Patents by Inventor Hidenobu Nishikawa
Hidenobu Nishikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8866021Abstract: The invention includes: applying an anisotropic conductive resin including conductive particles only to a plurality of bumps of an electronic component; placing the electronic component above a main surface of a flexible wiring board via the anisotropic conductive resin; and pressurizing the electronic component to the wiring board and curing the anisotropic conductive resin applied to the plurality of bumps to join the plurality of bumps to the electrodes of the wiring board. This can prevent a defective mounting of the electronic component.Type: GrantFiled: September 13, 2012Date of Patent: October 21, 2014Assignee: Panasonic CorporationInventors: Hidenobu Nishikawa, Daido Komyoji
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Patent number: 8599571Abstract: Memory card (1) includes at least semiconductor chip (3), circuit board (2) with semiconductor chip (3) mounted on main surface (21), having at least rigidity reducing portion (23) formed in main surface (21) or in a linear region of surface (22) opposite to the main surface, and cover portion (71) for covering semiconductor chip (3) on main surface (21) of circuit board (2), wherein circuit board (2) has a plurality of convex regions (201) which flex in a convex shape toward main surface (21) due to rigidity reducing portion (23).Type: GrantFiled: April 18, 2007Date of Patent: December 3, 2013Assignee: Panasonic CorporationInventors: Hidenobu Nishikawa, Daido Komyoji, Atsunobu Iwamoto, Hiroyuki Yamada, Shuichi Takeda, Shigeru Kondou
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Publication number: 20130010436Abstract: The invention includes: applying an anisotropic conductive resin including conductive particles only to a plurality of bumps of an electronic component; placing the electronic component above a main surface of a flexible wiring board via the anisotropic conductive resin; and pressurizing the electronic component to the wiring board and curing the anisotropic conductive resin applied to the plurality of bumps to join the plurality of bumps to the electrodes of the wiring board. This can prevent a defective mounting of the electronic component.Type: ApplicationFiled: September 13, 2012Publication date: January 10, 2013Inventors: Hidenobu NISHIKAWA, Daido Komyoji
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Patent number: 8291582Abstract: The invention includes: applying an anisotropic conductive resin including conductive particles only to a plurality of bumps of an electronic component; placing the electronic component above a main surface of a flexible wiring board via the anisotropic conductive resin; and pressurizing the electronic component to the wiring board and curing the anisotropic conductive resin applied to the plurality of bumps to join the plurality of bumps to the electrodes of the wiring board. This can prevent a defective mounting of the electronic component.Type: GrantFiled: January 31, 2007Date of Patent: October 23, 2012Assignee: Panasonic CorporationInventors: Hidenobu Nishikawa, Daido Komyoji
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Patent number: 8223500Abstract: A memory card includes a circuit board, semiconductor chips mounted on different areas on the circuit board, a semiconductor chip with a semiconductor electrode on its top face and being fixed such that at least a part of its bottom face faces at least a part of a top face of the semiconductor chip, a wire for connecting the semiconductor electrode and a board electrode on the circuit board to achieve a mounting state of the semiconductor chip, and a cover for covering a circuit formation area from an upper side of the circuit board. The circuit formation area includes three semiconductor chips and the wire. At least a part of each of three semiconductor chips, at least a part of the circuit board, and the wire are covered with secondary sealing resin and primary sealing resin.Type: GrantFiled: May 26, 2008Date of Patent: July 17, 2012Assignee: Panasonic CorporationInventors: Yuichiro Yamada, Hidenobu Nishikawa, Hiroyuki Yamada, Shuichi Takeda
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Patent number: 8125786Abstract: Memory card includes a circuit board, a component mounted on a main face of the circuit board, casing covering at least the main face of the circuit board and the component, and bittering agent retained in a roughened area provided on casing or an exposed part of the circuit board.Type: GrantFiled: January 26, 2007Date of Patent: February 28, 2012Assignee: Panasonic CorporationInventors: Hidenobu Nishikawa, Daido Komyoji, Hiroyuki Yamada, Yutaka Nakamura, Shuichi Takeda, Yasuharu Kikuchi
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Patent number: 8035225Abstract: A semiconductor chip dual-sided assembly which has a higher degree of reliability of connections between semiconductor chips and a circuit substrate is realized. This is achieved by the assembly including a plurality of upper side pads (2a) provided on a substrate upper surface (1a); a plurality of lower side pads (2b) provided on a substrate lower surface (1b) corresponding to the upper side pads (2a) across the substrate (1), respectively; a first semiconductor chip (4) having first bumps (8a) joined to the upper side pads (2a), respectively; and a second semiconductor chip (5) having second bumps (8b) joined to the lower side pads (2b), respectively.Type: GrantFiled: December 28, 2005Date of Patent: October 11, 2011Assignee: Panasonic CorporationInventors: Kojiro Nakamura, Hidenobu Nishikawa, Kentaro Kumazawa
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Patent number: 8031127Abstract: The semiconductor memory module incorporating antenna includes a wiring board (11) having a connection terminal (17) connected with a control semiconductor element (16) and arranged at a position exposed to the surface of an outer case (15), and a terminal electrode (18) for antenna connection connected with the control semiconductor element (16) and arranged in the outer case (15); a semiconductor storage element (12) mounted on one side of the wiring board (11); and a loop-like antenna (13) and an antenna terminal electrode (20) formed on the other side of the wiring board (11) along the outer peripheral thereof, the wiring board (11) includes at least one magnetic body layer (14) and the terminal electrode (18) for antenna connection is connected with the antenna terminal electrode (20).Type: GrantFiled: March 28, 2007Date of Patent: October 4, 2011Assignee: Panasonic CorporationInventors: Shozo Ochi, Hidenobu Nishikawa, Hiroshi Sakurai
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Patent number: 8007627Abstract: A chip is bonded on a circuit board by aligning in position bumps with board electrodes with interposition of an anisotropic conductive layer between the chip and the circuit board. The anisotropic conductive layer is a mixture of an insulating resin, conductive particles and an inorganic filler. The chip is pressed against the board with a pressure force of not smaller than 20 gf per bump by virtue of a tool, while warp of the chip is corrected and the board is connected, the bumps are compressed, and the insulating resin is hardened.Type: GrantFiled: February 23, 2005Date of Patent: August 30, 2011Assignee: Panasonic CorporationInventors: Kazuto Nishida, Hidenobu Nishikawa, Yoshinori Wada, Hiroyuki Otani
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Patent number: 7939923Abstract: A memory card includes a circuit board, a first semiconductor chip mounted on the circuit board with a bump sandwiched between the first semiconductor chip and the circuit board, a second semiconductor chip mounted on the circuit board with a bump sandwiched between the second semiconductor chip and the circuit board with a clearance not greater than 1 mm between the first semiconductor chip and the second semiconductor chip, a first sealing resin layer surrounding the bump and existing between the first semiconductor chip and the circuit board, and a second sealing resin layer surrounding the bump and existing between the second semiconductor chip and the circuit board, and a cover covering the first semiconductor chip, the second semiconductor chip on a principal face of the circuit board.Type: GrantFiled: January 31, 2007Date of Patent: May 10, 2011Assignee: Panasonic CorporationInventors: Hidenobu Nishikawa, Hiroyuki Yamada, Shuichi Takeda, Atsunobu Iwamoto
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Patent number: 7933127Abstract: A memory card includes a first circuit board, a first semiconductor chip mounted to a top face of the first circuit board with a part of its under face confronting the first circuit board, a second circuit board of which a top face is bonded to a under face of the first circuit board, a second semiconductor chip mounted to the top face of the second circuit board with at least a part of the second semiconductor chip confronting a part of another part other than the part of the under face of the first semiconductor chip, and a cover disposed over the top face of the second circuit board for covering the first semiconductor chip, the first circuit board and the second semiconductor chip.Type: GrantFiled: January 24, 2007Date of Patent: April 26, 2011Assignee: Panasonic CorporationInventors: Hidenobu Nishikawa, Hiroyuki Yamada, Shuichi Takeda, Atsunobu Iwamoto
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Patent number: 7910406Abstract: An electronic circuit device includes at least one semiconductor element, a plurality of external connection terminals, connecting conductors electrically connecting the semiconductor element and external connection terminals, and an insulating resin covering the semiconductor element and supporting the connecting conductors integrally. The semiconductor element is buried in the insulating resin, and terminal surfaces of the external connection terminals are exposed from the insulating resin.Type: GrantFiled: October 19, 2006Date of Patent: March 22, 2011Assignee: Panasonic CorporationInventors: Kentaro Kumazawa, Shigeru Kondou, Hidenobu Nishikawa
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Patent number: 7775446Abstract: Card type information device includes wiring board having a wiring pattern with an electronic component mounted on a first face of wiring board and an antenna connecting electrode, antenna board having antenna pattern with antenna terminal electrode formed on a first face of antenna board, magnetic material placed between wiring board and antenna board confronting each other, flexible wiring board for coupling the antenna connecting electrode to antenna terminal electrode, and housing for accommodating wiring board, antenna board, magnetic material, and flexible wiring board. Wiring board and antenna board are made from one and the same insulating motherboard.Type: GrantFiled: February 26, 2007Date of Patent: August 17, 2010Assignee: Panasonic CorporationInventors: Shozo Ochi, Osamu Uchida, Shigeaki Sakatani, Daisuke Sakurai, Masato Mori, Hiroshi Sakurai, Hidenobu Nishikawa
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Publication number: 20100193927Abstract: A memory card includes a circuit board, a first semiconductor chip mounted on the circuit board with a bump sandwiched between the first semiconductor chip and the circuit board, a second semiconductor chip mounted on the circuit board with a bump sandwiched between the second semiconductor chip and the circuit board with a clearance not greater than 1 mm between the first semiconductor chip and the second semiconductor chip, a first sealing resin layer surrounding the bump and existing between the first semiconductor chip and the circuit board, and a second sealing resin layer surrounding the bump and existing between the second semiconductor chip and the circuit board, and a cover covering the first semiconductor chip, the second semiconductor chip on a principal face of the circuit board.Type: ApplicationFiled: January 31, 2007Publication date: August 5, 2010Applicant: PANASONIC CORPORATIONInventors: Hidenobu Nishikawa, Hiroyuki Yamada, Shuichi Takeda, Atsunobu Iwamoto
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Publication number: 20100165587Abstract: A memory card includes a circuit board, semiconductor chips mounted on different areas on the circuit board, a semiconductor chip with a semiconductor electrode on its top face and being fixed such that at least a part of its bottom face faces at least a part of a top face of the semiconductor chip, a wire for connecting the semiconductor electrode and a board electrode on the circuit board to achieve a mounting state of the semiconductor chip, and a cover for covering a circuit formation area from an upper side of the circuit board. The circuit formation area includes three semiconductor chips and the wire. At least a part of each of three semiconductor chips, at least a part of the circuit board, and the wire are covered with secondary sealing resin and primary sealing resin.Type: ApplicationFiled: May 26, 2008Publication date: July 1, 2010Inventors: Yuichiro Yamada, Hidenobu Nishikawa, Hiroyuki Yamada, Shuichi Takeda
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Publication number: 20100157550Abstract: A memory card includes a first circuit board, a first semiconductor chip mounted to a top face of the first circuit board with a part of its under face confronting the first circuit board, a second circuit board of which a top face is bonded to a under face of the first circuit board, a second semiconductor chip mounted to the top face of the second circuit board with at least a part of the second semiconductor chip confronting a part of another part other than the part of the under face of the first semiconductor chip, and a cover disposed over the top face of the second circuit board for covering the first semiconductor chip, the first circuit board and the second semiconductor chip.Type: ApplicationFiled: January 24, 2007Publication date: June 24, 2010Inventors: Hidenobu Nishikawa, Hiroyuki Yamada, Shuichi Takeda, Atsunobu Iwamoto
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Publication number: 20100084762Abstract: Memory card (1) includes at least semiconductor chip (3), circuit board (2) with semiconductor chip (3) mounted on main surface (21), having at least rigidity reducing portion (23) formed in main surface (21) or in a linear region of surface (22) opposite to the main surface, and cover portion (71) for covering semiconductor chip (3) on main surface (21) of circuit board (2), wherein circuit board (2) has a plurality of convex regions (201) which flex in a convex shape toward main surface (21) due to rigidity reducing portion (23).Type: ApplicationFiled: April 18, 2007Publication date: April 8, 2010Inventors: Hidenobu Nishikawa, Daido Komyoji, Atsunobu Iwamoto, Hiroyuki Yamada, Shuichi Takeda, Shigeru Kondou
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Patent number: 7683482Abstract: A chip is bonded on a circuit board by aligning in position bumps with board electrodes with interposition of an anisotropic conductive layer between the chip and the circuit board. The anisotropic conductive layer is a mixture of an insulating resin, conductive particles and an inorganic filler. The chip is pressed against the board with a pressure force of not smaller than 20 gf per bump by virtue of a tool, while warp of the chip and the board is connected, the bumps are compressed, and the insulating resin is hardened.Type: GrantFiled: September 27, 2006Date of Patent: March 23, 2010Assignee: Panasonic CorporationInventors: Kazuto Nishida, Hidenobu Nishikawa, Yoshinori Wada, Hiroyuki Otani
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Publication number: 20090267214Abstract: The electronic circuit device of the present invention includes at least one semiconductor element, a plurality of external connection terminals, a connecting conductor for electrically connecting semiconductor element and external connection terminals, and an insulating resin for covering the semiconductor element and supporting the connecting conductor integrally, in which the semiconductor element is buried in the insulating resin, and the terminal surface of the external connection terminals is exposed from the insulating resin.Type: ApplicationFiled: October 19, 2006Publication date: October 29, 2009Inventors: Kentaro Kumazawa, Shigeru Kondou, Hidenobu Nishikawa
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Publication number: 20090173795Abstract: Card type information device includes wiring board having a wiring pattern with an electronic component mounted on a first face of wiring board and an antenna connecting electrode, antenna board having antenna pattern with antenna terminal electrodes formed on a first face of antenna board, magnetic material placed between wiring board and antenna board confronting each other, flexible wiring board for coupling the antenna connecting electrode to antenna terminal electrode, and housing for accommodating wiring board, antenna board, magnetic material, and flexible wiring board. Wiring board and antenna board are made from one and the same insulating motherboard.Type: ApplicationFiled: February 26, 2007Publication date: July 9, 2009Inventors: Shozo Ochi, Osamu Uchida, Shigeaki Sakatani, Daisuke Sakurai, Masato Mori, Hiroshi Sakurai, Hidenobu Nishikawa