Abstract: The present disclosure relates to a wireless battery management system which ensures stability when obtaining battery data through wireless communication. The battery management system includes a manager node operating a primary channel and a secondary channel based on wireless communication and obtaining battery data from a monitor node by using the primary channel or the secondary channel and a monitor node connected to a battery module to collect battery data including one or more of a current, a voltage, a temperature, and self-diagnosis data of the battery module, transmit the collected battery data to the manager node through the primary channel, and when the transmission of the battery data through the primary channel fails, transmit the battery data to the manager node through the secondary channel.

Abstract: A method for recording metadata for web caching in a cloud environment is provided. The method includes steps of: (a) a first web server caching file information of a first web server container corresponding to itself in a first cache memory in the first web server container; (b) the first web server recording metadata of the first cache memory in a common file storage; and (c) the first web server, if the first web server is scaled out by adding a second web server, allowing the second web server to access the common file storage, to thereby allow the metadata to be recorded in a second cache memory in a second web server container corresponding to the second web server.

Abstract: A method for auto-scaling at least one web server and at least one WAS (Web Application Server) is provided. The method includes a WAS administrating server grouping, as a first service group, both at least one first web server and at least one first WAS, which are connected with each other to provide a first application service, and grouping, as a second service group, both at least one second web server and at least one second WAS, which are connected with each other to provide a second application service, to thereby create at least two groups each of which includes at least its corresponding pair of web server and WAS, and the WAS administrating server allowing each of the grouped pairs of the web servers and the WAS's to be scaled out or scaled in, independently, by a process of scaling-out or scaling-in.

Abstract: A semiconductor package includes a circuit pattern extending in a horizontal direction. The circuit pattern is conductive. A first insulation layer is disposed on the circuit pattern. A semiconductor chip is disposed on the first insulation layer. The first insulation layer includes first protrusions which protrude from a bottom surface of the first insulation layer, penetrate through at least a portion of the circuit pattern, and have a mesh structure. A second protrusion protrudes from the bottom surface of the first insulation layer and penetrates at least a portion of the circuit pattern. The second protrusion is spaced apart from the semiconductor chip in the horizontal direction. The second protrusion has a width in the horizontal direction wider than that of each of the first protrusions.

Abstract: Disclosed is a touch sensing device for preventing touch sensing performance from being reduced by a parasitic capacitance. The touch sensing device includes a plurality of buffers buffering a difference between a reference signal and a reception signal received from a touch electrode through a touch sensing line and generating first and second currents corresponding to a buffered signal, a plurality of current mirror unit respectively connected to the plurality of buffers, a plurality of filter circuits generating a first filter signal and a second filter signal by removing common noise included in a first output signal output from an nth current mirror unit of the plurality of current mirror units and a second output signal output from an (n?1)th current mirror unit of the plurality of current mirror units, and a plurality of integrators respectively connected to the plurality of filter circuits.

Abstract: A touch sensing device of a current driving type, which separately drives a parasitic capacitor by using an electric charge controller, includes a parasitic capacitance charger connected to a touch sensing line to charge a parasitic capacitor of a touch electrode connected to the touch sensing line with a predetermined charging current during a charging period and a sensing unit connected to the touch sensing line during a first driving period to drive a capacitor of the touch electrode with a first driving current corresponding to a difference voltage between a first voltage, charged into the parasitic capacitor when a touch does not occur, and a second voltage charged into the parasitic capacitor when a touch occurs and to sense a first touch voltage of the capacitor based on the first driving current during a first sensing period.

Abstract: Disclosed is a touch sensing device for preventing touch sensing performance from being reduced by a parasitic capacitance. The touch sensing device includes a plurality of buffers buffering a difference between a reference signal and a reception signal received from a touch electrode and generating first and second currents corresponding to a buffered signal, a plurality of current mirror units generating a first output signal using a first mirror current generated through mirroring of the first current and a third mirror current generated through mirroring of the second current and generate a second output signal using a second mirror current generated through mirroring of the first current and a fourth mirror current generated through mirroring of the second current, and a plurality of integrators integrating a difference between the first output signal from an nth current mirror unit and the second output signal from an (n?1)th current mirror unit.

Abstract: An embodiment provides a touch sensing device configured to divide one driving cycle into two parts and to summate or subtract touch sensing data regarding respective parts, thereby removing periodic noise.

Abstract: A method for auto-scaling at least one web server and at least one WAS (Web Application Server) is provided. The method includes a WAS administrating server grouping, as a first service group, both at least one first web server and at least one first WAS, which are connected with each other to provide a first application service, and grouping, as a second service group, both at least one second web server and at least one second WAS, which are connected with each other to provide a second application service, to thereby create at least two groups each of which includes at least its corresponding pair of web server and WAS, and the WAS administrating server allowing each of the grouped pairs of the web servers and the WAS's to be scaled out or scaled in, independently, by a process of scaling-out or scaling-in.

Abstract: A method for recording metadata for web caching in a cloud environment is provided. The method includes steps of: (a) a first web server caching file information of a first web server container corresponding to itself in a first cache memory in the first web server container; (b) the first web server recording metadata of the first cache memory in a common file storage; and (c) the first web server, if the first web server is scaled out by adding a second web server, allowing the second web server to access the common file storage, to thereby allow the metadata to be recorded in a second cache memory in a second web server container corresponding to the second web server.

Abstract: Provided is a method for managing a cloud server by using a manager server in a cloud environment, the method including receiving server template information of a first cloud server in a cloud domain, to which the manager server pertains, from the first cloud server, generating server setting information for a cloud server in the cloud domain based on the server template information of the first cloud server, and transmitting the server setting information for the cloud server to the first cloud server to drive the first cloud server.

Abstract: A semiconductor package includes a circuit pattern extending in a horizontal direction. The circuit pattern is conductive. A first insulation layer is disposed on the circuit pattern. A semiconductor chip is disposed on the first insulation layer. The first insulation layer includes first protrusions which protrude from a bottom surface of the first insulation layer, penetrate through at least a portion of the circuit pattern, and have a mesh structure. A second protrusion protrudes from the bottom surface of the first insulation layer and penetrates at least a portion of the circuit pattern. The second protrusion is spaced apart from the semiconductor chip in the horizontal direction. The second protrusion has a width in the horizontal direction wider than that of each of the first protrusions.

Abstract: A semiconductor package includes a circuit pattern extending in a horizontal direction. The circuit pattern is conductive. A first insulation layer is disposed on the circuit pattern. A semiconductor chip is disposed on the first installation layer. The first insulation layer includes first protrusions which protrude from a bottom surface of the first insulation layer, penetrate through at least a portion of the circuit pattern, and have a mesh structure. A second protrusion protrudes from the bottom surface of the first insulation layer and penetrates at least a portion of the circuit pattern. The second protrusion is spaced apart from the semiconductor chip in the horizontal direction. The second protrusion has a width in the horizontal direction wider than that of each of the first protrusions.

Abstract: A semiconductor package includes a circuit pattern extending in a horizontal direction. The circuit pattern is conductive. A first insulation layer is disposed on the circuit pattern. A semiconductor chip is disposed on the first installation layer. The first insulation layer includes first protrusions which protrude from a bottom surface of the first insulation layer, penetrate through at least a portion of the circuit pattern, and have a mesh structure. A second protrusion protrudes from the bottom surface of the first insulation layer and penetrates at least a portion of the circuit pattern. The second protrusion is spaced apart from the semiconductor chip in the horizontal direction. The second protrusion has a width in the horizontal direction wider than that of each of the first protrusions.

Abstract: Provided is a method for managing a cloud server by using a manager server in a cloud environment, the method including receiving server template information of a first cloud server in a cloud domain, to which the manager server pertains, from the first cloud server, generating server setting information for a cloud server in the cloud domain based on the server template information of the first cloud server, and transmitting the server setting information for the cloud server to the first cloud server to drive the first cloud server.

Abstract: A semiconductor package includes a package base substrate including bonding pads and a connection pads respectively on an upper surface and a lower surface of the package base substrate, four semiconductor chips attached onto the package base substrate, including a 1A semiconductor chip, a 1B semiconductor chip, a 2A semiconductor chip, and a 2B semiconductor chip, and each including a plurality of chip pads that are adjacent to a first edge of an upper surface of each of the 1A semiconductor chip, the 1B semiconductor chip, the 2A semiconductor chip, and the 2B semiconductor chip, and a bonding wire electrically connecting the chip pad and the bonding pad to each other, wherein the four semiconductor chips are disposed on the package base substrate such that first edges of the four semiconductor chips respectively face edges of the package base substrate that are different from each other.

Abstract: A semiconductor package includes a package base substrate including bonding pads and a connection pads respectively on an upper surface and a lower surface of the package base substrate, four semiconductor chips attached onto the package base substrate, including a 1A semiconductor chip, a 1B semiconductor chip, a 2A semiconductor chip, and a 2B semiconductor chip, and each including a plurality of chip pads that are adjacent to a first edge of an upper surface of each of the 1A semiconductor chip, the 1B semiconductor chip, the 2A semiconductor chip, and the 2B semiconductor chip, and a bonding wire electrically connecting the chip pad and the bonding pad to each other, wherein the four semiconductor chips are disposed on the package base substrate such that first edges of the four semiconductor chips respectively face edges of the package base substrate that are different from each other.

Abstract: A method for managing a thread pool size dynamically using elemental task throughputs is provided. The method includes steps of: a computing device (a) calculating a first representative task throughput corresponding to a first group including elemental task throughputs during the first time section, and then increasing a maximum thread value for the first time section and setting it as a maximum thread value for the second time section; (b) calculating a second representative task throughput corresponding to a second group including elemental task throughputs during the second time section; and (c) comparing the first and the second representative task throughput and then, if the latter is greater than the former by an amount equal to or greater than a preset first threshold value, increasing the maximum thread value for the second time section and setting it as a maximum thread value for a third time section.

Abstract: A semiconductor package includes a package base substrate including bonding pads and a connection pads respectively on an upper surface and a lower surface of the package base substrate, four semiconductor chips attached onto the package base substrate, including a 1A semiconductor chip, a 1B semiconductor chip, a 2A semiconductor chip, and a 2B semiconductor chip, and each including a plurality of chip pads that are adjacent to a first edge of an upper surface of each of the 1A semiconductor chip, the 1B semiconductor chip, the 2A semiconductor chip, and the 2B semiconductor chip, and a bonding wire electrically connecting the chip pad and the bonding pad to each other, wherein the four semiconductor chips are disposed on the package base substrate such that first edges of the four semiconductor chips respectively face edges of the package base substrate that are different from each other.

Abstract: A semiconductor package includes a package base substrate including bonding pads and a connection pads respectively on an upper surface and a lower surface of the package base substrate, four semiconductor chips attached onto the package base substrate, including a 1A semiconductor chip, a 1B semiconductor chip, a 2A semiconductor chip, and a 2B semiconductor chip, and each including a plurality of chip pads that are adjacent to a first edge of an upper surface of each of the 1A semiconductor chip, the 1B semiconductor chip, the 2A semiconductor chip, and the 2B semiconductor chip, and a bonding wire electrically connecting the chip pad and the bonding pad to each other, wherein the four semiconductor chips are disposed on the package base substrate such that first edges of the four semiconductor chips respectively face edges of the package base substrate that are different from each other.