Patents by Inventor Harald Okorn-Schmidt
Harald Okorn-Schmidt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11908698Abstract: The invention relates to a method for plating a recess in a substrate, a device for plating a recess in a substrate and a system for plating a recess in a substrate comprising the device. The method for plating a recess in a substrate comprises the following steps: Providing a substrate with a substrate surface comprising at least one recess, applying a replacement gas to the recess to replace an amount of ambient gas in the recess to at least partially clear the recess from the ambient gas, applying a processing fluid to the recess, wherein the replacement gas dissolves in the processing fluid to at least partially clear the recess from the replacement gas, and plating the recess.Type: GrantFiled: October 1, 2021Date of Patent: February 20, 2024Assignee: SEMSYSCO GMBHInventors: Franz Markut, Thomas Wirnsberger, Oliver Knoll, Andreas Gleissner, Harald Okorn-Schmidt, Philipp Engesser
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Publication number: 20230313407Abstract: The invention relates to a shield body system for a process fluid for chemical and/or electrolytic surface treatment of a substrate, use of a shield body system, and a method for a chemical and/or electrolytic surface treatment of a substrate in a process fluid. The shield body system comprises a shield body and an agitation unit. The shield body has a plurality of openings to direct the process fluid flow and/or a current density distribution towards the substrate to be treated. The agitation unit is configured to move the shield body together with the substrate vertically and/or horizontally relative to a distribution body. Alternatively or additionally, the agitation unit is configured to move the shield body together with the substrate vertically and/or horizontally relative to a deposition chamber for chemical and/or electrolytic surface treatment.Type: ApplicationFiled: March 25, 2021Publication date: October 5, 2023Inventors: Herbert ÖTZLINGER, Marianne KOLITSCH-MATALN, Harald OKORN-SCHMIDT, Andreas GLEISSNER
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Publication number: 20230026551Abstract: The invention relates to a distribution body for a process fluid for chemical and/or electrolytic surface treatment of a substrate, a distribution system for chemical and/or electrolytic surface treatment of a substrate in a process fluid, a use of a distribution body or a distribution system for a chemical and/or electrolytic surface treatment of a substrate in a process fluid and a distribution method for a process fluid for chemical and/or electrolytic surface treatment of a substrate. The distribution body comprises: a front face, a rear face, at least an inlet, an outlet array, and a flow control array. The front face is configured to be directed towards the substrate for the surface treatment of the substrate. The rear face is arranged opposite to the front face. The inlet is configured for an entry of the process fluid into the distribution body. The outlet array comprises several outlets, which are configured for an exit of the process fluid out of the distribution body and towards the substrate.Type: ApplicationFiled: November 18, 2020Publication date: January 26, 2023Inventors: Andreas GLEISSNER, Philipp ENGESSER, Harald OKORN-SCHMIDT
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Patent number: 11164748Abstract: The invention relates to a method for plating a recess in a substrate, a device for plating a recess in a substrate and a system for plating a recess in a substrate comprising the device. The method for plating a recess in a substrate comprises the following steps: a) Providing a substrate with a substrate surface comprising at least one recess, b) applying a replacement gas to the recess to replace an amount of ambient gas in the recess to at least partially clear the recess from the ambient gas, c) applying a processing fluid to the recess, wherein the replacement gas dissolves in the processing fluid to at least partially clear the recess from the replacement gas, and d) plating the recess.Type: GrantFiled: January 24, 2019Date of Patent: November 2, 2021Assignee: Semsyso GMBHInventors: Franz Markut, Thomas Wirnsberger, Oliver Knoll, Andreas Gleissner, Harald Okorn-Schmidt, Philipp Engesser
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Publication number: 20190228975Abstract: The invention relates to a method for plating a recess in a substrate, a device for plating a recess in a substrate and a system for plating a recess in a substrate comprising the device. The method for plating a recess in a substrate comprises the following steps: a) Providing a substrate with a substrate surface comprising at least one recess, b) applying a replacement gas to the recess to replace an amount of ambient gas in the recess to at least partially clear the recess from the ambient gas, c) applying a processing fluid to the recess, wherein the replacement gas dissolves in the processing fluid to at least partially clear the recess from the replacement gas, and d) plating the recess.Type: ApplicationFiled: January 24, 2019Publication date: July 25, 2019Applicant: Semsysco GmbHInventors: Franz Markut, Thomas Wirnsberger, Oliver Knoll, Andreas Gleissner, Harald Okorn-Schmidt, Philipp Engesser
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Patent number: 10249521Abstract: An apparatus for processing wafer-shaped articles comprises a vacuum transfer module and an atmospheric transfer module. A first airlock interconnects the vacuum transfer module and the atmospheric transfer module. An atmospheric process module is connected to the atmospheric transfer module. A gas supply system is configured to supply gas separately and at different controlled flows to each of the atmospheric transfer module, the first airlock and the atmospheric process module, so as to cause: (i) a flow of gas from the first airlock to the atmospheric transfer module when the first airlock and the atmospheric transfer module are open to one another, and (ii) a flow of gas from the atmospheric transfer module to the atmospheric process module when the atmospheric transfer module and the atmospheric process module are open to one another.Type: GrantFiled: March 17, 2016Date of Patent: April 2, 2019Assignee: LAM RESEARCH AGInventors: Thorsten Lill, Andreas Fischer, Richard H. Gould, Michael Myslovaty, Philipp Engesser, Harald Okorn-Schmidt, Anders Joel Bjork
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Publication number: 20170271180Abstract: An apparatus for processing wafer-shaped articles comprises a vacuum transfer module and an atmospheric transfer module. A first airlock interconnects the vacuum transfer module and the atmospheric transfer module. An atmospheric process module is connected to the atmospheric transfer module. A gas supply system is configured to supply gas separately and at different controlled flows to each of the atmospheric transfer module, the first airlock and the atmospheric process module, so as to cause: (i) a flow of gas from the first airlock to the atmospheric transfer module when the first airlock and the atmospheric transfer module are open to one another, and (ii) a flow of gas from the atmospheric transfer module to the atmospheric process module when the atmospheric transfer module and the atmospheric process module are open to one another.Type: ApplicationFiled: March 17, 2016Publication date: September 21, 2017Inventors: Thorsten LILL, Andreas FISCHER, Richard H. GOULD, Michael MYSLOVATY, Philipp ENGESSER, Harald OKORN-SCHMIDT, Anders Joel BJORK
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Patent number: 9653328Abstract: An apparatus for treating a surface of an article includes a chamber for receiving an article to be treated. A dispenser dispenses a treatment liquid including inorganic acid onto the article. A tank stores the treatment liquid. An ozone generator communicates with a supply line entering or exiting the tank to mix ozone with the treatment liquid. A cooler cools the treatment liquid to a subambient temperature in a range of 3° C. to less than 20° C. A heater heats a surface of an article to be treated to a temperature at least 30° C. greater than a temperature of the treatment liquid when applied to the article.Type: GrantFiled: April 1, 2014Date of Patent: May 16, 2017Assignee: Lam Research AGInventors: Harald Okorn-Schmidt, Franz Kumning, Rainer Obweger, Thomas Wirnsberger
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Patent number: 9472402Abstract: Increased protection of areas of a chip are provided by both a mask structure of increased robustness in regard to semiconductor manufacturing processes or which can be removed with increased selectivity and controllability in regard to underlying materials, or both. Mask structures are provided which exhibit an interface of a chemical reaction, grain or material type which can be exploited to enhance either or both types of protection. Structures of such masks include TERA material which can be converted or hydrated and selectively etched using a mixture of hydrogen fluoride and a hygroscopic acid or organic solvent, and two layer structures of similar or dissimilar materials.Type: GrantFiled: September 16, 2014Date of Patent: October 18, 2016Assignee: GLOBALFOUNDRIES Inc.Inventors: Deok-kee Kim, Kenneth T. Settlemyer, Jr., Kangguo Cheng, Ramachandra Divakaruni, Carl J. Radens, Dirk Pfeiffer, Timothy J. Dalton, Katherina E. Babich, Arpan P. Mohorowala, Harald Okorn-Schmidt
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Patent number: 9059000Abstract: Increased protection of areas of a chip are provided by both a mask structure of increased robustness in regard to semiconductor manufacturing processes or which can be removed with increased selectivity and controllability in regard to underlying materials, or both. Mask structures are provided which exhibit an interface of a chemical reaction, grain or material type which can be exploited to enhance either or both types of protection. Structures of such masks include TERA material which can be converted or hydrated and selectively etched using a mixture of hydrogen fluoride and a hygroscopic acid or organic solvent, and two layer structures of similar or dissimilar materials.Type: GrantFiled: April 21, 2008Date of Patent: June 16, 2015Assignee: International Business Machines CorporationInventors: Deok-kee Kim, Kenneth T. Settlemyer, Jr., Kangguo Cheng, Ramachandra Divakaruni, Carl J. Radens, Dirk Pfeiffer, Timothy Dalton, Katherina Babich, Arpan P. Mahorowala, Harald Okorn-Schmidt
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Publication number: 20150004802Abstract: Increased protection of areas of a chip are provided by both a mask structure of increased robustness in regard to semiconductor manufacturing processes or which can be removed with increased selectivity and controllability in regard to underlying materials, or both. Mask structures are provided which exhibit an interface of a chemical reaction, grain or material type which can be exploited to enhance either or both types of protection. Structures of such masks include TERA material which can be converted or hydrated and selectively etched using a mixture of hydrogen fluoride and a hygroscopic acid or organic solvent, and two layer structures of similar or dissimilar materials.Type: ApplicationFiled: September 16, 2014Publication date: January 1, 2015Inventors: Deok-kee Kim, Kenneth T. Settlemyer, JR., Kangguo Cheng, Ramachandra Divakaruni, Carl J. Radens, Dirk Pfeiffer, Timothy J. Dalton, Katherina E. Babich, Arpan P. Mohorowala, Harald Okorn-Schmidt
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Publication number: 20140209129Abstract: Improved removal of ion-implanted photoresist in a single wafer front-end wet processing station is achieved by dissolving gaseous ozone into relatively cool inorganic acid, dispensing the acid ozone mixture onto a wafer, and rapidly heating the surface of the wafer to a temperature at least 30° C. higher than the temperature of the acid ozone mixture.Type: ApplicationFiled: April 1, 2014Publication date: July 31, 2014Applicant: LAM RESEARCH ABInventors: Harald OKORN-SCHMIDT, Franz KUMNING, Rainer OBWEGER, Thomas WIRNSBERGER
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Patent number: 8709165Abstract: Improved removal of ion-implanted photoresist in a single wafer front-end wet processing station is achieved by dissolving gaseous ozone into relatively cool inorganic acid, dispensing the acid ozone mixture onto a wafer, and rapidly heating the surface of the wafer to a temperature at least 30° C. higher than the temperature of the acid ozone mixture.Type: GrantFiled: December 3, 2010Date of Patent: April 29, 2014Assignee: Lam Research AGInventors: Harald Okorn-Schmidt, Franz Kumning, Rainer Obweger, Thomas Wirnsberger
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Patent number: 8668777Abstract: Mixtures containing concentrated sulfuric acid used for stripping photoresist from semiconductor wafer, such as SOM and SPM mixtures, are more quickly removed from a wafer surface using another liquid also containing high concentration of sulfuric acid, with the second liquid furthermore containing controlled small amounts of fluoride ion. The second liquid renders the wafer surface hydrophobic, which permits easy removal of the sulfuric acid therefrom by spinning and/or rinsing.Type: GrantFiled: December 22, 2010Date of Patent: March 11, 2014Assignee: Lam Research AGInventors: Harald Okorn-Schmidt, Dieter Frank, Franz Kumnig
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Publication number: 20120160276Abstract: Mixtures containing concentrated sulfuric acid used for stripping photoresist from semiconductor wafer, such as SOM and SPM mixtures, are more quickly removed from a wafer surface using another liquid also containing high concentration of sulfuric acid, with the second liquid furthermore containing controlled small amounts of fluoride ion. The second liquid renders the wafer surface hydrophobic, which permits easy removal of the sulfuric acid therefrom by spinning and/or rinsing.Type: ApplicationFiled: December 22, 2010Publication date: June 28, 2012Applicant: LAM RESEARCH AGInventors: Harald OKORN-SCHMIDT, Dieter FRANK, Franz KUMNIG
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Publication number: 20120138097Abstract: Improved removal of ion-implanted photoresist in a single wafer front-end wet processing station is achieved by dissolving gaseous ozone into relatively cool inorganic acid, dispensing the acid ozone mixture onto a wafer, and rapidly heating the surface of the wafer to a temperature at least 30° C. higher than the temperature of the acid ozone mixture.Type: ApplicationFiled: December 3, 2010Publication date: June 7, 2012Applicant: LAM RESEARCH AGInventors: Harald OKORN-SCHMIDT, Franz KUMNIG, Rainer OBWEGER, Thomas WIRNSBERGER
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Patent number: 7887711Abstract: A system and method for patterning metal oxide materials in a semiconductor structure. The method comprises a first step of depositing a layer of metal oxide material over a substrate. Then, a patterned mask layer is formed over the metal oxide layer leaving one or more first regions of the metal oxide layer exposed. The exposed first regions of the metal oxide layer are then subjected to an energetic particle bombardment process to thereby damage the first regions of the metal oxide layer. The exposed and damaged first regions of the metal oxide layer are then removed by a chemical etch. Advantageously, the system and method is implemented to provide high-k dielectric materials in small-scale semiconductor devices. Besides using the ion implantation damage (I/I damage) plus wet etch technique to metal oxides (including metal oxides not previously etchable by wet methods), other damage methods including lower energy, plasma-based ion bombardment, may be implemented.Type: GrantFiled: June 13, 2002Date of Patent: February 15, 2011Assignee: International Business Machines CorporationInventors: Douglas A. Buchanan, Eduard A. Cartier, Evgeni Gousev, Harald Okorn-Schmidt, Katherine L. Saenger
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Patent number: 7497959Abstract: Increased protection of areas of a chip are provided by both a mask structure of increased robustness in regard to semiconductor manufacturing processes or which can be removed with increased selectivity and controllability in regard to underlying materials, or both. Mask structures are provided which exhibit an interface of a chemical reaction, grain or material type which can be exploited to enhance either or both types of protection. Structures of such masks include TERA material which can be converted or hydrated and selectively etched using a mixture of hydrogen fluoride and a hygroscopic acid or organic solvent, and two layer structures of similar or dissimilar materials.Type: GrantFiled: May 11, 2004Date of Patent: March 3, 2009Assignee: International Business Machines CorporationInventors: Deok-kee Kim, Kenneth T. Settlemyer, Jr., Kangguo Cheng, Ramachandra Divakaruni, Carl J. Radens, Dirk Pfeiffer, Timothy Dalton, Katherina Babich, Arpan P. Mahorowala, Harald Okorn-Schmidt
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Publication number: 20080261128Abstract: Increased protection of areas of a chip are provided by both a mask structure of increased robustness in regard to semiconductor manufacturing processes or which can be removed with increased selectivity and controllability in regard to underlying materials, or both. Mask structures are provided which exhibit an interface of a chemical reaction, grain or material type which can be exploited to enhance either or both types of protection. Structures of such masks include TERA material which can be converted or hydrated and selectively etched using a mixture of hydrogen fluoride and a hygroscopic acid or organic solvent, and two layer structures of similar or dissimilar materials.Type: ApplicationFiled: April 21, 2008Publication date: October 23, 2008Inventors: Deok-kee Kim, Kenneth T. Settlemyer, Kangguo Cheng, Ramachandra Divakaruni, Carl J. Radens, Dirk Pfeiffer, Thimothy Dalton, Katherina Babich, Arpan P. Mahorowala, Harald Okorn-Schmidt
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Publication number: 20070295367Abstract: Disclosed is a device for wet treatment of disk-like substrates comprising a first plate (10) with a size and shape being able to overlap a disk-like substrate to be treated, holding means (22) for holding a disk-like substrate (W) parallel to said first plate in a s distance of 0.2 to 5 mm, rotating means (37) for rotating the disk-like substrate (W) about a rotation axis (A) substantially perpendicular to said first plate, first dispensing means (14) with a first dispensing opening (16) in the first gap for introducing fluid into a first gap (11) between said first plate (10) and a disk-like substrate (W) when being treated, and shifting means (34) for shifting the position of said first dispensing opening (16) from a first position (P1) to a second position (P2) wherein the distance of said first position (P1) to the rotation axis (A) is smaller than the distance of said second position (P2) to the rotation axis (A). Furthermore an associated method is disclosed.Type: ApplicationFiled: November 15, 2005Publication date: December 27, 2007Applicant: SEZ AGInventor: Harald Okorn-Schmidt