Abstract: A multilayered electronic component that is easy to manufacture and that has excellent electrical characteristics includes end portions of coil wiring patterns that oppose a coil connection electrode that is displaced on the surface of a second ceramic layer due to an increase or decrease in the number of first ceramic layers. A coil connection electrode has a shape in which surface portions of second ceramic layers or opposed second ceramic layers having the first ceramic layers disposed in between are connected to the end portions of the coil wiring patterns that oppose the respective coil connection electrode, which are displaced due to the increase or decrease in the number of the first ceramic layers. A connection wiring pattern has a shape in which one portion of a coil connection electrode is connected to one portion of an external extension electrode connection pattern.

Abstract: A method for manufacturing a plasma display panel is provided which is capable of enhancing luminance of a plasma display panel by forming a grid-shaped rib in the plasma display panel so as to be square-shaped. In the method for manufacturing a plasma display panel in which a front substrate and a rear substrate are arranged with the grid-shaped rib being interposed between the front substrate and the rear substrate in a manner in which both the substrates face each other, the grid-shaped rib is formed by using a resist mask in which a cut is formed only in both corner portions, in a pattern in a direction intersecting the column electrode, contacting a pattern parallel to the column electrode, in a pattern corresponding to a shape of the grid-shaped rib.

Abstract: To provide a dielectric-layer-provided copper foil or the like for extremely improving the product yield while making the most use of the increase effect of an electric capacity of a thin dielectric layer using the sputtering vapor deposition method. In the case of dielectric-layer-provided copper foils respectively having a dielectric layer on one side of a copper foil, the dielectric layer 6 is an inorganic-oxide sputter film having a thickness of 1.0 ?m or less and formed on the one side of the copper foil in accordance with the sputtering vapor deposition method and the dielectric-layer-provided copper foils for respectively forming a capacitor layer, characterized in that a pit-like defective portion generated on the inorganic-oxide sputter film is sealed by polyimide resin are used.

Abstract: A laminated coil array includes a laminate including a plurality of ceramic layers and a plurality of internal conductors disposed one on top of another, at least three coil conductors defined by electrically connecting internal conductors of the plurality of internal conductors and arranged in line inside the laminate, and external electrodes disposed on a surface of the laminate and electrically connected to end portions of the at least three spiral coil conductors, respectively. In the coil conductors not located on both end portions in the arrangement direction of the coil conductors, the internal conductors are arranged so as to be partially reversed.

Abstract: A laminated coil array includes a laminate including a plurality of ceramic layers and a plurality of internal conductors disposed one on top of another, at least three coil conductors defined by electrically connecting internal conductors of the plurality of internal conductors and arranged in line inside the laminate, and external electrodes disposed on a surface of the laminate and electrically connected to end portions of the at least three spiral coil conductors, respectively. In the coil conductors not located on both end portions in the arrangement direction of the coil conductors, the internal conductors are arranged so as to be partially reversed.

Abstract: A method of forming a dielectric layer containing dielectric filler, which is excellent in film thickness uniformity, from a polyimide electrodeposition liquid containing dielectric filler. In particular, a method of forming a polyimide coating container dielectric filler on a surface of metallic material according to the electrodeposition coating technique, characterized in that as the dielectric filler, use is made of dielectric powder of perovskite structure in approximately spherical form which has an average particle diameter (D1A) of 0.05 to 1.0 ?m and a weight cumulative particle diameter (D50), measured in accordance with the laser diffraction scattering type particle size distribution measuring method, of 0.1 to 2.0 ?m and further exhibits an aggregation degree, in terms of D50/D1a wherein D50 and D1a represent a weight cumulative particle diameter and an average particle diameter obtained by image analysis, respectively, of 4.5 or less.

Abstract: A multilayered electronic component that is easy to manufacture and that has excellent electrical characteristics includes end portions of coil wiring patterns that oppose a coil connection electrode that is displaced on the surface of a second ceramic layer due to an increase or decrease in the number of first ceramic layers. A coil connection electrode has a shape in which surface portions of second ceramic layers or opposed second ceramic layers having the first ceramic layers disposed in between are connected to the end portions of the coil wiring patterns that oppose the respective coil connection electrode, which are displaced due to the increase or decrease in the number of the first ceramic layers. A connection wiring pattern has a shape in which one portion of a coil connection electrode is connected to one portion of an external extension electrode connection pattern.

Abstract: A method for manufacturing a plasma display panel is provided which is capable of enhancing luminance of a plasma display panel by forming a grid-shaped rib in the plasma display panel so as to be square-shaped. In the method for manufacturing a plasma display panel in which a front substrate and a rear substrate are arranged with the grid-shaped rib being interposed between the front substrate and the rear substrate in a manner in which both the substrates face each other, the grid-shaped rib is formed by using a resist mask in which a cut is formed only in both corner portions, in a pattern in a direction intersecting the column electrode, contacting a pattern parallel to the column electrode, in a pattern corresponding to a shape of the grid-shaped rib.

Abstract: A cleaned pulling room installed with a plurality of single crystal pulling apparatuses, having a plurality of operation floors and supplied with clean air as a down flow from a ceiling or an upper position neighboring the ceiling, wherein at least three operation floors are provided depending on degrees of cleanness required for operations performed on each of the floors. Thus, there is provided a pulling room that can separate dusting operations such as operations of dismantlement and cleaning of the furnace body and structural members in the furnace body and operations requiring highly clean environment such as charging of raw material into the furnace body as preparation for starting running of the pulling apparatuses, and can secure safety of the operations even when the pulling apparatuses become larger.

Abstract: The circulating type grain drying machine is provided in which, at the grain filling operation, a controller causes a first heated air generator to operate and a second heated air generator to stop operating, and also causes, according to the detected values of the outside air humidity from an outside air humidity detector, an airflow control section to operate so as to change the quantity of the airflow by an air exhaust section. Also, at the drying operation, the controller controls the first heated air generator and controls the temperature of the heated air supplied into each heating pipe according to the detected values of the grain water content value, and controls the second heated air generator and controls the temperature of the temperature of the heated air supplied into the drying section according to the detected values of the grain water content values and the grain filling amount.