Abstract: The present invention relates to a method and to a device (10; 30) for conveying electronic components (50) including a feed rail (11) in which a plurality of components (50) arranged juxtaposed in a row are located in a guideway (14). In accordance with the invention it is provided for to change the cross-section of the guideway (14) to prevent or eliminate tilting or back-ups of the components (50) accommodated in the guideway (14). For this purpose the device (10; 30) comprises a signal-controllable positioner (16). The size of the guideway (14) may be changed continually or discontinually between a minimum value and a maximum value.

Abstract: The handling device is particularly suited for handling the test heads on a wafer tester. The test head is thereby supported on a mount which is rotatable about its longitudinal axis on a supporting part. A frame column supports the supporting part adjustably in a vertical direction relative to the frame column via at least one linear bearing. A weight balancing device balances the weight of the head and the mount. The supporting part is configured such that the mount is laterally displayed relative to the frame column.

Abstract: Holding trays for electronic components have different dimensions, depending upon the manufacturer, and are, thus, non-standardized. The invention is a device for holding trays of this kind, which has a tray-shaped carrying element. The carrying element includes a holding region for at least one holding tray, which has variable dimensions for adapting to the dimensions of the at least one holding tray. The carrying element also has a rectangular-shaped edge region with outer surfaces. Guide elements are provided on the outer surfaces of the rectangular edge region. In one embodiment according to the invention, the guide elements are grooves with toothed rack profiles on an end of the grooves. Guide devices such as a pinion, groove block or roller engage in the toothed rack profiles to guide and transport the device.

Abstract: A handling device, in particular for handling probes of a wafer testing device, includes a receiving device for a probe being disposed in such a way as to be adjustable in a vertical direction and in a horizontal direction relative to at least one vertical bearer. The receiving device is guided adjustably in a horizontal direction on a supporting part. The supporting part is guided adjustably in a vertical direction on the at least one vertical bearer. Furthermore, a counterweight device is constructed so as to counterbalance the weight of the probe, the receiving device and the supporting part. The counterweight device includes a carrying device for receiving counterbalance weights. The carrying device is aligned horizontally and for parallel motion includes at least three suspension devices for fixing a connector which is turned round associated guide pulleys and is connected to the supporting part.

Abstract: A positioning device for test heads, and the like, comprising: an upright stand having legs with leveling mechanisms; a vertically adjustable platform mounted on the stand; two symmetrically arranged pairs of arms mounted on the platform for articulated movement in a horizontal plane; a bracket rotatably mounted to the free end of each arm pair; and, a test head holder tiltably mounted on each bracket for movement about a horizontal axis, a test head being attachable to and between the test head holders, whereby the test head may be vertically, horizontally and tiltably positioned. Clamping devices are provided for locking the test head into place after proper positioning.