Patents by Inventor Han Huang

Han Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11961093
    Abstract: A method for regulating an unmanned aerial vehicle (UAV) includes receiving a UAV identifier and one or more types of contextual information broadcasted by the UAV. The UAV identifier uniquely identifies the UAV from other UAVs. The one or more types of contextual information includes at least geographical information of the UAV. The method further includes authenticating, via an authentication device, an identity of the UAV based on the UAV identifier to determine whether the UAV is authorized for operation, and transmitting a signal to a remote device in response to determining whether the UAV is authorized for operation.
    Type: Grant
    Filed: June 20, 2022
    Date of Patent: April 16, 2024
    Assignee: SZ DJI TECHNOLOGY CO., LTD.
    Inventors: Ming Gong, Jin Dai, Hao Cui, Xiaodong Wang, Han Huang, Jun Wu, Wei Fan, Ning Ma, Xinhua Rong, Xingsen Lin
  • Patent number: 11962796
    Abstract: This disclosure describes gradient-based prediction refinement. A video coder (e.g., video encoder or video decoder) determines one or more prediction blocks for inter-predicting a current block (e.g., based on one or more motion vectors for the current block). In gradient-based prediction refinement, the video coder modifies one or more samples of the prediction block based on various factors such as displacement in a horizontal direction, the horizontal gradient, a displacement in the vertical direction, and a vertical gradient. This disclosure provides for gradient-based prediction refinement where a precision level of the displacement (e.g., at least one of the horizontal or vertical displacement) is unified (e.g., the same) for different prediction modes.
    Type: Grant
    Filed: March 31, 2020
    Date of Patent: April 16, 2024
    Assignee: QUALCOMM Incorporated
    Inventors: Han Huang, Wei-Jung Chien, Marta Karczewicz
  • Patent number: 11957752
    Abstract: The present invention relates to the technical field of photosensitizers, and particularly to a near-infrared nano-photosensitizer and a preparation method and use thereof. The near-infrared nano-photosensitizer in the present invention is modified by conjugation extension of the boron dipyrromethene core, achieving absorption and emission spectra close to the near-infrared region. A polyfluoroalkyl group and a polyethylene glycol group are introduced to the boron dipyrromethene structure to obtain an amphiphilic photosensitizer. By means of the strong fluorine-fluorine interaction between the polyfluoroalkyl group and the hydrophilic interaction of the polyethylene glycol group, a nano-photosensitive micelle with an ultra-low CMC value is ultimately constructed. Boron dipyrromethene is induced by fluorine-fluorine interaction to undergo J-aggregation, causing the maximum absorption peak to red-shift to the near-infrared region, beneficial to the deep phototherapy of tumors.
    Type: Grant
    Filed: January 25, 2022
    Date of Patent: April 16, 2024
    Assignee: SOOCHOW UNIVERSITY
    Inventors: Zhengqing Guo, Hui He, Mengke Shi, Han Xu, Dandan Ji, Yangyang Huang, Qiujin He
  • Patent number: 11961444
    Abstract: The disclosure provides a transparent display device including a display panel. The display panel includes a display area, a non-display area, and a plurality of pixels. The non-display area is adjacent to the display area. The plurality of pixels are disposed in the display area. A difference between a transmittance of the display area and a transmittance of the non-display area is less than 30% of the transmittance of the display area.
    Type: Grant
    Filed: February 3, 2023
    Date of Patent: April 16, 2024
    Assignee: Innolux Corporation
    Inventors: Yu-Chia Huang, Yuan-Lin Wu, Tsung-Han Tsai, Kuan-Feng Lee
  • Publication number: 20240115616
    Abstract: The present disclosure provides a method for treating liver cirrhosis by using a composition including mesenchymal stem cells, extracellular vesicles produced by the mesenchymal stem cells, and growth factors. The composition of the present disclosure achieves the effect of treating liver cirrhosis through various efficacy experiments.
    Type: Application
    Filed: October 4, 2023
    Publication date: April 11, 2024
    Inventors: Po-Cheng Lin, Pi-Chun Huang, Zih-Han Hong, Ming-Hsi Chuang, Yi-Chun Lin, Chia-Hsin Lee, Chun-Hung Chen, Chao-Liang Chang, Kai-Ling Zhang
  • Publication number: 20240120315
    Abstract: A semiconductor package includes a first semiconductor die and a second semiconductor die disposed laterally adjacent one another. The semiconductor package includes a semiconductor bridge overlapping a first corner of the first semiconductor die and a second corner of the second semiconductor die. The semiconductor bridge electrically couples the first semiconductor to the second semiconductor die. The semiconductor package includes a third semiconductor die and a fourth semiconductor die electrically coupled to the first semiconductor die and the second semiconductor die, respectively. The semiconductor bridge is interposed between the third semiconductor die and the fourth semiconductor die.
    Type: Application
    Filed: February 15, 2023
    Publication date: April 11, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ming-Fa Chen, Tze-Chiang Huang, Yun-Han Lee, Lee-Chung Lu
  • Publication number: 20240118526
    Abstract: An imaging system lens assembly includes a first lens group and a second lens group. The first lens group includes a first catadioptric lens element and a second catadioptric lens element, the second lens group includes at least one lens element. Each of an object-side surface and an image-side surface of the first catadioptric lens element and the second catadioptric lens element includes a central region and a peripheral region. The peripheral region of the object-side surface of the first catadioptric lens element includes a first refracting surface. The peripheral region of the image-side surface of the second catadioptric lens element includes a first reflecting surface. The central region of the object-side surface of the first catadioptric lens element includes a second reflecting surface. The central region of the image-side surface of the second catadioptric lens element includes a last refracting surface.
    Type: Application
    Filed: September 26, 2023
    Publication date: April 11, 2024
    Inventors: Shih-Han CHEN, Cheng-Yu TSAI, Hsin-Hsuan HUANG
  • Publication number: 20240118523
    Abstract: An image capturing optical lens assembly includes, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, and a sixth lens element. The first lens element with positive refractive power has a convex object-side surface. The second lens element with negative refractive power has a concave object-side surface. The third lens element has negative refractive power. The fourth lens element has refractive power. The fifth lens element with positive refractive power has a convex image-side surface. The sixth lens element with refractive power has a concave image-side surface, wherein an object-side surface and the image-side surface of the sixth lens element are aspheric, and the sixth lens element has at least one inflection point on the image-side surface thereof.
    Type: Application
    Filed: December 12, 2023
    Publication date: April 11, 2024
    Inventors: Tsung-Han TSAI, Hsin-Hsuan HUANG
  • Publication number: 20240121426
    Abstract: Encoding and decoding video data using an affine decoder side motion vector derivation (DMVR) mode includes receiving a block of video data to be decoded using the affine DMVR mode, and dividing the block into a plurality of subblocks. A video encoder and video decoder may determine a final offset for the affine DMVR mode using a first subset of the plurality of subblocks. The video encoder and decoder may code the block of video data using the final offset to generate a coded block of video data.
    Type: Application
    Filed: September 14, 2023
    Publication date: April 11, 2024
    Inventors: Han Huang, Yan Zhang, Zhi Zhang, Vadim Seregin, Marta Karczewicz
  • Publication number: 20240119749
    Abstract: Systems and methods of monitoring inventory of a product storage facility include an image capture device configured to move about the product storage areas of the product storage facility and capture images of the product storage areas from various angles. A computing device coupled to the image capture device obtains the images of the product storage areas captured by the image capture device and processes the obtained images of the product storage areas to detect individual products captured in the obtained images. Based on detection of the individual products captured in the images, the computing device analyzes each of the obtained images to extract meta data from the packaging the individual products to detect one more keywords and determine the locations of the detected keywords on the packaging, and then utilize this information to predict an identity of the products associated with the packaging.
    Type: Application
    Filed: October 11, 2022
    Publication date: April 11, 2024
    Inventors: Lingfeng Zhang, Han Zhang, Abhinav Pachauri, Amit Jhunjhunwala, Ashlin Ghosh, Avinash Madhusudanrao Jade, Raghava Balusu, Srinivas Muktevi, Mingquan Yuan, Zhaoliang Duan, Zhiwei Huang, Tianyi Mao
  • Publication number: 20240121399
    Abstract: An example device for decoding video data includes a memory configured to store video data; and a processing system comprising one or more processors implemented in circuitry, the processing system being configured to: refine a first control point motion vector (CPMV) of a current block of the video data using a first decoder-side motion vector refinement (DMVR) process to form a first refined CPMV for the current block; refine a second CPMV of the current block of video data using a second DMVR process, independently of the first DMVR process, to form a second refined CPMV for the current block; form a prediction block for the current block using the first refined CPMV and the second refined CPMV; and decode the current block using the prediction block. In some examples, the CPMVs may each be decoded using a respective merge index and a respective motion vector difference (MVD).
    Type: Application
    Filed: September 28, 2023
    Publication date: April 11, 2024
    Inventors: Han Huang, Vadim Seregin, Marta Karczewicz, Yan Zhang
  • Patent number: 11955397
    Abstract: A semiconductor structure is provided. The semiconductor structure includes a substrate, a channel layer, a barrier layer, a compound semiconductor layer, a gate electrode, and a stack of dielectric layers. The channel layer is disposed on the substrate. The barrier layer is disposed on the channel layer. The compound semiconductor layer is disposed on the barrier layer. The gate electrode is disposed on the compound semiconductor layer. The stack of dielectric layers is disposed on the gate electrode. The stack of dielectric layers includes layers having different etching rates.
    Type: Grant
    Filed: November 9, 2020
    Date of Patent: April 9, 2024
    Assignee: Vanguard International Semiconductor Corporation
    Inventors: Shin-Cheng Lin, Cheng-Wei Chou, Ting-En Hsieh, Yi-Han Huang, Kwang-Ming Lin, Yung-Fong Lin, Cheng-Tao Chou, Chi-Fu Lee, Chia-Lin Chen, Shu-Wen Chang
  • Patent number: 11955336
    Abstract: Method of manufacturing a semiconductor device, includes forming a protective layer over substrate having a plurality of protrusions and recesses. The protective layer includes polymer composition including polymer having repeating units of one or more of: Wherein a, b, c, d, e, f, g, h, and i are each independently H, —OH, —ROH, —R(OH)2, —NH2, —NHR, —NR2, —SH, —RSH, or —R(SH)2, wherein at least one of a, b, c, d, e, f, g, h, and i on each repeating unit is not H. R, R1, and R2 are each independently a C1-C10 alkyl group, a C3-C10 cycloalkyl group, a C1-C10 hydroxyalkyl group, a C2-C10 alkoxy group, a C2-C10 alkoxy alkyl group, a C2-C10 acetyl group, a C3-C10 acetylalkyl group, a C1-C10 carboxyl group, a C2-C10 alkyl carboxyl group, or a C4-C10 cycloalkyl carboxyl group, and n is 2-1000. A resist layer is formed over the protective layer, and the resist layer is patterned.
    Type: Grant
    Filed: April 23, 2021
    Date of Patent: April 9, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Jing Hong Huang, Wei-Han Lai, Ching-Yu Chang
  • Patent number: 11954824
    Abstract: An image pre-processing method and an image processing apparatus for a fundoscopic image are provided. A region of interest (ROI) is obtained from a fundoscopic image to generate a first image. The ROI is focused on an eyeball in the fundoscopic image. A smoothing process is performed on the first image to generate a second image. A value difference between neighboring pixels in the second image is increased to generate a third image.
    Type: Grant
    Filed: April 21, 2021
    Date of Patent: April 9, 2024
    Assignee: Acer Medical Inc.
    Inventors: Yi-Jin Huang, Chin-Han Tsai, Ming-Ke Chen
  • Publication number: 20240111078
    Abstract: A method forming a grating device includes: providing a substrate; entering the substrate into a process chamber; and depositing a grating material on the substrate to form a grating material layer on the substrate. A refractive index of the grating material gradually changes during depositing the grating material in the process chamber. The grating material layer includes a varying refractive index.
    Type: Application
    Filed: September 29, 2022
    Publication date: April 4, 2024
    Inventors: Chun-Wei HUANG, Yu-Shan TSAI, Po-Han FU
  • Publication number: 20240113036
    Abstract: An electromagnetic interference (EMI) shielding package structure, a manufacturing method thereof, and an electronic assembly are provided. The EMI shielding package structure includes a carrier, at least one chip mounted on a first board surface of the carrier, an encapsulant formed on the carrier and packaging the at least one chip, an EMI shielding layer formed on an outer surface of the encapsulant, and an insulating layer. The insulating layer includes a spraying portion and a capillary permeating portion. The spraying portion is formed at least part of an outer surface of the EMI shielding layer. The capillary permeating portion is formed by extending from a bottom end of the spraying portion toward a second board surface of the carrier through capillarity, and the capillary permeating portion covers a bottom edge of the EMI shielding layer.
    Type: Application
    Filed: November 17, 2022
    Publication date: April 4, 2024
    Inventors: CHIH-HAO LIAO, SHU-HAN WU, HSIN-YEH HUANG
  • Publication number: 20240113154
    Abstract: A semiconductor device may include a compound substrate and a 3-dimensional inductor structure. The compound substrate may include a front surface and a back surface. The 3-dimensional inductor structure may include a front conductive stack, a back conductive layer, and at least one through-hole structure. At least one portion of the front conductive stack may include a first conductive layer disposed on the front surface of the compound substrate, and a second conductive layer disposed on the first conductive layer. The second conductive layer has a thickness ranging between 30 micrometers and 400 micrometers. The back conductive layer is disposed on the back surface of the compound substrate. The at least one through-hole structure penetrates through the compound substrate, and electrically connects the front conductive stack to the back conductive layer.
    Type: Application
    Filed: November 20, 2022
    Publication date: April 4, 2024
    Applicant: RichWave Technology Corp.
    Inventors: Chia-Wei Chang, Yan-Han Huang, Chin-Chia Chang
  • Patent number: 11946802
    Abstract: An ambient light sensor includes a substrate, a metasurface disposed on the substrate, and an aperture layer disposed on the substrate. The metasurface includes a plurality of nanostructures and a filling layer laterally surrounding the plurality of nanostructures. The aperture layer laterally separates the metasurface into a plurality of sub-meta groups.
    Type: Grant
    Filed: March 29, 2023
    Date of Patent: April 2, 2024
    Assignee: VISERA TECHNOLOGIES COMPANY LIMITED
    Inventors: Shih-Liang Ku, Zi-Han Liao, Chun-Wei Huang
  • Publication number: 20240100517
    Abstract: The present disclosure provide a detection device of microfluidic polymerase chain reaction (PCR) and a detection system including the same. This all-in-one device and system may be used to detect at least one biological detection chip, so that can amplify gene fragments at the front-end and detect them at the back-end immediately, decreasing the time required for the analysis, enabling real-time, low-cost, and rapid detection of various viruses, such as EBV and COVID-19, without compromising accuracy or sensitivity.
    Type: Application
    Filed: September 27, 2022
    Publication date: March 28, 2024
    Inventors: HORN-JIUNN SHEEN, PEI-KUEN WEI, YU-JUI FAN, PO-HAN JUAN, YUNG-YU HUANG
  • Publication number: 20240105521
    Abstract: A method for forming a semiconductor device structure is provided. The method includes providing a substrate having a base, a first fin, and a second fin over the base. The method includes forming a first trench in the base and between the first fin and the second fin. The method includes forming an isolation layer over the base and in the first trench. The first fin and the second fin are partially in the isolation layer. The method includes forming a first gate stack over the first fin and the isolation layer. The method includes forming a second gate stack over the second fin and the isolation layer. The method includes removing a bottom portion of the base. The isolation layer passes through the base after the bottom portion of the base is removed.
    Type: Application
    Filed: February 9, 2023
    Publication date: March 28, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Da-Zhi ZHANG, Chung-Pin HUANG, Po-Nien CHEN, Hsiao-Han LIU, Jhon-Jhy LIAW, Chih-Yung LIN