Patents by Inventor Hideto Yamaguchi

Hideto Yamaguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180328790
    Abstract: A thermocouple includes: a temperature measuring portion configured to measure an internal temperature of a reaction tube; a main body portion provided therein with a wire which constitutes the temperature measuring portion; and a cushioning portion attached to the main body portion at least in the vicinity of the temperature measuring portion, wherein the thermocouple is fixed to an outer surface of the reaction tube in a state in which the thermocouple makes contact with the reaction tube through the cushioning portion.
    Type: Application
    Filed: July 26, 2018
    Publication date: November 15, 2018
    Applicant: HITACHI KOKUSAI ELECTRIC INC.
    Inventors: Akihiro OSAKA, Hideto YAMAGUCHI, Tetsuya KOSUGI, Tokunobu AKAO, Atsushi UMEKAWA, Motoya TAKEWAKI
  • Publication number: 20180211840
    Abstract: There is provided a technology includes: heating a heat insulating plate, which is held by a substrate holder configured to hold a substrate, to a processing temperature, at which the substrate is processed, by an electromagnetic wave supplied from a heating device, and measuring a temperature change of the heat insulating plate until the heat insulating plate reaches the processing temperature; heating the substrate, to the processing temperature and measuring a temperature change of the substrate until the substrate reaches the processing temperature; obtaining a correlation between the temperature change of the heat insulating plate and the temperature change of the substrate and heating the substrate by controlling the heating device based on the temperature of the heat insulating plate and the correlation.
    Type: Application
    Filed: March 19, 2018
    Publication date: July 26, 2018
    Applicant: HITACHI KOKUSAI ELECTRIC INC.
    Inventors: Hideto YAMAGUCHI, Yukitomo HIROCHI
  • Publication number: 20180040520
    Abstract: A substrate processing apparatus includes: a reaction tube configured to accommodate a substrate holder holding a plurality of substrates and process a substrate held on the substrate holder; a heating unit installed outside the reaction tube and configured to heat an inside of the reaction tube; a protection tube installed to extend in a vertical direction in contact with an outer wall of the reaction tube; an insulating tube disposed inside the protection tube and having through-holes extending in a vertical direction; a thermocouple having a thermocouple junction provided at an upper end thereof, and thermocouple wires joined at the thermocouple junction and inserted into the through-holes of the insulating tube; a gas supply unit configured to supply a gas, for processing a substrate accommodated in the reaction tube, into the reaction tube; and an exhaust unit configured to exhaust a gas from the reaction tube.
    Type: Application
    Filed: October 20, 2017
    Publication date: February 8, 2018
    Applicant: HITACHI KOKUSAI ELECTRIC, INC.
    Inventors: Hideto YAMAGUCHI, Tetsuya KOSUGI, Masaaki UENO
  • Publication number: 20160245704
    Abstract: A thermocouple includes: a temperature measuring portion configured to measure an internal temperature of a reaction tube; a main body portion provided therein with a wire which constitutes the temperature measuring portion; and a cushioning portion attached to the main body portion at least in the vicinity of the temperature measuring portion, wherein the thermocouple is fixed to an outer surface of the reaction tube in a state in which the thermocouple makes contact with the reaction tube through the cushioning portion.
    Type: Application
    Filed: February 24, 2016
    Publication date: August 25, 2016
    Applicant: HITACHI KOKUSAI ELECTRIC INC.
    Inventors: Akihiro OSAKA, Hideto YAMAGUCHI, Tetsuya KOSUGI, Tokunobu AKAO, Atsushi UMEKAWA, Motoya TAKEWAKI
  • Patent number: 9418881
    Abstract: Provided is a substrate processing apparatus capable of suppressing inferiority when heat treatment is controlled using a temperature sensor.
    Type: Grant
    Filed: July 28, 2011
    Date of Patent: August 16, 2016
    Assignee: HITACHI KOKUSAI ELECTRIC INC.
    Inventors: Shinobu Sugiura, Masaaki Ueno, Kazuo Tanaka, Masashi Sugishita, Hideto Yamaguchi, Kenji Shirako
  • Patent number: 9269638
    Abstract: A temperature detecting apparatus is provided which is capable of suppressing disconnection of a thermocouple wire or positional deviation of a thermocouple junction portion caused by change over time. The temperature detecting apparatus includes: an insulation rod installed to extend in a vertical direction and including a through-hole in vertical direction; a thermocouple wire inserted in the through-hole of the insulation rod, the thermocouple wire including a thermocouple junction portion at an upper end thereof and an angled portion at a lower end of the insulation rod; and a buffer area installed below the insulation rod and configured to suppress a restriction of a horizontal portion of the angled portion upon heat expansion, wherein an upper portion of the thermocouple wire or a middle portion in the vertical direction are supported by the insulation rod.
    Type: Grant
    Filed: July 30, 2014
    Date of Patent: February 23, 2016
    Assignee: HITACHI KOKUSAI ELECTRIC INC.
    Inventors: Tetsuya Kosugi, Masaaki Ueno, Hideto Yamaguchi
  • Publication number: 20140342474
    Abstract: A temperature detecting apparatus is provided which is capable of suppressing disconnection of a thermocouple wire or positional deviation of a thermocouple junction portion caused by change over time. The temperature detecting apparatus includes: an insulation rod installed to extend in a vertical direction and including a through-hole in vertical direction; a thermocouple wire inserted in the through-hole of the insulation rod, the thermocouple wire including a thermocouple junction portion at an upper end thereof and an angled portion at a lower end of the insulation rod; and a buffer area installed below the insulation rod and configured to suppress a restriction of a horizontal portion of the angled portion upon heat expansion, wherein an upper portion of the thermocouple wire or a middle portion in the vertical direction are supported by the insulation rod.
    Type: Application
    Filed: July 30, 2014
    Publication date: November 20, 2014
    Applicant: HITACHI KOKUSAI ELECTRIC INC.
    Inventors: Tetsuya KOSUGI, Masaaki UENO, Hideto YAMAGUCHI
  • Patent number: 8822240
    Abstract: A temperature detecting apparatus is provided which is capable of suppressing disconnection of a thermocouple wire or positional deviation of a thermocouple junction portion caused by change over time. The temperature detecting apparatus includes: an insulation rod installed to extend in a vertical direction and including a through-hole in vertical direction; a thermocouple wire inserted in the through-hole of the insulation rod, the thermocouple wire including a thermocouple junction portion at an upper end thereof and an angled portion at a lower end of the insulation rod; and a buffer area installed below the insulation rod and configured to suppress a restriction of a horizontal portion of the angled portion upon heat expansion, wherein an upper portion of the thermocouple wire or a middle portion in the vertical direction are supported by the insulation rod.
    Type: Grant
    Filed: June 28, 2012
    Date of Patent: September 2, 2014
    Assignee: Hitachi Kokusai Electric Inc.
    Inventors: Tetsuya Kosugi, Masaaki Ueno, Hideto Yamaguchi
  • Publication number: 20140120636
    Abstract: A substrate processing apparatus includes: a reaction tube configured to accommodate a substrate holder holding a plurality of substrates and process a substrate held on the substrate holder; a heating unit installed outside the reaction tube and configured to heat an inside of the reaction tube; a protection tube installed to extend in a vertical direction in contact with an outer wall of the reaction tube; an insulating tube disposed inside the protection tube and having through-holes extending in a vertical direction; a thermocouple having a thermocouple junction provided at an upper end thereof, and thermocouple wires joined at the thermocouple junction and inserted into the through-holes of the insulating tube; a gas supply unit configured to supply a gas, for processing a substrate accommodated in the reaction tube, into the reaction tube; and an exhaust unit configured to exhaust a gas from the reaction tube.
    Type: Application
    Filed: September 23, 2013
    Publication date: May 1, 2014
    Applicant: Hitachi Kokusai Electric Inc.
    Inventors: Hideto YAMAGUCHI, Tetsuya KOSUGI, Masaaki UENO
  • Patent number: 8380360
    Abstract: In a temperature control method in which a target temperature is given in a thermal treatment furnace and plural heaters are controlled according to the target temperature, the correlation of the each heater and plural profile temperature sensors provided in the thermal treatment furnace is determined, a virtual temperature is calculated on the basis of the detection temperature of each profile temperature sensor and a weighting factor calculated from the correlation, and the each heater is controlled so that the virtual temperature is coincident with the target temperature.
    Type: Grant
    Filed: September 9, 2008
    Date of Patent: February 19, 2013
    Assignee: Hitachi Kokusai Electric Inc.
    Inventor: Hideto Yamaguchi
  • Publication number: 20130017628
    Abstract: A temperature detecting apparatus is provided which is capable of suppressing disconnection of a thermocouple wire or positional deviation of a thermocouple junction portion caused by change over time. The temperature detecting apparatus includes: an insulation rod installed to extend in a vertical direction and including a through-hole in vertical direction; a thermocouple wire inserted in the through-hole of the insulation rod, the thermocouple wire including a thermocouple junction portion at an upper end thereof and an angled portion at a lower end of the insulation rod; and a buffer area installed below the insulation rod and configured to suppress a restriction of a horizontal portion of the angled portion upon heat expansion, wherein an upper portion of the thermocouple wire or a middle portion in the vertical direction are supported by the insulation rod.
    Type: Application
    Filed: June 28, 2012
    Publication date: January 17, 2013
    Applicant: HITACHI KOKUSAI ELECTRIC INC.
    Inventors: Tetsuya KOSUGI, Masaaki UENO, Hideto YAMAGUCHI
  • Patent number: 8266095
    Abstract: There is provided a substrate processing system that can automatically inspect the operation of various kinds of parts of a semiconductor manufacturing apparatus without increasing the load of a main controller in the semiconductor manufacturing apparatus. In the substrate processing system of the present invention, inspection data of the semiconductor manufacturing apparatus 1 under operation are shared and collected online by a main controller 5, a data collection auxiliary computer 2 and a data collecting computer 3 through a network 6, and the operation state is collectively inspected by an inspecting computer 4.
    Type: Grant
    Filed: June 18, 2007
    Date of Patent: September 11, 2012
    Assignee: Hitachi Kokusai Electric, Inc.
    Inventors: Hideto Yamaguchi, Yasuhiro Joho, Mitsuhiro Matsuda, Yoshitaka Koyama
  • Publication number: 20120094010
    Abstract: Provided is a substrate processing apparatus capable of suppressing inferiority when heat treatment is controlled using a temperature sensor.
    Type: Application
    Filed: July 28, 2011
    Publication date: April 19, 2012
    Applicant: HITACHI KOKUSAI ELECTRIC INC.
    Inventors: Shinobu SUGIURA, Masaaki UENO, Kazuo TANAKA, Masashi SUGISHITA, Hideto YAMAGUCHI, Kenji SHIRAKO
  • Publication number: 20100223277
    Abstract: There is provided a substrate processing system that can automatically inspect the operation of various kinds of parts of a semiconductor manufacturing apparatus without increasing the load of a main controller in the semiconductor manufacturing apparatus. In the substrate processing system of the present invention, inspection data of the semiconductor manufacturing apparatus 1 under operation are shared and collected online by a main controller 5, a data collection auxiliary computer 2 and a data collecting computer 3 through a network 6, and the operation state is collectively inspected by an inspecting computer 4.
    Type: Application
    Filed: June 18, 2007
    Publication date: September 2, 2010
    Inventors: Hideto Yamaguchi, Yasuhiro Joho, Mitsuhiro Matsuda, Yoshitaka Koyama
  • Publication number: 20090105867
    Abstract: In a temperature control method in which a target temperature is given in a thermal treatment furnace and plural heaters are controlled according to the target temperature, the correlation of the each heater and plural profile temperature sensors provided in the thermal treatment furnace is determined, a virtual temperature is calculated on the basis of the detection temperature of each profile temperature sensor and a weighting factor calculated from the correlation, and the each heater is controlled so that the virtual temperature is coincident with the target temperature.
    Type: Application
    Filed: September 9, 2008
    Publication date: April 23, 2009
    Applicant: Hitachi Kokusai Electric, Inc.
    Inventor: Hideto Yamaguchi
  • Patent number: D778741
    Type: Grant
    Filed: August 19, 2015
    Date of Patent: February 14, 2017
    Assignee: HITACHI KOKUSAI ELECTRIC INC.
    Inventors: Akihiro Osaka, Hideto Yamaguchi, Motoya Takewaki
  • Patent number: D778742
    Type: Grant
    Filed: August 19, 2015
    Date of Patent: February 14, 2017
    Assignee: HITACHI KOKUSAI ELECTRIC INC.
    Inventors: Akihiro Osaka, Hideto Yamaguchi, Motoya Takewaki
  • Patent number: D780606
    Type: Grant
    Filed: August 19, 2015
    Date of Patent: March 7, 2017
    Assignee: HITACHI KOKUSAI ELECTRIC INC.
    Inventors: Akihiro Osaka, Hideto Yamaguchi, Moyota Takewaki
  • Patent number: D786951
    Type: Grant
    Filed: August 19, 2015
    Date of Patent: May 16, 2017
    Assignee: HITACHI KOKUSAI ELECTRIC INC.
    Inventors: Akihiro Osaka, Hideto Yamaguchi, Motoya Takewaki
  • Patent number: D790490
    Type: Grant
    Filed: March 2, 2016
    Date of Patent: June 27, 2017
    Assignee: HITACHI KOKUSAI ELECTRIC INC.
    Inventors: Akihiro Osaka, Hideto Yamaguchi, Motoya Takewaki