Abstract: A rotation sensor is formed of three semiconductor wafers. A first wafer comprises a frame that surrounds a paddle. The rotation-sensitive paddle is surrounded on either of the opposed sides of the first wafer by rings of driven elements formed of radially-directed plateaus in the semiconductor material. Second and third wafers sandwich the first wafer. Each of the second and third wafers includes a first surface in which are formed concentric rings of driver and pickoff electrodes. In a preferred embodiment, the rings of pickoff electrodes are split into two semicircular arcs.

Abstract: The fiber jacket application system is used to provide a protective jacket over spliced optical fibers (10, 12), such as to coat a length of bare fiber, previously coated fiber, and particularly to rejacket a length of fiber in which the jacket was removed for splicing. Curable jacketing material is twice fed from a reservoir (28) through a small orifice or syringe (32) onto the respective sides of bared portions (10d, 12d) of the fiber. A first material (14) is deposited from and between the existing jackets (10a, 12a) and onto essentially half of the bared portions. A second material (16) is deposited in bonded contact with the first applied material from and between the surrounding protective jackets and onto essentially the remaining half of the bared portions.

Abstract: An improved laser diode is taught. A laser diode chip with an optical port for outputing an optical signal is mounted on a substrate. The substrate has a perimeter that extends beyond the area of the laser diode chip. The lens face of an optical fiber is aligned to receive the optical signal from the optical port. The optical fiber is secured at a pad location on the substrate with a solder ball. A portion of the substrate is mounted on a TEC leaving an overhang portion unsupported by the TEC. The overhang portion of the substrate forms a ledge portion of the substrate. A thermal insulating slot and a stress relief slot are micromachined through the substrate forming an "L" shaped slot defining a cantilever fiber support segment of the substrate. The fiber is mounted on the end of the fiber support segment with a solder ball.

Abstract: An integrated optics chip with improved performance when exposed to changing temperature is disclosed. The optic chip or integrated optics chip or MIOC has a top surface, a +Z face and -Z face. The integrated optics chip is formed from a crystal substrate having a high electro-optic coefficient such as Lithium Niobate. For the purpose of orienting the components to the optic chip to be described, the +Z crystal axis extends outward from the +Z face, the Z axis being the axis across which a pyroelectric effect is exhibited. The top surface is orthogonal to the Z axis. An input waveguide on the top surface receives an optical signal from an input port, passes the signal via a waveguide network, to an output waveguide coupling the waveguide network to an output port. A portion of the +Z and -Z faces are coated at least partially with a conductive coating.

Abstract: An input optical fiber (22), an output optical fiber (24, 26) and a waveguide (14) in an integrated optic chip (IOC) (12) intermediate the fibers are coupled together using service and alignment robots (42; 48, 50, 52). The service robot (42) establishes the three dimensional position of the waveguide. The alignment robots (48, 50, 52) three dimensionally and angularly align the input and output fibers respectively to the input and output legs (16; 18, 20) of the waveguide. An adhesive applying tool (46) coupled with the service robot adheres the input and output fibers respectively to their waveguide input and output legs.

Abstract: An integrated accelerometer includes hinges of silicon composition for securing the strut legs of a pendulous mass to the accelerometer body. Both the body of the accelerometer and the pendulous mass are of metal-coated compositions. Metallized pads are provided on selected surfaces of the hinges for forming eutectic bonds with the body and struts of the pendulous mass of the accelerometer. A heavily-doped continuous region adjacent the surface of the hinge connects the eutectic bonds through a flexure region of reduced thickness to complete necessary device circuitry.

Abstract: An integrated accelerometer includes features for minimizing the effects of foreseeable operational stresses. The accelerometer is of a type that includes a planar support base having an internal aperture for accommodating a hinged strut and limit stops for minimizing the travel of the shadow paddle portion of the strut. The limit stops are fabricated of material of suitable spring constant to provide an appropriate degree of "give" without degrading instrument performance or accuracy. Two-piece arrangements sandwich the hinges, thereby limiting flexure to an acceptable range. The predictable mechanical stresses resulting, for example, from thermal coefficient mismatches between the materials of the torquer coil and the strut are minimized by the use of a spacer intermediate the base and the coil.

Abstract: An integrated accelerometer includes features for minimizing the effects of foreseeable operational stresses. The accelerometer is of a type that includes a planar support base having an internal aperture for accommodating a hinged strut and limit stops for minimizing the travel of the shadow paddle portion of the strut. The limit stops are fabricated of material of suitable spring constant to provide an appropriate degree of "give" without degrading instrument performance or accuracy. Two-piece arrangements sandwich the hinges, thereby limiting flexure to an acceptable range. The predictable mechanical stresses resulting, for example, from thermal coefficient mismatches between the materials of the torquer coil and the strut are minimized by the use of a spacer intermediate the base and the coil.

Abstract: An integrated accelerometer includes features for minimizing the effects of foreseeable operational stresses. The accelerometer is of a type that includes a planar support base having an internal aperture for accommodating a hinged strut and limit stops for minimizing the travel of the shadow paddle portion of the strut. The limit stops are fabricated of material of suitable spring constant to provide an appropriate degree of "give" without degrading instrument performance or accuracy. Two-piece arrangements sandwich the hinges, thereby limiting flexure to an acceptable range. The predictable mechanical stresses resulting, for example, from thermal coefficient mismatches between the materials of the torquer coil and the strut are minimized by the use of a spacer intermediate the base and the coil.

Abstract: An assembly for use in a dry accelerometer. The assembly includes a flat ceramic base with an interior aperture, two metal hinges and a pendulous mass supported within the aperture by such hinges. A light emitting diode and photodetector are provided for measuring movement of the pendulous mass. The assembly is readily fabricated and tested with batch processes.

Abstract: A laser gyro is disclosed having a long life cathode located therein. The laser gyro comprises a block having a plurality of lasing tubes bored therethrough and being angularly disposed to each other to form a closed path within the block. A plurality of mirrors are positioned at the intersection of the tubes to reflect light from one tube into the next. A pair of anodes are inserted into two of the lasing tubes. A cavity is formed within the center of the block and is connected to the triangular laser path via a conduit. The cavity contains a cathode for conducting direct current to each of the anodes. These current flows energize the lasing gas to create a pair of laser beams moving in opposite directions in the closed path. The cathode is a closed end, hollow cylinder made of aluminum having a layer of oxide formed thereon by means of anodization.