall. The printed circuit may include a ground trace coupled to the resonating element. A dimpled pad may couple the ground trace to the support plate. Compressive foam may be used to exert a force against the flexible printed circuit that presses the dimpled pad against the conductive support plate. The ground trace and the dimpled pad may form a return path to ground for the resonating element. The dimpled pad may occupy less height within the device than other structures such as metal springs.

Abstract: An electronic device may be provided with a sensor module and an antenna having an antenna arm, ground structures, and a tuner. The tuner may be mounted to a printed circuit overlapping the sensor module. A spring may be mounted to the printed circuit and may couple the tuner to a conductive chassis of the sensor module. The sensor module may include optical sensors that gather sensor data through a display and may form ground paths from the tuner to the ground structures. Conductive interconnect structures such as springs may exert biasing forces in different directions to couple the ground paths to different layers of the ground structures. This may serve to couple the antenna to the ground structures as close as possible to the tuner, thereby maximizing antenna performance, despite the presence of the sensor module.