Abstract: A wireless data terminal apparatus, comprising: a wireless wide-area network (WAN) data terminal configured to provide data communication over a wireless wide-area telecommunication network, the wireless WAN data terminal including at least a data processor and an RF section; and a network processing module configured to provide access to a local-area network (LAN), the network processing module providing multi-port switch functionality to allow connection of the wireless WAN data terminal to a plurality of LAN devices coupled to the LAN.

Abstract: A bone plate for fixation of a fractured bone comprises a first portion having a first longitudinal axis, an upper surface and a lower surface and a second portion having a second longitudinal axis, an upper surface and a lower surface. The second portion is angled with respect to the first portion such that the lower surface of the first portion and the lower surface of the second portion define an included angle therebetween. The first portion has at least one hole for receiving a bone anchor having a shaft. The hole has a first hole portion defining a first central axis substantially perpendicular to the lower surface and the first hole portion is configured to receive the bone anchor.

Abstract: An embodiment of this invention pertains to a versatile and flexible logic element and logic array block (“LAB”). Each logic element includes a programmable combinational logic function block such as a lookup table (“LUT”) and a flip-flop. Within the logic element, multiplexers are provided to allow the flip-flop and the LUT to be programmably connected such that either the output of the LUT may be connected to the input of the flip-flop or the output of the flip-flop may be connected to the input of the LUT. An additional multiplexer allows the output of the flip-flop in one logic element to be connected to the input of a flip-flop in a different logic element within the same LAB. Output multiplexers selects between the output of the LUT and the output of the flip-flop to generate signals that drive routing lines within the LAB and to routing lines external to the LAB.

Abstract: An embodiment of this invention pertains to a versatile and flexible logic element and logic array block (“LAB”). Each logic element includes a programmable combinational logic function block such as a lookup table (“LUT”) and a flip-flop. Within the logic element, multiplexers are provided to allow the flip-flop and the LUT to be programmably connected such that either the output of the LUT may be connected to the input of the flip-flop or the output of the flip-flop may be connected to the input of the LUT. An additional multiplexer allows the output of the flip-flop in one logic element to be connected to the input of a flip-flop in a different logic element within the same LAB. Output multiplexers selects between the output of the LUT and the output of the flip-flop to generate signals that drive routing lines within the LAB and to routing lines external to the LAB.

Abstract: Methods for forming a composite for use as a vehicle weather strip and the products formed thereby are disclosed in which a main body member is formed from an elastomer polymer and an abrasion resistant decorative layer including a blend of a crosslinkable thermoplastic polyolefin and a thermoplastic vulcanizate is applied thereon. The crosslinkable thermoplastic polyolefin preferably includes a crosslinkable olefin homopolymer. The olefin homopolymer preferably contains grafted silane functional groups to allow the material to be crosslinked in the presence of moisture. The abrasion resistant decorative layer may be extruded or otherwise applied onto the main body either prior to or after the main body member is cured and either prior to or after the crosslinkable polyolefin of the abrasion resistant decorative layer is crosslinked. The material of the abrasion resistant decorative layer may be extruded into sheet form and laminated onto the main body member.

Abstract: A specialized desoldering unit head is provided for the limited purpose of removing high-density solid state electronic components from circuit boards in a single step, without damaging the circuit board. In the typical case of a four-sided component with a row of leads on each side, the unit includes an electrically heated head which fits over the component with a heat-conducting blade fitting over each of the rows on the four sides of the component. The head has depth limiters stop means formed by at least one adjustable screw threaded through at least one laterally extended cross-strap on the head and positioned to engage against the top of the component to limit the lowering of the heated blades relative to the rows of leads so that the heated blades do not touch the circuit board, or even the horizontal portion of the surface-mounted leads of the lead rows, but only mounds of solder which have been applied over the leads to facilitate their heating and the removal of the component.

Abstract: A specialized desoldering iron utilizes a blade which takes the form of a quadrilateral enclosure having a pair of heating elements mounted to two opposite walls of the enclosure. The enclosure is shaped and dimensioned to fit over a quad flat pack integrated circuit such that the lower edges of the walls of the enclosure come down onto the soldered leads of the integrated circuit. The two heating elements provide enough heat to simultaneously desolder all of the leads of a large quad flat pack, and the enclosure is open-topped so that the large heat sinks which are mounted atop IC's that consume a high level of power do not interfere with the desoldering process.

Abstract: A soldering iron which is developed specifically to address a wide variety of miniaturized integrated circuit soldered pin configurations has a handle with a heating block which mounts one of a set of wide, chisel-shaped blades that are engaged in a deep channel in the heating block and which taper gradually to a knife edge which is the operative edge of the soldering head. The wide, thin, extensively tapered and knife-edged blade usually addresses a row of integrated circuit pins or surface mounted leads to act brush-like to solder them substantially at the same time, or to heat them substantially simultaneously when desoldering the row to remove the component.