Patents by Inventor Hans-Juergen Eickelmann
Hans-Juergen Eickelmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20150030283Abstract: An absorber device comprises a substrate; one or more thin film radiation absorbers arranged on the substrate; an integrated optical system, comprising at least one first optical element; a cover medium arranged above the substrate and the one or more radiation absorbers. The at least one first optical element and at least one corresponding one of the one or more radiation absorbers are aligned with respect to their optical axis, such that an incoming radiation is directed onto the one or more radiation absorbers by the optical system. A method of manufacturing an absorber device is also provided.Type: ApplicationFiled: July 1, 2014Publication date: January 29, 2015Inventors: Hans-Juergen Eickelmann, Harold J. Hovel, Ruediger Kellmann, Hartmut Kuehl, Markus Schmidt, Steven E. Steen
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Publication number: 20150024542Abstract: Use of chemical mechanical polishing (CMP) and/or pure mechanical polishing to separate sub-cells in a thin film solar cell. In one embodiment the CMP is only used to separate the active, thin film layer into sub-cells, with scribing still being used to achieve sub-cell separation in conductive layers above and below the active, thin film layer. Also, the active layer may be placed over a series of protrusions so that the CMP removes the active layer that is over the protrusion, while leaving intact the flat, planar portions of the active layer. In this way, the removed active layer, from over the protrusions then becomes the division between sub-cells in the active layer.Type: ApplicationFiled: January 28, 2014Publication date: January 22, 2015Applicant: International Business Machines CorporationInventors: Hans-Juergen Eickelmann, Ruediger Kellmann, Markus Schmidt
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Publication number: 20150020863Abstract: Use of chemical mechanical polishing (CMP) and/or pure mechanical polishing to separate sub-cells in a thin film solar cell. In one embodiment the CMP is only used to separate the active, thin film layer into sub-cells, with scribing still being used to achieve sub-cell separation in conductive layers above and below the active, thin film layer. Also, the active layer may be placed over a series of protrusions so that the CMP removes the active layer that is over the protrusion, while leaving intact the flat, planar portions of the active layer. In this way, the removed active layer, from over the protrusions then becomes the division between sub-cells in the active layer.Type: ApplicationFiled: July 22, 2013Publication date: January 22, 2015Applicant: International Business Machines CorporationInventors: Hans-Juergen Eickelmann, Ruediger Kellmann, Markus Schmidt
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Publication number: 20140202529Abstract: A silicon solar cell is manufactured by providing a carrier plate, and by applying a first contact pattern to the carrier plate. The first contact pattern includes a set of first laminar contacts. The silicon solar cell is further manufactured by applying a multitude of silicon slices to the first contact pattern, and by applying a second contact pattern to the multitude of silicon slices. Each first laminar contact of the set of first laminar contacts is in spatial laminar contact with maximally two silicon slices. The second contact pattern includes a set of second laminar contacts. Each second laminar contact of the set of second laminar contacts is in spatial laminar contact with maximally two silicon slices.Type: ApplicationFiled: March 20, 2014Publication date: July 24, 2014Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Rainer Klaus Krause, Gerd Pfeiffer, Hans-Juergen Eickelmann, Thorsten Muehge
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Patent number: 8772079Abstract: A method of backside contacting of thin layer photovoltaic cells having Si elements as well as thin film cells, like CIGS, is provided, including the following steps: providing a p-n-junction including a thin n-doped Si layer and a thin p-doped Si layer bonded on top of said n-doped Si layer; bonding said p-n-junction to a glass substrate; preparing contact points on said structured thin p-doped Si layer and said thin n-doped Si layer; and creating contact pins on said structured thin p-doped Si layer and said thin n-doped Si layer.Type: GrantFiled: April 8, 2008Date of Patent: July 8, 2014Assignee: International Business Machines CorporationInventors: Rainer Krause, Gerd Pfeiffer, Thorsten Muehge, Hans-Juergen Eickelmann, Michael Haag, Markus Schmidt
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Patent number: 8735212Abstract: A silicon solar cell is manufactured by providing a carrier plate, and by applying a first contact pattern to the carrier plate. The first contact pattern includes a set of first laminar contacts. The silicon solar cell is further manufactured by applying a multitude of silicon slices to the first contact pattern, and by applying a second contact pattern to the multitude of silicon slices. Each first laminar contact of the set of first laminar contacts is in spatial laminar contact with maximally two silicon slices. The second contact pattern includes a set of second laminar contacts. Each second laminar contact of the set of second laminar contacts is in spatial laminar contact with maximally two silicon slices.Type: GrantFiled: January 13, 2009Date of Patent: May 27, 2014Assignee: International Business Machines CorporationInventors: Rainer Klaus Krause, Gerd Pfeiffer, Hans-Juergen Eickelmann, Thorsten Muehge
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Publication number: 20140102509Abstract: Manufacture for an improved stacked-layered thin film solar cell. Solar cell has reduced absorber thickness and an improved back contact for Copper Indium Gallium Selenide solar cells. The back contact provides improved reflectance particularly for infrared wavelengths while still maintaining ohmic contact to the semiconductor absorber. This reflectance is achieved by producing a back contact having a highly reflecting metal separated from an absorbing layer with a dielectric layer.Type: ApplicationFiled: October 12, 2012Publication date: April 17, 2014Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Hans-Juergen Eickelmann, Michael Haag, Ruediger Kellmann, Markus Schmidt, Johannes Windeln
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Patent number: 8631565Abstract: A method for manufacturing a solar concentrator cell module assembly within an integrated circuit process, which solar concentrator cell module assembly includes at least one solar device and which solar device includes one printed circuit board and one Fresnel lens. A printed circuit board is assembled according to a pre-defined circuit board base design layout that allows pick and place of a single solar concentrator cell chip onto a circuit board base. Connections are provided for the solar concentrator cell chip in a serialized or a parallelized arrangement on the circuit board base, and a plurality of openings are formed in the circuit board base below a backside of the solar concentrator chip to enable attachment of cooling fingers.Type: GrantFiled: September 3, 2008Date of Patent: January 21, 2014Assignee: International Business Machines CorporationInventors: Christian Becker, Hans-Juergen Eickelmann, Michael Haag, Rainer Klaus Krause, Thorsten Muehge, Markus Schmidt
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Publication number: 20130226652Abstract: Embodiments of the invention relate to identification of risks in a brand commodity supply chain. Risks are centrally assessed and a single holistic image of the risk assessment is provided. Specifically, risks are assessed vertically and horizontally across the supply chain, brand, and commodity. Risk identification techniques may be applied to the identified risks to reduce supply chain disruption and to enable continued manufacturing.Type: ApplicationFiled: February 28, 2012Publication date: August 29, 2013Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Ubaldo G. Bilello, Hans-Juergen Eickelmann, Ricardo L. Fabrize, Louis R. Ferretti, JR., Udo Kleemann, Jeffrey W. Miles, Michael S. O'Leary, Sharmila S. Tilwalli, Karen N. Toger
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Patent number: 8129216Abstract: A method of manufacturing a solar cell. The method includes the steps of providing a substrate, applying a first dopant to a first surface, applying a second dopant to a second surface, covering the doped first surface with a hard mask, applying a third dopant to the substrate side, removing the hard mask, applying a pattern of first electrical contacts to the doping pattern, and applying a pattern of second electrical contacts to the doped second surface, the pattern of second electrical contacts and the doping pattern being straight-lined opposed.Type: GrantFiled: April 29, 2009Date of Patent: March 6, 2012Assignee: International Business Machines CorporationInventors: Hans-Juergen Eickelmann, Michael Haag, Harold John Hovel, Rainer Krause, Markus Schmidt, Steven Erik Steen
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Publication number: 20110100451Abstract: A silicon solar cell is manufactured by providing a carrier plate, and by applying a first contact pattern to the carrier plate. The first contact pattern includes a set of first laminar contacts. The silicon solar cell is further manufactured by applying a multitude of silicon slices to the first contact pattern, and by applying a second contact pattern to the multitude of silicon slices. Each first laminar contact of the set of first laminar contacts is in spatial laminar contact with maximally two silicon slices. The second contact pattern includes a set of second laminar contacts. Each second laminar contact of the set of second laminar contacts is in spatial laminar contact with maximally two silicon slices.Type: ApplicationFiled: January 13, 2009Publication date: May 5, 2011Inventors: Rainer Klaus Krause, Gerd Pfeiffer, Hans-Juergen Eickelmann, Thorsten Muehge
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Patent number: 7897434Abstract: A method of fabricating solar cell chips. The method includes creating an integrated circuit chip process route for fabricating integrated circuit chips using integrated circuit wafers in an integrated circuit fabrication facility; creating a solar cell process route for fabricating solar cells using solar cell wafers in the integrated circuit fabrication facility; releasing integrated circuit chip wafers and solar cell wafers into tool queues of tools of the an integrated circuit fabrication facility; and processing the solar cell wafers on at least some tools of the integrated circuit fabrication facility used to process the integrated circuit wafers. Also the process used to fabricate the solar cell chips.Type: GrantFiled: August 12, 2008Date of Patent: March 1, 2011Assignee: International Business Machines CorporationInventors: Hans-Juergen Eickelmann, Michael Haag, Harold J. Hovel, Rainer Klaus Krause, Markus Schmidt, Xiaoyan Shao, Steven Erik Steen
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Publication number: 20100304519Abstract: A method of fabricating solar cell chips. The method includes creating an integrated circuit chip process route for fabricating integrated circuit chips using integrated circuit wafers in an integrated circuit fabrication facility; creating a solar cell process route for fabricating solar cells using solar cell wafers in the integrated circuit fabrication facility; releasing integrated circuit chip wafers and solar cell wafers into tool queues of tools of the an integrated circuit fabrication facility; and processing the solar cell wafers on at least some tools of the integrated circuit fabrication facility used to process the integrated circuit wafers. Also the process used to fabricate the solar cell chips.Type: ApplicationFiled: August 3, 2010Publication date: December 2, 2010Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Hans-Juergen Eickelmann, Michael Haag, Harold J. Hovel, Rainer Klaus Krause, Markus Schmidt, Xiaoyan Shao, Steven Erik Steen
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Publication number: 20100297802Abstract: Solar cell assemblies and method of making solar cell assemblies. The method, including: fabricating solar cell chips on solar cell wafers; dicing the solar cell wafers into individual solar cell chips; packaging the individual solar cell chips in molded plastic packages to form solar cell chip packages; and mounting on and electrically connecting one or more of the solar cell chip packages to a printed circuit board. The assemblies including a printed circuit board; one or more solar cell chip packages mounted on and electrically connected to the printed circuit board, each of said one or more solar chip packages comprising a solar cell chip and a lead frame encapsulated in a molded plastic body, top surfaces the solar cell chips exposed in top surfaces of the molded plastic bodies.Type: ApplicationFiled: August 3, 2010Publication date: November 25, 2010Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Christian Becker, Hans-Juergen Eickelmann, Michael Haag, Rainer Klaus Krause, Markus Schmidt
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Publication number: 20100279454Abstract: A method of manufacturing a solar cell. The method includes the steps of providing a substrate, applying a first dopant to a first surface, applying a second dopant to a second surface, covering the doped first surface with a hard mask, applying a third dopant to the substrate side, removing the hard mask, applying a pattern of first electrical contacts to the doping pattern, and applying a pattern of second electrical contacts to the doped second surface, the pattern of second electrical contacts and the doping pattern being straight-lined opposed.Type: ApplicationFiled: April 29, 2009Publication date: November 4, 2010Inventors: Hans-Juergen Eickelmann, Michael Haag, Harold John Hovel, Rainer Krause, Markus Schmidt, Steven Erik Steen
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Publication number: 20100132760Abstract: A method of backside contacting of thin layer photovoltaic cells having Si elements as well as thin film cells, like CIGS, is provided, including the following steps: providing a p-n-junction including a thin n-doped Si layer and a thin p-doped Si layer bonded on top of said n-doped Si layer; bonding said p-n-junction to a glass substrate; preparing contact points on said structured thin p-doped Si layer and said thin n-doped Si layer; and creating contact pins on said structured thin p-doped Si layer and said thin n-doped Si layer.Type: ApplicationFiled: April 8, 2008Publication date: June 3, 2010Applicant: International Business Machines CorporationInventors: Rainer Krause, Gerd Pfeiffer, Thorsten Muehge, Hans-Juergen Eickelmann, Michael Haag, Markus Schmidt
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Publication number: 20100070890Abstract: A computer-implemented method for providing on-demand manufacturing execution systems for clients in which a response to a questionnaire from a client with information relative to identification of a business and production process, a determination of process steps, and an identification of process step requirements is evaluated by the service provider according to GUI requirements for each one of a number of individual process steps. Based on the evaluation, a GUI is defined for each of the individual process steps by the service provider and provided to the client for installation on client computing devices in a manufacturing line of the client. Data is collected for each of the individual process steps via each GUI and sent to the service provider for storage and evaluation.Type: ApplicationFiled: September 12, 2008Publication date: March 18, 2010Applicant: International Business Machines CorporationInventors: Jakob Axt, Christian Becker, Hans-Juergen Eickelmann, Rainer Kaus Krause, Thorsten Muehge, Ralph Schoenhofer
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Publication number: 20100050428Abstract: A method for manufacturing a solar concentrator cell module assembly within an integrated circuit process, which solar concentrator cell module assembly includes at least one solar device and which solar device includes one printed circuit board and one Fresnel lens. A printed circuit board is assembled according to a pre-defined circuit board base design layout that allows pick and place of a single solar concentrator cell chip onto a circuit board base. Connections are provided for the solar concentrator cell chip in a serialized or a parallelized arrangement on the circuit board base, and a plurality of openings are formed in the circuit board base below a backside of the solar concentrator chip to enable attachment of cooling fingers.Type: ApplicationFiled: September 3, 2008Publication date: March 4, 2010Applicant: International Business Machines CorporationInventors: Christian Becker, Hans-Juergen Eickelmann, Michael Haag, Rainer Klaus Krause, Thorsten Muehge, Markus Schmidt
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Publication number: 20100037936Abstract: Solar cell assemblies and method of making solar cell assemblies. The method, including: fabricating solar cell chips on solar cell wafers; dicing the solar cell wafers into individual solar cell chips; packaging the individual solar cell chips in molded plastic packages to form solar cell chip packages; and mounting on and electrically connecting one or more of the solar cell chip packages to a printed circuit board. The assemblies including a printed circuit board; one or more solar cell chip packages mounted on and electrically connected to the printed circuit board, each of said one or more solar chip packages comprising a solar cell chip and a lead frame encapsulated in a molded plastic body, top surfaces the solar cell chips exposed in top surfaces of the molded plastic bodies.Type: ApplicationFiled: August 12, 2008Publication date: February 18, 2010Inventors: Christian Becker, Hans-Juergen Eickelmann, Michael Haag, Rainer Klaus Krause, Markus Schmidt
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Publication number: 20100037939Abstract: A method of fabricating solar cell chips. The method includes creating an integrated circuit chip process route for fabricating integrated circuit chips using integrated circuit wafers in an integrated circuit fabrication facility; creating a solar cell process route for fabricating solar cells using solar cell wafers in the integrated circuit fabrication facility; releasing integrated circuit chip wafers and solar cell wafers into tool queues of tools of the an integrated circuit fabrication facility; and processing the solar cell wafers on at least some tools of the integrated circuit fabrication facility used to process the integrated circuit wafers. Also the process used to fabricate the solar cell chips.Type: ApplicationFiled: August 12, 2008Publication date: February 18, 2010Inventors: Hans-Juergen Eickelmann, Michael Haag, Harold J. Hovel, Rainer Klaus Krause, Markus Schmidt, Xiaoyan Shao, Steven Erik Steen