Patents by Inventor Hidetsugu Namiki

Hidetsugu Namiki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110095235
    Abstract: There is disclosed a conductive particle used for an anisotropic conductive connection material for establishing conductive interconnection between e.g. a substrate and an electrical component. The conductive particle includes a base particle (2) exhibiting electrical conductivity at least on its surface and a continuous insulating resin film (3) formed by welding of fine particles (3a) of an insulating resin that composes the resin film. The surface of the base particle is coated with the continuous insulating resin film. There are formed voids at least between neighboring fine particles.
    Type: Application
    Filed: December 30, 2010
    Publication date: April 28, 2011
    Applicant: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
    Inventors: Yasushi Akutsu, Hidetsugu Namiki
  • Publication number: 20100051878
    Abstract: There is disclosed a conductive particle used for an anisotropic conductive connection material for establishing conductive interconnection between e.g. a substrate and an electrical component. The conductive particle includes a base particle (2) exhibiting electrical conductivity at least on its surface and a continuous insulating resin film (3) formed by welding of fine particles (3a) of an insulating resin that composes the resin film. The surface of the base particle is coated with the continuous insulating resin film. There are formed voids at least between neighboring fine particles.
    Type: Application
    Filed: April 11, 2008
    Publication date: March 4, 2010
    Applicant: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
    Inventors: Yasushi Akutsu, Hidetsugu Namiki
  • Patent number: 7647694
    Abstract: A method for mounting through an anisotropic conductive film defined as an adhesive sheet an electronic component on a printed circuit board (flexible board) provided with a wiring pattern. The anisotropic conductive film is bonded to an area of the flexible board to be mounted with the electronic component in a state where air intervening between the anisotropic conductive film and the flexible board is heated. Since the air confined between the anisotropic conductive film and the flexible board reduces in volume upon cooled down, occurrence of voids, exposure of the wiring pattern, or the like is avoided. Consequently, reliability can be enhanced without complicating the mounting.
    Type: Grant
    Filed: May 5, 2004
    Date of Patent: January 19, 2010
    Assignees: Sony Corporation, Sony Chemical & Information Corporation
    Inventors: Misao Konishi, Hidetsugu Namiki, Jyunji Shinozaki
  • Publication number: 20080017873
    Abstract: A mounting structure and a mounting method which are capable of securely electrically connecting wiring on a board and a device to each other in the case where the device is mounted on the board, and are capable of forming a finer bump, and increasing the number of pins are provided. A device includes at least one projection having a structure in which a surface of at least a tip part of a projecting section made of an elastic body is coated with a conductive film.
    Type: Application
    Filed: July 17, 2007
    Publication date: January 24, 2008
    Applicants: SONY CORPORATION, SONY CHEMICAL & INFORMATION DEVICE CORPORATION
    Inventors: Katsuhiro Tomoda, Shiyuki Kanisawa, Hidetsugu Namiki
  • Publication number: 20070094872
    Abstract: A method for mounting through an anisotropic conductive film defined as an adhesive sheet an electronic component on a printed circuit board (flexible board) provided with a wiring pattern. The anisotropic conductive film is bonded to an area of the flexible board to be mounted with the electronic component in a state where air intervening between the anisotropic conductive film and the flexible board is heated. Since the air confined between the anisotropic conductive film and the flexible board reduces in volume upon cooled down, occurrence of voids, exposure of the wiring pattern, or the like is avoided. Consequently, reliability can be enhanced without complicating the mounting.
    Type: Application
    Filed: May 5, 2004
    Publication date: May 3, 2007
    Applicant: Sony Chemicals Corporation
    Inventors: Misao Konishi, Hidetsugu Namiki, Jyunji Shinozaki
  • Patent number: 6717064
    Abstract: A flexible printed wiring board constructed by using elemental pieces at a low cost. The elemental pieces 81a to 81c according to the present invention are provided respectively with supporting films 24a to 24c on one face and adhesive resin films 19a to 19c on the other face. The supporting films 24a to 24c have connecting openings on the bottom face of which the surface of metal wiring circuits are exposed as lands 23a to 23c. On the other hand, conductive bumps 16a to 16c, which are connected respectively to the metal wiring circuits 14a to 14c, project on the resin films 19a to 19c. To construct a flexible printed wiring board 83 by using plural elemental pieces 81a to 81c, the tips of the conductive bumps 16b and 16c are brought into contact respectively with the lands 23a and 23b on the bottom face of the openings and contact-bonded under heating. Thus, the elemental pieces 81a to 81c are adhered to each other owing to the adhesiveness of the resin film 19b and 19c.
    Type: Grant
    Filed: January 31, 2000
    Date of Patent: April 6, 2004
    Assignee: Sony Chemicals Corp.
    Inventors: Hideyuki Kurita, Masato Taniguchi, Masayuki Nakamura, Hiroyuki Hishinuma, Hidetsugu Namiki
  • Patent number: 6355357
    Abstract: A flexible printed board, in which a polyimide resulting from the imidation of a polyamic acid obtained by the addition polymerization of diamines and acid dianhydrides is formed as an insulating layer on a metal foil, is characterized in that the diamines include specific imidazolyl-diaminoazines represented by the formula 1; (where A is an imidazolyl group; R1 is an alkylene group; m is 0 or 1; R2 is an alkyl group; n is 0, 1, or 2; R3 and R4 are alkylene groups; p and q are each 0 or 1; and B is an azine residue, diazine residue, or triazine residue).
    Type: Grant
    Filed: December 8, 1999
    Date of Patent: March 12, 2002
    Assignee: Sony Chemicals Corp.
    Inventors: Satoshi Takahashi, Hidetsugu Namiki
  • Patent number: 6346298
    Abstract: A flexible board comprises metal foil 1 and provided thereon a laminated polyimide-based resin layer 2 of a three-layer structure comprising a first polyimide-based resin layer 2a, a second polyimide-based resin layer 2b, and a third polyimide-based resin layer 2c, wherein the following equation is satisfied. k1>k3>k2, where k1 is the coefficient of linear thermal expansion of the first polyimide-based resin layer 2a on the side of the metal foil 1, k2 is the coefficient of linear thermal expansion of the second polyimide-based resin layer 2b, and k3 is the coefficient of linear thermal expansion of the third polyimide-based resin layer 2c.
    Type: Grant
    Filed: December 8, 1999
    Date of Patent: February 12, 2002
    Assignee: Sony Chemicals Corp.
    Inventors: Satoshi Takahashi, Hidetsugu Namiki