Patents by Inventor Hidetsugu Namiki

Hidetsugu Namiki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160194531
    Abstract: This adhesive contains an epoxy compound, a cationic catalyst, and an acrylic resin that includes acrylic acid and an acrylic acid ester having a hydroxyl group. The acrylic acid in the acrylic resin reacts with the epoxy compound, creating a link between the acrylic resin island part and the epoxy compound sea part, and strengthening the anchoring effect with respect to the epoxy compound sea part by roughening the surface of an oxide film. Furthermore, the hydroxyl-group-containing acrylic acid ester in the acrylic resin becomes electrostatically adhesive to wiring due to the polarity of the hydroxyl group. Excellent adhesive strength can be obtained by adhering, in this way, the entire cured product composed of the acrylic resin island part and the epoxy compound sea part to the oxide film.
    Type: Application
    Filed: September 9, 2014
    Publication date: July 7, 2016
    Applicant: DEXERIALS CORPORATION
    Inventors: Masaharu AOKI, Shiyuki KANISAWA, Hidetsugu NAMIKI, Taichi KOYAMA, Akira ISHIGAMI
  • Patent number: 9340710
    Abstract: A light-reflective conductive particle for an anisotropic conductive adhesive used for anisotropic conductive connection of a light-emitting element to a wiring board includes a core particle coated with a metal material and a light-reflecting layer formed from light-reflective inorganic particles having a refractive index of 1.52 or more on a surface of the core particle. Examples of the light-reflective inorganic particles having a refractive index of 1.52 or more include titanium oxide particles, zinc oxide particles, or aluminum oxide particles.
    Type: Grant
    Filed: December 19, 2013
    Date of Patent: May 17, 2016
    Assignee: DEXERIALS CORPORATION
    Inventors: Hidetsugu Namiki, Shiyuki Kanisawa, Hideaki Umakoshi
  • Patent number: 9260634
    Abstract: A light-reflective anisotropic conductive adhesive is used for anisotropic conductive connection of a light-emitting element to a wiring board. The adhesive includes a thermosetting resin, conductive particles, and light-reflective acicular insulating particles. The conductive particles comprise a core particle coated with a metal particle or a metal material, and a light reflective layer formed on a surface of the core particle. The light reflective layer comprises inorganic particles selected from any one of titanium oxide particles, zinc oxide particles or aluminum oxide particles until the entire conductive particle appears a color in a range from white to gray.
    Type: Grant
    Filed: November 17, 2014
    Date of Patent: February 16, 2016
    Assignee: Dexerials Corporation
    Inventors: Hidetsugu Namiki, Shiyuki Kanisawa, Hideaki Umakoshi, Akira Ishigami
  • Publication number: 20150353781
    Abstract: Provided is a light emitting device high in the intensity of emitted light. A blue LED chip having a peak of emitted light in a wavelength range of at least 360 nm and at most 500 nm is adhered to an electrode substrate by an anisotropic conductive adhesive. A light reflecting layer made of a silver alloy on a surface of each conductive particle contained in the anisotropic conductive adhesive, and has high reflectance with respect to blue light. The light reflecting layer is formed by sputtering of a sputtering target that contains Ag, Bi, and Nd with the content ratio of Bi set to at least 0.1 weight % (wt %) and at most 3.0 wt % and the content ratio of Nd set to at least 0.1 weight % and at most 2.0 wt % with respect to the total weight of Ag, Bi, and Nd of 100 wt %. The conductive particle has high anti-migration properties.
    Type: Application
    Filed: August 19, 2015
    Publication date: December 10, 2015
    Inventors: Hidetsugu NAMIKI, Shiyuki KANISAWA, Hideaki UMAKOSHI, Masaharu AOKI, Akira ISHIGAMI
  • Publication number: 20150209914
    Abstract: An anisotropic conductive adhesive in which high thermal dissipation is provided. Conductive particles and solder particles are dispersed in a binder. In a thermally compressed LED device manufactured using this anisotropic conductive adhesive, terminals of the LED device are electrically connected to terminals of a substrate via particles and the terminals of the LED device and the terminals of the substrate are solder bonded.
    Type: Application
    Filed: September 17, 2013
    Publication date: July 30, 2015
    Inventors: Akira Ishigami, Shiyuki Kanisawa, Hidetsugu Namiki, Masaharu Aoki
  • Publication number: 20150197672
    Abstract: An anisotropic conductive adhesive includes: a conductive particle including a resin particle and a conductive metal layer that is formed on a surface of the resin particle; a thermally conductive particle that is a metal particle or an insulation coated particle, wherein the metal particle has an average particle size that is smaller than an average particle size of the conductive particle, and the insulation coated particle has an average particle size that is smaller than the average particle size of the conductive particle and includes a metal particle and an insulating layer that is formed on a surface of the metal particle; and an adhesive component in which the conductive particle and the thermally conductive particle are dispersed.
    Type: Application
    Filed: September 17, 2013
    Publication date: July 16, 2015
    Applicant: DEXERIALS CORPORATION
    Inventors: Hidetsugu Namiki, Shiyuki Kanisawa, Akira Ishigami
  • Publication number: 20150069448
    Abstract: A light-reflective anisotropic conductive adhesive is used for anisotropic conductive connection of a light-emitting element to a wiring board. The adhesive includes a thermosetting resin, conductive particles, and light-reflective acicular insulating particles. The conductive particles comprise a core particle coated with a metal particle or a metal material, and a light reflective layer formed on a surface of the core particle. The light reflective layer comprises inorganic particles selected from any one of titanium oxide particles, zinc oxide particles or aluminum oxide particles until the entire conductive particle appears a color in a range from white to gray.
    Type: Application
    Filed: November 17, 2014
    Publication date: March 12, 2015
    Inventors: Hidetsugu Namiki, Shiyuki Kanisawa, Hideaki Umakoshi, Akira Ishigami
  • Patent number: 8975654
    Abstract: A light-reflective conductive particle for an anisotropic conductive adhesive used for connecting a light-emitting element to a wiring board by anisotropic conductive connection includes a core particle covered with a metal material and a light reflecting layer formed of a light-reflective inorganic particle having a refractive index of 1.52 or greater on the surface of the core particle. Examples of the light-reflective inorganic particles having a refractive index of 1.52 or greater include a titanium oxide particle, a zinc oxide particle, and an aluminum oxide particle. The coverage of the light reflecting layer on the surface of the core particle is 70% or more.
    Type: Grant
    Filed: March 21, 2014
    Date of Patent: March 10, 2015
    Assignee: Dexerials Corporation
    Inventors: Hidetsugu Namiki, Shiyuki Kanisawa, Hideaki Umakoshi
  • Publication number: 20150034989
    Abstract: an anisotropic conductive adhesive which uses conductive particles where a silver-based metal is used as a conductive layer, having high light reflectance and excellent migration resistance is provided. The anisotropic conductive adhesive includes light reflective conductive particles in an insulating adhesive resin. The light reflective conductive particle includes a light reflective metal layer made of a metal alloy including silver, gold and hafnium formed on the surface of a resin particle as a core by sputtering method. The light reflective metal layer is preferably formed having a composition ratio of a silver of at least 50% by weight to at most 80% by weight: a gold of at least 10% by weight to at most 45%: a hafnium of at least 10% by weight to at most 40% by weight, and a total ratio does not exceed 100% by weight.
    Type: Application
    Filed: October 16, 2014
    Publication date: February 5, 2015
    Inventors: Hidetsugu NAMIKI, Shiyuki KANISAWA, Hideaki UMAKOSHI, Masaharu AOKI, Akira ISHIGAMI
  • Patent number: 8916894
    Abstract: A light-reflective anisotropic conductive adhesive and light-emitting device capable of maintaining luminous efficiency of a light-emitting element and preventing the occurrence of a crack to obtain conduction reliability are provided. The light-reflective anisotropic conductive adhesive contains a thermosetting resin composite, conductive particles, and a light-reflective acicular insulating particles. These light-reflective acicular insulating particles are inorganic particles of at least one type selected from the group including titanium oxide, zinc oxide, and titanate.
    Type: Grant
    Filed: April 13, 2011
    Date of Patent: December 23, 2014
    Assignee: Dexerials Corporation
    Inventors: Hidetsugu Namiki, Shiyuki Kanisawa, Hideaki Umakoshi, Akira Ishigami
  • Patent number: 8852462
    Abstract: A light-reflective anisotropic conductive adhesive used for anisotropic conductive connection of a light-emitting element to a wiring board includes a thermosetting resin composition containing a silicone resin and a curing agent, conductive particles and light-reflective insulating particles. The light-reflective insulating particle is at least one kind of inorganic particles selected from the group consisting of titanium oxide, boron nitride, zinc oxide, silicon oxide, and aluminum oxide. The silicone resin is a glycidyloxyalkyl-alicyclic alkyl-modified organopolysiloxane.
    Type: Grant
    Filed: March 14, 2012
    Date of Patent: October 7, 2014
    Assignee: Dexerials Corporation
    Inventors: Hideaki Umakoshi, Hidetsugu Namiki, Masaharu Aoki, Akira Ishigami, Shiyuki Kanisawa
  • Patent number: 8846142
    Abstract: There is disclosed a conductive particle used for an anisotropic conductive connection material for establishing conductive interconnection between e.g. a substrate and an electrical component. The conductive particle includes a base particle (2) exhibiting electrical conductivity at least on its surface and a continuous insulating resin film (3) formed by welding of fine particles (3a) of an insulating resin that composes the resin film. The surface of the base particle is coated with the continuous insulating resin film. There are formed voids at least between neighboring fine particles.
    Type: Grant
    Filed: December 30, 2010
    Date of Patent: September 30, 2014
    Assignee: Dexerials Corporation
    Inventors: Yasushi Akutsu, Hidetsugu Namiki
  • Publication number: 20140248477
    Abstract: A buffer film for multi-chip packaging which does not cause out of alignment during multi-chip packaging and ensures favorable connection reliability has a structure in which a heat-resistant resin layer having a linear expansion coefficient of 80 ppm/° C. or less and a flexible resin layer made of a resin material having a Shore A hardness according to JIS K6253 of 10 to 80 are laminated. A multi-chip module can be produced by aligning a plurality of chip devices on a substrate through an adhesive to perform temporary adhesion, disposing the buffer film for multi-chip packaging between the chip devices and a bonding head so that the heat-resistant resin layer is on a chip device side, and connecting the plurality of chip devices with the substrate by applying heat and pressure to the chip devices toward the substrate with the bonding head.
    Type: Application
    Filed: May 12, 2014
    Publication date: September 4, 2014
    Applicant: DEXERIALS CORPORATION
    Inventors: Akira ISHIGAMI, Shiyuki KANISAWA, Hidetsugu NAMIKI, Hideaki UMAKOSHI, Masaharu AOKI
  • Publication number: 20140225144
    Abstract: A light-reflective conductive particle for an anisotropic conductive adhesive used for connecting a light-emitting element to a wiring board by anisotropic conductive connection includes a core particle covered with a metal material and a light reflecting layer formed of a light-reflective inorganic particle having a refractive index of 1.52 or greater on the surface of the core particle. Examples of the light-reflective inorganic particles having a refractive index of 1.52 or greater include a titanium oxide particle, a zinc oxide particle, and an aluminum oxide particle. The coverage of the light reflecting layer on the surface of the core particle is 70% or more.
    Type: Application
    Filed: March 21, 2014
    Publication date: August 14, 2014
    Applicant: DEXERIALS CORPORATION
    Inventors: Hidetsugu NAMIKI, Shiyuki KANISAWA, Hideaki UMAKOSHI
  • Publication number: 20140217450
    Abstract: An anisotropic conductive adhesive which uses conductive particles where a silver-based metal is used as a conductive layer, having high light reflectance and excellent migration resistance is provided. The anisotropic conductive adhesive includes light reflective conductive particles in an insulating adhesive resin. The light reflective conductive particle includes a light reflective metal layer made of a metal having at least 60% of reflectance at a peak wavelength of 460 nm formed on the surface of a resin particle as a core, and a coating layer made of a silver alloy formed on the surface of the light reflective metal layer. The light reflective metal layer is preferably formed by a plating method.
    Type: Application
    Filed: April 7, 2014
    Publication date: August 7, 2014
    Inventors: Akira ISHIGAMI, Shiyuki KANISAWA, Hidetsugu NAMIKI, Hideaki UMAKOSHI, Masaharu AOKI
  • Patent number: 8796725
    Abstract: A light-reflective conductive particle for an anisotropic conductive adhesive used for anisotropic conductive connection of a light-emitting element to a wiring board includes a core particle coated with a metal material and a light-reflecting layer formed from light-reflective inorganic particles having a refractive index of 1.52 or more on a surface of the core particle. Examples of the light-reflective inorganic particles having a refractive index of 1.52 or more include titanium oxide particles, zinc oxide particles, or aluminum oxide particles.
    Type: Grant
    Filed: July 22, 2010
    Date of Patent: August 5, 2014
    Assignee: Dexerials Corporation
    Inventors: Hidetsugu Namiki, Shiyuki Kanisawa, Hideaki Umakoshi
  • Patent number: 8790547
    Abstract: An anisotropic conductive adhesive including conductive particles dispersed in an epoxy-based adhesive containing an epoxy compound and a curing agent gives a cured product having the elastic modulus satisfying the expressions (1) to (5), in which EM35, EM55, EM95, and EM150 are values of the elastic modulus of the cured product at 35° C., 55° C., 95° C., and 150° C., respectively, ?EM55-95 is the rate of change in the elastic modulus between 55° C. and 95° C., and ?EM95-150 is the rate of change in the elastic modulus between 95° C. and 150° C., 700 MPa?EM35?3000 MPa??(1) EM150<EM95<EM55<EM35??(2) ?EM55-95<?EM95-150??(3) 20%??EM55-95??(4) 40%??EM95-150??(5).
    Type: Grant
    Filed: January 15, 2010
    Date of Patent: July 29, 2014
    Assignee: Dexerials Corporation
    Inventors: Hidetsugu Namiki, Shiyuki Kanisawa, Genki Katayanagi
  • Patent number: 8758546
    Abstract: A buffer film for multi-chip packaging which does not cause out of alignment during multi-chip packaging and ensures favorable connection reliability has a structure in which a heat-resistant resin layer having a linear expansion coefficient of 80 ppm/° C. or less and a flexible resin layer made of a resin material having a Shore A hardness according to JIS K6253 of 10 to 80 are laminated. A multi-chip module can be produced by aligning a plurality of chip devices on a substrate through an adhesive to perform temporary adhesion, disposing the buffer film for multi-chip packaging between the chip devices and a bonding head so that the heat-resistant resin layer is on a chip device side, and connecting the plurality of chip devices with the substrate by applying heat and pressure to the chip devices toward the substrate with the bonding head.
    Type: Grant
    Filed: September 12, 2011
    Date of Patent: June 24, 2014
    Assignee: Dexerials Corporation
    Inventors: Akira Ishigami, Shiyuki Kanisawa, Hidetsugu Namiki, Hideaki Umakoshi, Masaharu Aoki
  • Patent number: 8710662
    Abstract: A light-reflective anisotropic conductive paste is used as an anisotropic conductive paste when a light-emitting device is produced by flip-chip mounting a light-emitting element such as a light-emitting diode element (LED) on a wiring board. The light-reflective anisotropic conductive paste includes light-reflective insulating particles, in order to improve light emission efficiency without providing, in the LED, a light-reflecting layer that causes an increase in manufacturing cost. With the light-reflective anisotropic conductive paste, a reduction in bonding strength of the light-emitting element to the wiring board in a high-temperature environment can be suppressed, and a reduction in conduction reliability after a TCT can also be suppressed. In the light-reflective anisotropic conductive paste, conductive particles and the light-reflective insulating particles are dispersed in a thermosetting resin composition.
    Type: Grant
    Filed: May 27, 2011
    Date of Patent: April 29, 2014
    Assignee: Sony Corporation & Information Device Corporation
    Inventors: Hideaki Umakoshi, Hidetsugu Namiki, Akira Ishigami, Masaharu Aoki, Shiyuki Kanisawa, Yoshihisa Shinya
  • Publication number: 20140103266
    Abstract: A light-reflective conductive particle for an anisotropic conductive adhesive used for anisotropic conductive connection of a light-emitting element to a wiring board includes a core particle coated with a metal material and a light-reflecting layer formed from light-reflective inorganic particles having a refractive index of 1.52 or more on a surface of the core particle. Examples of the light-reflective inorganic particles having a refractive index of 1.52 or more include titanium oxide particles, zinc oxide particles, or aluminum oxide particles.
    Type: Application
    Filed: December 19, 2013
    Publication date: April 17, 2014
    Applicant: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
    Inventors: Hidetsugu NAMIKI, Shiyuki KANISAWA, Hideaki UMAKOSHI