Abstract: The present invention provides Hahella chejuensis-derived recombinant cellulase and a use thereof. The recombinant cellulase according to the present invention has a high stability at a high temperature and an optimized activity at a neutral pH, and therefore has a high availability in a process. Also, since the cellulase according to the present invention has an exoglucanase activity as well as an endoglucanase activity, a monosaccharide can be produced during decomposition of cellulose and an additional treatment required in a fermentation process is not needed, and therefore a cost may be reduced. Such an enzyme activity is advantageous to a fermentation or thermal treatment condition for producing a biofuel, and therefore industrial profits may be achieved.

Abstract: A stack semiconductor package includes a first semiconductor package having a first package substrate and a first semiconductor chip mounted on the first package substrate. The first semiconductor chip includes first chip pads arranged along a side portion thereof. The stack semiconductor package includes a second semiconductor package disposed on the first semiconductor package, and includes a second package substrate. A first sub-chip and a second sub-chip is mounted on the second semiconductor package and arranged side by side extending along a direction of a first side portion of the second package substrate. Each of the first and second sub-chips includes second chip pads arranged along a side portion thereof. Connection wiring paths between interface portions and connection pads may be reduced and simplified, thereby preventing connection wires from being tangled. Moreover, connection wiring paths between a logic chip and a memory chip may be minimized, thereby providing high speed performance.

Abstract: The present disclosure provides a method for controlling a multilevel converter, the method including, detecting modulation state values and current directions of sub-modules, and designating, by one sub-module, an average number of switching for each period of an output waveform, wherein the step of designating the average number of switching includes, grouping the sub-modules according to being in ON state or in OFF state, comparing the number of sub-modules in previous ON state and the number of sub-modules in OFF state to obtain a difference therebetween, and changing a state as much as the difference, comparing a sub-module of ON state in charged state and in discharged state with a sub-module of OFF state, and changing the compared states of sub-modules of ON state and OFF state.

Abstract: There is provided plasma equipment including a power supply that supplies a RF power; a chamber in which plasma is generated, and a processing target to processed by the plasma is provided; an antenna coil that is provided on a top surface of the chamber, and is connected to the power supply to receive the RF power; and a resonance coil that is provided to be electrically insulated or cut off from the antenna coil. The resonance coil receives electromagnetic energy applied from the antenna coil to allow a current to flow, and the plasma is generated within the chamber. It is possible to increase the degree of freedom for an installation position of the resonance coil, and it is possible to increase plasma density.

Abstract: An apparatus for alleviating a voltage drop of a battery cell includes a battery having a plurality of battery cells, a sensor configured to sense the battery to generate sensing information, a calculator configured to calculate an allowable torque of a motor using the sensing information and calculate an expected voltage of the battery using the allowable torque and the sensing information, and a determinator configured to control a torque quantity of the motor using the expected voltage and a reference voltage.

Abstract: A stack semiconductor package includes a first semiconductor package having a first package substrate and a first semiconductor chip mounted on the first package substrate. The first semiconductor chip includes first chip pads arranged along a side portion thereof. The stack semiconductor package includes a second semiconductor package disposed on the first semiconductor package, and includes a second package substrate. A first sub-chip and a second sub-chip is mounted on the second semiconductor package and arranged side by side extending along a direction of a first side portion of the second package substrate. Each of the first and second sub-chips includes second chip pads arranged along a side portion thereof. Connection wiring paths between interface portions and connection pads may be reduced and simplified, thereby preventing connection wires from being tangled. Moreover, connection wiring paths between a logic chip and a memory chip may be minimized, thereby providing high speed performance.

Abstract: The present invention provides Hahella chejuensis-derived recombinant cellulase and a use thereof. The recombinant cellulase according to the present invention has a high stability at a high temperature and an optimized activity at a neutral pH, and therefore has a high availability in a process. Also, since the cellulase according to the present invention has an exoglucanase activity as well as an endoglucanase activity, a monosaccharide can be produced during decomposition of cellulose and an additional treatment required in a fermentation process is not needed, and therefore a cost may be reduced. Such an enzyme activity is advantageous to a fermentation or thermal treatment condition for producing a biofuel, and therefore industrial profits may be achieved.

Abstract: A multi-chip package may include a package substrate, a first semiconductor chip, a second semiconductor chip and a supporting member. The first semiconductor chip may be arranged on an upper surface of the package substrate. The first semiconductor chip may be electrically connected with the package substrate. The second semiconductor chip may be arranged on an upper surface of the first semiconductor chip. The second semiconductor chip may be electrically connected with the first semiconductor chip. The second semiconductor chip may have a protrusion overhanging an area beyond a side surface of the first semiconductor chip. The supporting member may be interposed between the protrusion of the second semiconductor chip and the package substrate to prevent a deflection of the protrusion. Thus, the protrusion may not be deflected.

Abstract: An apparatus for alleviating a voltage drop of a battery cell includes a battery having a plurality of battery cells, a sensor configured to sense the battery to generate sensing information, a calculator configured to calculate an allowable torque of a motor using the sensing information and calculate an expected voltage of the battery using the allowable torque and the sensing information, and a determinator configured to control a torque quantity of the motor using the expected voltage and a reference voltage.

Abstract: A wireless power transmission apparatus includes: a transmitter to generate transmission power to a receiving coil of a receiving device through a transmitting coil, a location adjuster to adjust a location of the transmitter based on a location of the receiving coil, a voltage ratio calculator to calculate a voltage ratio applied to the receiving coil according to a location variation of the transmitter, and a transmission power determiner to determine an intensity of the transmission power for a signal output to the receiving device resulting from the voltage ratio applied to the receiving coil, and to transmit a signal corresponding to the intensity of the transmission power to the transmitter.

Abstract: Provided are a tape package and a flat panel display device including the tape package. The tape package includes a base film, a semiconductor chip mounted on one surface of the base film, a wire pattern including an input wire pattern and an output wire pattern formed on one surface of the base film and electrically connected with the semiconductor chip, a solder resist covering the remaining portion, except for an end of the wire pattern, and a protection film provided on an edge at one side of the solder resist facing an end of the output wire pattern.

Abstract: A method of controlling a multilevel converter is provided. In the method of controlling a multilevel converter according to an embodiment, a sub-module having the maximum voltage and a sub-module having the minimum voltage respectively are extracted from among a plurality of sub-modules. An amount of state variation of each of the plurality of sub-modules is determined. When the amount of state variation is not determined to be 0, a direction of a current flowing through the plurality of sub-modules is detected. A subsequent state of at least one sub-module is determined according to at least one of the amount of the state variation and current direction. Subsequently an arrangement time for sub-module values can be efficiently reduced while the number of the sub-modules increases in the voltage balancing.

Abstract: A transmitter apparatus of a wireless power transmission system for charging a vehicle includes a parking stopper configured to be fixedly mounted on a ground of a parking space. A transmitter is configured to be connected to the parking stopper and to include a transmitter coil which generates a magnetic field at the time of parking the vehicle.

Abstract: There is provided plasma equipment including a power supply that supplies a RF power; a chamber in which plasma is generated, and a processing target to processed by the plasma is provided; an antenna coil that is provided on a top surface of the chamber, and is connected to the power supply to receive the RF power; and a resonance coil that is provided to be electrically insulated or cut off from the antenna coil. The resonance coil receives electromagnetic energy applied from the antenna coil to allow a current to flow, and the plasma is generated within the chamber. It is possible to increase the degree of freedom for an installation position of the resonance coil, and it is possible to increase plasma density.

Abstract: The present disclosure provides a method for controlling a multilevel converter, the method including, detecting modulation state values and current directions of sub-modules, and designating, by one sub-module, an average number of switching for each period of an output waveform, wherein the step of designating the average number of switching includes, grouping the sub-modules according to being in ON state or in OFF state, comparing the number of sub-modules in previous ON state and the number of sub-modules in OFF state to obtain a difference therebetween, and changing a state as much as the difference, comparing a sub-module of ON state in charged state and in discharged state with a sub-module of OFF state, and changing the compared states of sub-modules of ON state and OFF state.

Abstract: A multi-chip package may include a package substrate, a first semiconductor chip, a second semiconductor chip and a supporting member. The first semiconductor chip may be arranged on an upper surface of the package substrate. The first semiconductor chip may be electrically connected with the package substrate. The second semiconductor chip may be arranged on an upper surface of the first semiconductor chip. The second semiconductor chip may be electrically connected with the first semiconductor chip. The second semiconductor chip may have a protrusion overhanging an area beyond a side surface of the first semiconductor chip. The supporting member may be interposed between the protrusion of the second semiconductor chip and the package substrate to prevent a deflection of the protrusion. Thus, the protrusion may not be deflected.

Abstract: Provided are a tape package and a flat panel display device including the tape package. The tape package includes a base film, a semiconductor chip mounted on one surface of the base film, a wire pattern including an input wire pattern and an output wire pattern formed on one surface of the base film and electrically connected with the semiconductor chip, a solder resist covering the remaining portion, except for an end of the wire pattern, and a protection film provided on an edge at one side of the solder resist facing an end of the output wire pattern.

Abstract: A multi-chip package may include a package substrate, a first semiconductor chip, a second semiconductor chip and a supporting member. The first semiconductor chip may be arranged on an upper surface of the package substrate. The first semiconductor chip may be electrically connected with the package substrate. The second semiconductor chip may be arranged on an upper surface of the first semiconductor chip. The second semiconductor chip may be electrically connected with the first semiconductor chip. The second semiconductor chip may have a protrusion overhanging an area beyond a side surface of the first semiconductor chip. The supporting member may be interposed between the protrusion of the second semiconductor chip and the package substrate to prevent a deflection of the protrusion.

Abstract: Provided are a semiconductor package of a semiconductor chip, a semiconductor module, an electronic system, and methods of manufacturing the same. The method includes mounting a semiconductor chip on a package substrate, forming a molding member on the semiconductor chip, forming via holes penetrating the molding member to expose a portion of a top surface of the semiconductor chip, the via holes being arranged in a lattice shape in a plan view, and forming thermally conductive via plugs in the via holes.

Abstract: A method of operating a semiconductor memory device includes an operation of applying a first voltage to selected bit lines, a second voltage to unselected bit lines and a common source line, and turning on drain and source selection transistors, an operation of applying a program voltage to a selected word line and a switch voltage to a switch word line, and applying a first pass voltage to first unselected word lines disposed between the switch word line and a common source line and between the selected word line and a bit line, and elevating the switch voltage to generate hot electrons and inject the hot electrons to a selected memory cell of the selected word line to program the selected cell.