Abstract: A solid electrolytic capacitor includes a capacitor element, an anode terminal, a cathode terminal, and an outer casing resin. The anode and cathode terminals constitute parts of the mounting surface, and are drawn immediately below the capacitor element. The anode terminal and the cathode terminal are electrically coupled with an anode leader of the capacitor element and a cathode layer, respectively. The outer casing resin covers the capacitor element, and exposes the anode and cathode terminals on the mounting surface. At least one recess is provided on a mounting surface side of at least one of the anode and cathode terminals having a larger area projected onto the mounting surface.

Abstract: A solid electrolytic capacitor includes a plurality of laminated capacitor elements; an anode terminal connected to an anode portion where anode exposed portions of the capacitor elements are connected together; and a cathode terminal connected to a cathode portion where cathode layers of the capacitor elements are bonded together. Between lamination planes of the cathode layers of the capacitor elements, a conductive sheet is disposed. The capacitor elements are coated with a packaging resin layer in such a manner that a part of the anode terminal and a part of the cathode terminal are exposed.

Abstract: A solid electrolytic capacitor includes a capacitor element, an anode terminal, a cathode terminal, and an outer casing resin. The anode and cathode terminals constitute parts of the mounting surface, and are drawn immediately below the capacitor element. The anode terminal and the cathode terminal are electrically coupled with an anode leader of the capacitor element and a cathode layer, respectively. The outer casing resin covers the capacitor element, and exposes the anode and cathode terminals on the mounting surface. At least one recess is provided on a mounting surface side of at least one of the anode and cathode terminals having a larger area projected onto the mounting surface.

Abstract: A solid electrolytic capacitor includes a capacitor unit having a cathode frame coupled to a cathode part of a capacitor element, and anode frames formed at the opposite sides of the capacitor unit sandwiching a cathode frame, and coupled to an anode part of the capacitor element. Flat parts provided at the opposite ends of anode terminals are coupled to the anode frames. A flat part provided in the center of a cathode terminal is coupled to the cathode frame. The capacitor unit is covered with coating resin. The solid electrolytic capacitor has a simplified structure and a lower ESL.

Abstract: A solid electrolytic capacitor including capacitor unit having cathode frame coupled to cathode part of capacitor element, and anode frames formed at the opposite sides of capacitor unit sandwiching cathode frame, and coupled to anode part of capacitor element. Flat parts provided at the opposite ends of anode terminals are coupled to anode frames. Flat part provided in the center of cathode terminal is coupled to cathode frame. Capacitor unit is covered with coating resin. The solid electrolytic capacitor has simplified structure and a lower ESL.

Abstract: A solid electrolytic capacitor includes a plurality of laminated capacitor elements; an anode terminal connected to an anode portion where anode exposed portions of the capacitor elements are connected together; and a cathode terminal connected to a cathode portion where cathode layers of the capacitor elements are bonded together. Between lamination planes of the cathode layers of the capacitor elements, a conductive sheet is disposed. The capacitor elements are coated with a packaging resin layer in such a manner that a part of the anode terminal and a part of the cathode terminal are exposed.

Abstract: A shielding member (30) of the receptacle connector (A) has a fully shielding structure that surrounds the connector fitting section (2), and the shielding member (80) of the plug connector (B) has a fully shielding structure that surrounds the connector fitting section (54).

Abstract: A shielding member (30) of the receptacle connector (A) has a fully shielding structure that surrounds the connector fitting section (2), and the shielding member (80) of the plug connector (B) has a fully shielding structure that surrounds the connector fitting section (54).

Abstract: A temperature control method is provided which is capable of performing quick, accurate, and error-free soaking control over all wafer areas to be thermally treated at a target temperature without requiring any skilled operator and which can be automated by using a computer. In the temperature control method of controlling a heating apparatus having at least two heating zones in such a manner that temperatures detected at predetermined locations equal a target temperature therefor, temperatures are detected at predetermined locations the number of which is larger than the number of the heating zones, and the heating apparatus is controlled in such a manner that the target temperature falls between a maximum value and a minimum value of a plurality of detected temperatures.

Abstract: A temperature control simulation method and apparatus for forming a temperature system simulation model on a computer, provide substantially the same response or simulation characteristics as a temperature change in an actual furnace, whereby a temperature control algorithm can be developed and the method or manner of manipulating the temperature control can be learned without using an actual furnace. A transfer function is determined which represents a relationship between a heater input and a temperature output. A temperature control simulation for a heating furnace is executed using the transfer function of a heating furnace as a transfer function that a temperature system simulation device uses.

Abstract: A mobile station (mobile communication unit) receives system software from a base station via an antenna and a transmitter/receiver, and stores the received system software in a memory. A digital signal processor in the mobile station then performs communication processing according to the system software stored in the memory. By transmitting various system software from the base station, the single mobile station can easily be adapted to different communication principles. The base station also receives system software from a center via a public exchange network, and stores the received system software in a memory. A digital signal processor in the base station then performs communication processing according to the system software stored in the memory.

Abstract: A semiconductor producing apparatus is capable of quickly and accurately changing a controlled variable to a target value to thereby make the controlled variable quickly follow the target value. Moreover, the controlled variable and target value can be adjusted automatically, thus improving the productivity of a process. The semiconductor producing apparatus includes a PID adjustment section to which a target value and a detected control value are inputted through an adder, a pattern generation section having an approximate function for calculating a pattern output and making it possible to change the pattern output in accordance wit parameter values of the approximate function, and a switcher for switching between an output including at least an output of the pattern generation section and an output of the PID adjustment section to thereby generate an output.

Abstract: A temperature control method is provided which is capable of performing quick, accurate, and error-free soaking control over all wafer areas to be thermally treated at a target temperature without requiring any skilled operator and which can be automated by using a computer. In the temperature control method of controlling a heating apparatus having at least two heating zones in such a manner that temperatures detected at predetermined locations equal a target temperature therefor, temperatures are detected at predetermined locations the number of which is larger than the number of the heating zones, and the heating apparatus is controlled in such a manner that the target temperature falls between a maximum value and a minimum value of a plurality of detected temperatures.

Abstract: A chip-type solid electrolytic capacitor includes a cathode conductive layer provided on a whole surface of a cathode layer formed on an outer surface of a capacitor element, which whole surface is opposite to a surface where an anode lead wire is lead out, and on a surface adjacent to the first-mentioned whole surface. With this arrangement, if the capacitor element is obliquely inserted into a mold during the formation of a resin shell, the inner walls of the mold will not come into contact with cathode layer of the capacitor element, but will instead come into contact with the cathode conductive layer to prevent the cathode layer from being exposed to the resin shell. As a result, any possible damage to the cathode layer of the capacitor element when the peripheral surface of the resin shell on a cathode side is subjected to roughening is prevented to eliminate defects in electric characteristics such as leakage of electric current and a tan.delta. value.